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Sections
« prev | next »- 1.1. Introduction
- 1.2. Pressure
- 1.2.1. Pressure as a physical quantity
- 1.2.1.1. Static pressure
- 1.2.1.2. Units
- 1.2.2. Absolute, relative and differential sensors
- 1.2.3. Fluid physical properties
- 1.2.3.1. Liquids
- 1.2.3.2. Gases
- 1.3. Pressure ranges
- 1.3.1. Vacuum and ultra-vacuum
- 1.3.2. Middle range pressure
- 1.3.3. High pressure
- 1.4. Main physical principles
- 1.4.1. The sensing device
- 1.4.2. Sensors with elastic element
- 1.4.2.7. Servo controlled sensors with balance of force Principle
- 1.4.3. Vacuum sensors
- 1.5. Calibration: pressure standards
- 1.5.1. Low pressure standard
- 1.5.2. High pressure standard
- 1.6. Choosing a pressure sensor
- 1.7. References
- 1.8. Other pressure sensors manufacturers
- 1.9. Bibliography
- 2.1. Optical waveguides and fibers
- 2.2. Light sources and detectors
- 2.2.1. Light sources
- 2.2.1.2. Laser diodes
- 2.2.2. Light detectors
- 2.2.2.1. Photoresistors
- 2.2.2.2. Photodiodes
- 2.3. Sensors of position and movement
- 2.3.1. Position sensors using the principle of triangulation
- 2.3.2. Incremental sensors of position or displacement
- 2.3.3. Photoelectric switches
- 2.4. Optical sensors of dimensions
- 2.4.1. Dimensional gauge with scanned beam
- 2.5. Optical sensors of pressure and force
- 2.5.1. Pressure sensor using the optical resonator
- 2.6. Optical fiber sensors
- 2.6.1. Introduction and classification of sensors with optical fibers
- 2.6.2. Optical fiber sensors with amplitude modulation
- 2.6.3. Sensor with wavelength modulation
- 2.6.4. Optical sensors with phase modulation
- 2.6.5. Perspective of optical fiber sensors
- 2.7. Optical chemical sensors
- 2.7.1. Introduction
- 2.7.2. Chemical sensors based on the absorbency measurement
- 2.7.3. Turbidity sensors
- 2.8. Bibliography
- 2.8.1. Books
- 2.8.2. Physical background – websites
- 3.1. Introduction
- 3.1.1. Volume flow and mass flow
- 3.1.2. Influences on the flow
- 3.1.3. Bernoulli equation
- 3.2. Flow measurements based on the principle of difference in pressure
- 3.2.1. The Pitot and Prandtl tube
- 3.2.1.1. Principle
- 3.2.2. The orifice plate
- 3.2.2.1. Principle
- 3.2.3. The flow nozzle
- 3.2.4. The Venturi tube
- 3.2.5. The Dall tube
- 3.2.6. General guidelines for a correct reading
- 3.3. Flow measurements based on variable passage
- 3.3.1. The float flow meter (rotameter)
- 3.3.1.1. Principle
- 3.3.2. Target flow meter
- 3.3.2.1. Principle
- 3.4. Turbine flow meter
- 3.4.1. Principle
- 3.4.2. Practical installation
- 3.4.3. Characteristics
- 3.5. The mechanical flow meter (positive displacement)
- 3.5.1. Principle
- 3.5.2. Characteristics
- 3.6. Magnetic flow meter
- 3.6.1. Principle
- 3.6.2. Construction of the measuring instrument
- 3.6.3. Practical installation
- 3.6.4. Characteristics
- 3.7. The vortex flow meter
- 3.7.1. Principle
- 3.7.2. Construction of the vortex flow meter
- 3.7.3. Practical installation
- 3.7.4. Characteristics
- 3.8. Ultrasonic flow meter
- 3.8.1. Principle
- 3.8.2. Practical installation
- 3.8.3. Characteristics
- 3.9. Coriolis mass-flow meters
- 3.9.1. Principle
- 3.9.2. Applications
- 3.9.3. Practical installation
- 3.9.4. Characteristics
- 3.10. Flow measurements for solid substances
- 3.10.1. Flow measurement of solids by means of an impact plate
- 3.10.2. Flow measurement of solids based on the weighing method
- 3.10.3. Capacitive flow measurement of solid substances
- Figure 3.54. Capacitive flow measurement of solid substances
- 3.10.4. Detection of solid substances using microwaves
- 3.11. Flow measurement for open channels with weirs
- 3.12. Choice and comparison of flow measurements
- 3.13. Bibliography
- 3.14. Website references
- 4.1. Introduction
- 4.2. Intelligent sensors
- 4.2.1. Sensors and transducers
- 4.2.2. Signal conditioning (SC)
- 4.2.2.3. Filtration
- 4.2.2.4. Detection
- 4.2.3. A/D Conversion
- 4.2.4. Data processing
- 4.2.5. Human Machine Interface
- 4.2.6. Communication interface
- 4.2.6.1. IEEE 1451
- 4.2.7. Industrial examples
- 4.3. Sensor networks and interfaces
- 4.3.1. Centralized and distributed industrial systems
- 4.3.2. Hierarchical structure of distributed communication
- 4.3.3. Data communication basics
- 4.3.3.3. Data link layer
- 4.3.3.4. Network layer
- 4.3.3.6. Session layer
- 4.3.4. Simple sensor interfaces
- 4.3.5. Sensor networks
- 4.3.5.1. AS-Interface
- 4.3.5.5. Interbus
- 4.3.5.6. M-Bus
- 4.3.5.7. Profibus
- 4.3.6. Wireless sensor networks
- 4.3.6.1. IEEE 802.15.4
- 4.3.6.2. ZigBee
- 5.1. Introduction
- 5.2. Acceleration
- 5.2.1. Physical quantity
- 5.2.2. Application to velocity and position measurements
- 5.2.3. Application to position measurements
- 5.2.4. The inclinometers
- 5.3. Application ranges
- 5.3.1. Static and low-frequency acceleration
- 5.3.2. Vibrations
- 5.3.3. Shocks
- 5.3.4. Inclination
- 5.4. Main models of accelerometers
- 5.4.1. Piezoelectric accelerometers
- 5.4.2. Piezoresistive accelerometers
- 5.4.3. Accelerometers with resonators
- 5.4.3.1. Principle
- 5.4.4. Capacitive accelerometers
- 5.4.4.1. Principle
- 5.4.5. Potentiometric accelerometers
- 5.4.5.1. Principle
- 5.4.6. Optical detection accelerometers
- 5.4.6.1. Principle
- 5.4.7. Magnetic detection Accelerometers
- 5.4.7.1. Principle
- 5.4.8. Servo accelerometers with controlled displacement
- 5.4.8.1. Principle
- 5.5. The signal processing associated with accelerometers
- 5.6. Manufacturing process
- 5.6.1. The monolithic processes
- 5.6.1.3. Above IC
- 5.6.2. Hybrid process
- 5.6.3. Packaging
- 5.7. The calibrations:
- 5.7.1. Inclinometers and accelerometers with range lower than 1 g
- 5.7.2. Acceleration range higher than 1 g
- 5.8. Examples of accelerometers and inclinometers
- 5.9. List of Manufacturers of Accelerometers
- 5.10. References
- 5.11. Bibliography
- 6.1. Introduction
- 6.2. What is involved in developing a sensor?
- 6.2.1. Molecular recognition
- 6.2.2. Immobilization of host molecules
- 6.2.3. Transduction of signal
- 6.3. Electrochemical sensors
- 6.3.1. Amperometric and voltammetric sensors
- 6.3.2. Potentiometric sensors
- 6.3.3. Resistance, conductance and impedance sensors
- 6.4. Optical sensors
- 6.4.1. Methods of detection
- 6.4.2. Reagent-mediated sensors
- 6.5. Acoustic (mass) sensors
- 6.5.1. Quartz crystal microbalance sensors
- 6.5.2. Sensor arrays
- 6.6. Biosensors
- 6.6.1. Affinity biosensors
- 6.6.1.4. Proteomics
- 6.6.2. Catalytic biosensors
- 6.7. Future trends
- 6.7.1. Microanalytical instruments as sensors
- 6.7.2. Autonomous sensing devices
- 6.7.3. Sub-micron dimensioned sensors
- 6.8. Conclusions
- 6.9. References
- 7.1. Introduction
- 7.1.1. Classification of LPD sensors
- 7.2. Resistive LPD sensors
- 7.2.1. Potentiometer
- 7.2.2. Angular position measurement
- 7.2.3. Draw wire sensors
- 7.2.4. Inclination detectors
- 7.2.5. Application of potentiometers
- 7.3. Inductive LPD sensors
- 7.3.1. Linear variable differential transformers
- 7.3.2. Inductosyns
- 7.3.3. Resolvers
- 7.3.4. Selsyn
- 7.3.5. Inductive sensors of angular velocity
- 7.3.6. Eddy current distance sensors
- 7.4. Magnetic LPD sensors
- 7.4.1. Magnetic field sensors
- 7.4.2. Reed switches
- 7.4.3. Hall sensors
- 7.4.4. Semiconductor magnetoresistors
- 7.4.5. Wiegand wire
- 7.4.6. Magnetostrictive sensor
- 7.5. Capacitive LPD sensors
- 7.5.1. Introduction
- 7.5.2. Signal conditioning circuits for capacitive sensors
- 7.5.3. Using capacitive sensors
- 7.6. Optical LPD sensors
- 7.6.1. Introduction
- 7.6.2. Photo-electric switches (PES)
- 7.6.3. LPD Sensors based on triangulation
- 7.6.4. Optical encoders
- 7.6.4.3. Gray Code
- 7.6.5. Interferometry
- 7.6.7. Image-based measurement-machine vision, videometry
- 7.6.7.1. Introduction
- 7.7. Ultrasonic sensors
- 7.7.1. Introduction
- 7.7.2. Travel time principle
- 7.7.3. Doppler effect
- 7.8. Microwave distance sensors (radar)
- 7.8.1. Introduction
- 7.8.2. Microwave sensors based on FMCW
- 7.8.3. Properties of microwave sensors
- 7.9 Level measurement
- 7.9.1. Introduction
- 7.9.2. Detection limits
- 7.9.3. Continuous level measurement
- 7.9.3.2. Capacitive sensors
- 7.10. Conclusions and trends
- 7.11. References
- 7.12. Online references
- 8.1. Introduction
- 8.2. Thermal measuring techniques
- 8.2.1. Heat and temperature
- 8.2.2. Static and dynamic readings
- 8.2.3. Time constant and response time
- 8.2.4. Thermal units
- 8.2.5. Thermal equilibrium
- 8.2.6. Temperature measuring options
- 8.2.7. Quality of a measurement
- 8.3. Physical or direct temperature measurement
- 8.3.1. Glass thermometer
- 8.3.2. Liquid filled expansion thermometers
- 8.3.3. Gas filled expansion thermometer or pressure thermometer detector
- 8.3.4. Vapor-pressure systems
- 8.3.5. Bimetallic thermometer
- 8.4. Thermoelectric measurements (thermocouples)
- 8.4.1. Measuring principle: thermoelectricity
- 8.4.2. Thermoelectric laws
- 8.4.3. Practical temperature measurement with thermocouples
- 8.4.4. Technological realizations of thermocouples
- 8.4.5. Applications
- 8.4.6. Parallel and series connections of thermocouples
- 8.5. Resistance temperature detectors (RTDs)
- 8.5.1. Principle
- 8.5.2. Used materials and construction
- 8.5.3. Applications
- 8.6. Thermistors
- 8.6.1. Principle
- 8.6.2. Thermistor technology
- 8.6.3. Application
- 8.7. Monolithic temperature sensors (IC sensor)
- 8.8. Pyrometers
- 8.8.1. Introduction
- 8.8.2. Basic principles of pyrometry
- 8.8.3. Measurement possibilities for pyrometers
- 8.8.4. Implementation and construction of pyrometers
- 8.9. References
- 8.10. Bibliography
- 9.1. Introduction
- 9.2. The angular rate
- 9.2.1. Definition of rate gyro
- 9.2.2. Use of rate sensors
- 9.3. Different ranges of rate gyro
- 9.3.1. Control of trajectory
- 9.3.2. Piloting and Stabilization
- 9.3.3. Guidance
- 9.3.4. Navigation
- 9.4. Main models of rate gyro
- 9.4.1. Rotary gyrometers
- 9.4.2. Vibrating gyrometers
- 9.4.3. Optical gyrometers
- 9.4.4. Other original principles
- 9.5. Calibration of rate sensors
- 9.6. General features of the gyrometers
- 9.7. The main manufacturers
- 9.8. References
- 9.9. Bibliography
- 10.1. Introduction
- 10.2. Hall sensors
- 10.2.1. The Hall effect
- 10.2.2. New types of Hall sensors
- 10.3. AMR sensors
- 10.3.1. Operating principles of AMR effect
- 10.3.2. Measuring configuration of AMR
- 10.3.3. Flipping
- 10.3.4. Magnetic feedback
- 10.4. GMR sensors
- 10.4.1. Physical mechanism
- 10.4.2. Spin valves
- 10.4.3. Sandwiches and multilayers
- 10.4.4. SDT sensors
- 10.4.5. Linear GMR sensors
- 10.4.6. Rotational GMR sensors
- 10.5. Induction and fluxgate sensors
- 10.5.1. Induction coil sensors
- 10.5.2. Fluxgate sensors
- 10.6 Other magnetic field sensors
- 10.6.1. Resonance sensors
- 10.7. Magnetic position sensors
- 10.7.1. Sensors using permanent magnets
- 10.7.2. Eddy current sensors
- 10.7.3. Linear and rotational transformers
- 10.7.4. Magnetostrictive position sensors
- 10.7.5. Proximity switches
- 10.7.5.1. Reed contacts
- 10.8. Contactless current sensors
- 10.8.1. Hall current sensors
- 10.8.2. Magnetoresistive current sensors
- 10.8.3. AC and DC Transformers
- 10.8.4. Current clamps
- 10.9 References
- 11.1. Introduction: MEMS
- 11.2. Materials
- 11.2.1. Passive materials
- 11.2.2. Active materials
- 11.2.3. Silicon
- 11.2.4. Other semiconductors
- 11.2.5. Plastics
- 11.2.6. Metals
- 11.2.7. Ceramics
- 11.2.8. Glass
- 11.3. Silicon planar IC technology
- 11.3.1. The substrate: crystal growth
- 11.3.2. Diffusion and ion implantation
- 11.3.3. Oxidation
- 11.3.4. Lithography and etching
- 11.3.5. Deposition of materials
- 11.3.6. Metallization and wire bonding
- 11.3.7. Passivation and encapsulation
- 11.4. Deposition technologies
- 11.4.1. Introduction
- 11.4.2. Chemical reactions
- 11.4.3. Physical reactions
- 11.4.4. Epitaxial techniques for semiconductor device preparation
- List of Authors
- Index
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