FinePix S1000fd Service Manual
Conﬁdential: FUJIFILM Service Center Use Only
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive
, all the internal connections andcomponent parts and materials used in this product are lead-free compliant
under the European RoHS directive.*1: Excluded items (list of the main lead-related items)• Lead included in glass used in ﬂuorescent tubes, electronic components and cathode-ray tubes• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)• Lead in ceramic electronic parts (piezo-electronic devices)• Mercury contained in ﬂuorescent tubes is also excluded.*2: Deﬁnition of lead-freeA lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)<Reference>RoHS: The name of a directive issued by the European Parliament aimed at restricting the use of certain designated hazardous substances included in electrical and electronic equipment.Designated substances (6): Lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBBs) andpolybrominated diphenyl ether (PBDE)
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventionalsolder (eutectic) and lead-free solder.
Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are asshown below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder isused. Accordingly, the soldering techniques used must take that into account.
1The solder starts melting later.The initial melting point of lead-free solder is high, so youhave to get used to it.2Poor wettingMove the tip of the soldering iron around to heat the entireconnection to the melting temperature and assist wetting.3Solder feed rate is difﬁcult to control.Use the solder (wire) diameter and soldering iron that arebest suited to connection being soldered.4Wetting the insides of through holes is especiallydifﬁcult.First apply solder to the area immediately around thethrough hold and then feed the solder into the hole.5During repairs (or modiﬁcations) removing solder from inside through holes is difﬁcult.Use a suitable wicking wire (with a suitable method andheating) and a suction tool.6There is serious carbonization of the soldering iron.Either put solder onto the soldering iron tip after completingthe work, or turn the iron off frequently.7The surface is not glossy.Learn to recognize the appearance of the surface.