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SCH
 
Technologies
 
is
 
a
 
Trading
 
Name
 
of 
 
SCH
 
Services
 
Limited
 
Newburgh
 
Building,
 
McLintock
 
Way,
 
Barnsley,
 
South
 
Yorkshire.
 
S70
 
6BF
 
Tel:
 
+44
 
(0)1226
 
297711
 
Fax:
 
+44
 
(0)1226
 
297733
 
www.conformalcoating.co.uk
 
SCH
 
Technologies
 
are
 
ISO9001
 
and
 
ISO14001 certified
 
Technical Bulletin Feb 09
Common failure mechanisms in conformal coating: Pin holes,Bubbles and Foam
In conformal coating, there are several mechanisms that cause failure of printed circuit boards(PCBs). In a series of technical bulletins SCH will examine the common failure mechanisms inconformal coating including capillary flow, delamination, cracking, loss of adhesion, de-wetting, corrosion, orange peel, pin holes, bubbles and foam.
Conformal Coating Failure Mechanism: Pin holes,bubbles & foam
Definition
Bubbles are trapped pockets of air under coating, pinholes are burst bubbles that reach to the surface of thePCB and foam is extreme bubbling.
Causes of pin hole, bubbles & foam in ConformalCoating
Factors that can cause these effects include:1.
 
When applying the conformal coating the wet filmsurface can skin over, entrapping solvents under thesurface which can bubble or burst out.2.
 
If the coating is applied too thick or too viscous anybubbles which are created in the process ofapplication can become entrapped in the coatingbefore they settle out.3.
 
Air entrapped under components by the coatingprocess can be forced out during the drying / curingprocess and cause bubbles.4.
 
Pressure pots with conformal coating inside can absorbair which can manifest as champagne bubbles whenapplied.5.
 
Brush coating with too viscous a material or workingthe coating can cause bubbles.
6.
 
Incorrect spray equipment or pressures can causeexcessive bubbles & foam.
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