Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686Specifications subject specified. Latin/S. Am.: +54 (0) 11-4733-2200 Netherlands: +31 (0) 73-6246-999www.te.com to change. USA: +1 (800) 522-6752 Germany: +49 (0) 6251-133-1999 China: +86 (0) 400-820-6015
Signal Integrity Services: Taking SI to the Next Level
High Speed Backplane Connectors
Our goal is to apply system-level expertise to design,simulate, and verify a system to meet your performancegoals. We have completed hundreds of system designs andhave years of experience in system layout, design, simula-tion and product selection. We have an extensive library ofTE Connectivity’s product models ready to go to work onyour design, utilizing our modeling skills and techniques.
TE’s Signal Integrityengineers use a verysophisticated suite of toolsto provide accurate con-nector and system modelsto 20 GHz and beyond.Whether we are analyzinga connector or an entiresystem, we have the toolsand expertise to get theright answer. Our tool suiteincludes 2D and 3D full-waveanalysis, with solutions inboth the time and frequen-cy domains.
TE provides a variety oftools to aid customers intheir design:
SPICE single-line andmulti-line models
Customer evaluationboards using realisticsystem implementations
Electrical PerformanceReports (EPRs) withinformation on many highspeed products.
For more info:
With measurement capabili-ties beyond 10 Gb/s and50 GHz, TE can character-ize and provide detailedmeasurements of variousproducts. Measurements ofa product within a system,including measurementsfrom silicon companies thathave teamed with TE, canbe invaluable to provide thesuccessful implementationof a design.
While TE has made every reasonableeffort to ensure the accuracy of theinformation in this catalog, TE doesnot guarantee that it is error-free, nordoes TE make any other representation,warranty or guarantee that the informa-tion is accurate, correct, reliable orcurrent. TE reserves the right to makeany adjustments to the informationcontained herein at any time withoutnotice. TE expressly disclaims all impliedwarranties regarding the informationcontained herein, including, but notlimited to, any implied warranties ofmerchantability or fitness for a particularpurpose. The dimensions in this catalogare for reference purposes only andare subject to change without notice.Specifications are subject to changewithout notice. Consult TE for the latestdimensions and design specifications.© 2012, 2008 and 2005Tyco Electronics Corporation.All Rights Reserved.ACTION PIN, AMP, AMP-HDI, CHAMP,MULTI-BEAM XL, MULTIGIG RT, SEC-Z,TRI-Q, Z-DOK, Z-PACK, Z-PACK SlimUHD, Z-PACK TinMan, TE Connectivityand the TE connectivity (logo) aretrademarks of the TE Connectivity Ltd.family of companies.AdvancedTCA is a trademark of PICMG-PCI Industrial Computer Mfg’s. Group.ALPHA is a trademark of DigitalEquipment Corporation.AMD is a trademark of Advanced MicroDevices, Inc.CompactPCI is a trademark of PICMG-PCI Industrial Computer Mfg’s. Group.IGES is a trademark of IAMBA Networks,Inc.INFINIBAND is a trademark of theInfiniBand Trade Association.LOCTITE is a trademark of Henkel Corp.PCI Express is a trademark of PCI-SIG.PRO/E is a trademark of ParametricTechnology Corp.RAPIDIO is a trademark of RAPIDIO, Inc.SPARC is a trademark of SPARCInternational, Inc.STARFABRIC is a trademark ofStarGen, Inc.TELCORDIA is a trademark of TelcordiaTechnologies, Inc.VITA, VMEbus, VPX, and VXS aretrademarks of VITA.Other logos, product and Companynames mentioned herein may betrademarks of their respective owners.