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Using Springs as CapSense

Sensors

April 1, 2008 Document No. 001-44999 Rev. ** 1

AN44999

Author

: Petro Koblyuk, Vasyl Mandziy, Andriy Ryshtun

Associated Project

: No

Associated Part Family

: CY8C24x94, CY8C21x34, CY8C20x34GET FREE SAMPLES HERE

Software Version

: PSoC Designer™

4.4

Associated Application Notes

:AN2394,AN2398,AN42851

Application Note Abstract

This application note considers the possibility of using springs as sensors. A comparison with solid conductive sensors andrecommendations for the practical usage of springs are also discussed.

Introduction

CapSense

may be used in several applications.However, some applications cannot install printed circuitboards with a set of sensors directly under the overlay orattached to the device case. Examples of suchapplications are “white goods” (that is, cooktop, washingmachines, refrigerators, microwave ovens, and others)and various vehicle electronics, such as radio sets, TVtuners, dash boards, seat occupant detection, and so on.Metallic spring sensors may be used as an alternative tosolid conductive sensors. This allows placement of theboard at a distance from the overlay, and reliableconnection of the sensors with the covering case inconditions of strong vibration or sharp temperaturechanges. In addition, springs provide additional functionalpossibilities, such as backlighting, and combinations ofmechanical and CapSense buttons.This application note compares using a spring modelagainst a solid conductive sensor, and provides practicalrecommendations for the best results. This applicationnote also deals with examples of designs with springs, theadvantages of using springs, and additional functionalpossibilities.

Spring Electrical Field Simulation

To study the behavior of a spring sensor and to compare itwith that of a solid conductive sensor, the electrical fieldsof these objects are modeled.The simulations are created using Comsol Multiphysicsver. 3.2. This tool has a powerful interactive environmentfor modeling and can solve most scientific and engineeringproblems based on Partial Differential Equations (PDEs).A profound knowledge of mathematics or numericalanalysis is not required to access these features. Usingthe built in physics modes, one can develop models bydefining the relevant physical quantities, such as materialproperties (for example, geometric dimensions, objectconductivity, dielectric constants, and so on) and sources,instead of defining the underlying equations. ComsolMultiphysics then internally compiles a set of PDEsrepresenting the entire model.Figure 1andFigure 2show the electrical field from a solid conductive sensor and aspring sensor simulation.Figure 1. Typical PCB Sensor Electrical Field Propagation

FingerOverlaySensorEquipotentLines of theElectricalField

Figure 2. Spring Electrical Field Propagation

FingerOverlaySpringEquipotentLines of theElectricalField

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AN44999

The solid conductive sensor and spring sensor modeling isdone in the following conditions:



The overlay is mineral glass (relative permittivitye = 4.2; thickness = 4 mm.)



Finger is modeled as a metal ellipsoid(height = 20 mm; diameter = 10 mm).

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Solid conductive sensor is a solid metal circle(diameter = 10 mm; thickness = 0.1 mm).

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The spring sensor is modeled with a hollow metalcylinder (height = 20 mm; diameter = 10 mm; metalthickness = 1 mm).Figure 1on page1shows that propagation from the solid conductive sensor to the finger emanates from the uppersurface of the sensor.Figure 2 on page 1 shows that propagation from the spring (cylinder) to the fingeremanates from the upper surface of the sensor, and alsofrom the side surface. This suggests that the sensitivity ofthe spring is a little better than that of the solid conductivesensor with thick overlays, because a larger electric field isformed. This assumption is verified with touch capacitancecalculation, described in the following section.

Finger Introduced CapacitanceSimulation

The simulation technique discussed inAN42851 “Proximity Detection in the Presence of Metal Objects”

isused in this case. To define the influence of the overlaythickness on the Finger Touch added Capacitance (FTC),modeling on a solid conductive sensor and a spring sensoris done in the same conditions described in the sectionSpring Electrical Field Simulationon page 1. This is showninFigure 3. The only feature changed is the overlaythickness (from 1mm to 10 mm).Figure 3. FTC versus Overlay Thickness

00,20,40,60,811,20 2 4 6 8 10

Thickness of the Overlay, mm

I n t r o d u c e d C a p a c i t a n c e , p F

In addition, to define the most optimal spring physicaldimensions, the dependence of the FTC is modeled on itsparameters such as its height, its diameter, and thethickness of the wire in the spring.The dependence of FTC

against different simulationparameters is shown inFigure4toFigure 6. Figure 4. FTC Versus Height of the Spring

00,10,20,30,40,50,60 5 10 15 20 25 30 35

Height of the Spring, mm

I n t r o d u c e d C a p a c i t a n c e , p F

Figure 5. FTC Versus Diameter of the Spring

00,511,522,530 5 10 15 20 25

Diameter of the Spring, mm

I n t r o d u c e d C a p a c i t a n c e , p F

Figure 6. FTC Versus Wire Thickness of the Spring

0,520,530,540,550,560,570,580,590 1 2 3 4 5

Wire Thickness of the Spring, mm

I n t r o d u c e d C a p a c i t a n c e , p F

Spring Solid Sensor

April 1, 2008 Document No. 001-44999 Rev. ** 2

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Analysis of Simulation Results

FromFigure 1andFigure 2 on page 1,it is evident that a spring and a solid conductive sensor have the samesensitivity when a finger is placed above the sensor. Whena finger is placed beside the sensor center, the sensitivityof both sensor types is less. However, the springsensitivity is comparatively better.The greater signal from finger displacement of springsensors is considered an advantage, especially whenused in sliders. The sectionSliders from Springson page4explains this in more detail. Figure 3on page 2 shows that if the overlay thickness is2 mm or more, the spring sensitivity is higher.Figure 4toFigure 6on page 2 show which spring physicaldimensions are better suited to receive the optimalcapacitance features.

Recommendations for Physical SpringDimension Selections

Use springs with a height 5 mm or more. Springs withmore height do not result in additional sensitivity, but donot worsen the performance either. Therefore, moredistance between the board and overlay may be providedwhen required. Springs with heights less than 5 mm loseproperties such as elasticity, sensitivity, and sidesensitivity.To reach the optimal spring sensitivity, the diameter of thespring must be not less than 10 mm for a 4 mm overlay(seeFigure 5 on page 2). In some cases one can use springs with a smaller diameter if their sensitivity throughthe chosen overlay is sufficient.Figure 6on page 2 shows that the thickness of the springwire does not greatly influence its capacitancecharacteristics. The FTC changes in the range ofhundredths of picofarads. Therefore, the wire thicknessmust be chosen according to the required strength of thespring elasticity. On the whole, the wire thickness canrange from 0.3 mm to 1.5 mm.Judging by the intermediate results of the simulation, ingeneral the self capacitance of the spring is more than thatof a solid conductive sensor with the same diameter. Thisis compensated by using a shield electrode when the CSDmethod is used. For more information on CSD and theshield electrode, seeAN2398“Capacitance Sensing -Waterproof Capacitance Sensing” and the CSD UM datasheet.

Using Different Shape Springs

Springs of different shapes may be used in practicalapplications. Each shape has its advantages anddisadvantages.Figure 7toFigure 9show some of the common shapes.Figure 7. Round SpringFigure 8. Round Spring with Variable DiameterFigure 9. Rectangular SpringFigure 7shows a round spring for a standard button. It iseasily made and has a hollow space inside for backlight orother requirements.Figure 8shows a round spring with higher sensitivity.When the overlay contacts and compresses the spring, thewider part folds in forming a solid sensor, which increasesits sensitivity and allows the use of thicker overlays.It is better to use rectangular springs to form a slider (seeFigure 9). When several rectangular springs are placed ina row, they cover the slider sensing area more effectively.Also, the rectangular spring width is shorter than that of around one, which allows creating a slider with moresensors.

April 1, 2008 Document No. 001-44999 Rev. ** 3

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This application note considers the possibility of using springs as sensors. A comparison with solid conductive sensors and recommendations for the practical usage of springs ar... (More)

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Category:	How-To Guides/Manuals
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Upload Date:	02/10/2009
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Tags:	Technology backlighting partial differential equations springs as sensors (more tags) Technology backlighting partial differential equations springs as sensors capsense sensors solid conductive sensors metallic spring sensors solid conductive sensor spring electrical field simulation comsol multiphysics pcb sensor electrical field propagation spring electrical field propagation finger introduced capacitance simulation sliders from springs seat occupant detection (fewer)