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The MBR2535CTG/45CTG series uses the Schottky Barrier principle with a platinum barrier metal. These stateoftheart devices have the following features:
Features http://onsemi.com
Guardring for Stress Protection Low Forward Voltage 175C Operating Junction Temperature These are PbFree Devices* Case: Epoxy, Molded Epoxy Meets UL 94 V0 @ 0.125 in Weight: 1.9 grams (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds
Mechanical Characteristics
1 2, 4 3
MARKING DIAGRAM
AY WW B25x5G AKA
A Y WW B25x5 x G AKA
= Assembly Location = Year = Work Week = Device Code = 3 or 4 = PbFree Package = Diode Polarity
ORDERING INFORMATION
Device MBR2535CTG MBR2545CTG Package TO220 (PbFree) TO220 (PbFree) Shipping 50 Units/Rail 50 Units/Rail
*For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
MBR2535CTG, MBR2545CTG
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MBR2535CTG MBR2545CTG Average Rectified Forward Current (Rated VR, TC = 160C) Per Device Per Diode Peak Repetitive Forward Current per Diode Leg (Rated VR, Square Wave, 20 kHz, TC = 150C) NonRepetitive Peak Surge Current per Diode Leg (Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) Storage Temperature Range Operating Junction Temperature (Note 1) Voltage Rate of Change (Rated VR) ESD Ratings: Machine Model = C Human Body Model = 3B Symbol VRRM VRWM VR Value Unit V 35 45 A 30 15 IFRM IFSM IRRM Tstg TJ dv/dt ESD 30 150 1.0 65 to +175 65 to +175 10,000 > 400 > 8000 A A A C C V/ms V
IF(AV)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. The heat generated must be less than the thermal conductivity from JunctiontoAmbient: dPD/dTJ < 1/RqJA.
IR
mA
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MBR2535CTG, MBR2545CTG
IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 1000 200 100 40 20 10 4.0 2.0 1.0 0.4 0.2 0.1 0.04 0.02 0.01 0.004 0.002 IR , REVERSE CURRENT (mA) TJ = 150C 125C 100C 75C 25C 0 10 20 30 40 50
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
48 44 40 36 32 28 24 20 16 12 8.0 4.0 0 110 RATED VOLTAGE APPLIED RqJC = 1.5C/W 120 130 140 150 160 170 180 SQUARE WAVE
48 44 40 36 32 28 24 20 16 12 8.0 4.0 0 0 SQUARE WAVE dc SQUARE WAVE 20 40 60 80 100 120 140 160 180 dc RATED VR APPLIED RqJA = 16C/W (With TO-220 Heat Sink) RqJA = 60C/W (No Heat Sink)
dc
32 28 24 20 16 10 12 20 8.0 TJ = 125C 4.0 0 0 4.0 8.0 12 16 20 24 28 32 36 40 IF, AVERAGE FORWARD CURRENT (AMPS) I (CAPACITATIVE LOAD) PK + 5.0 I dc I (RESISTIVE LOAD) PK + p I SQUARE WAVE
AV
AV
MBR2535CTG, MBR2545CTG
PACKAGE DIMENSIONS
TO220 CASE 221A09 ISSUE AG
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z STYLE 6: PIN 1. 2. 3. 4. INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.036 0.142 0.161 0.095 0.105 0.110 0.161 0.014 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 ----0.080 ANODE CATHODE ANODE CATHODE MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.91 3.61 4.09 2.42 2.66 2.80 4.10 0.36 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 ----2.04
T B
4
SEATING PLANE
C S
Q
1 2 3
A U K
H Z L V G D N
R J
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customers technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MBR2535CT/D