In Chap. 2 the basic PCB design ﬂow was demonstrated starting from schematic entry withCapture to board routing with Layout, but no attention was given to board design issues suchas component placement and spacing rules, layer stack-up, or trace routing and spacing rules.Design examples will be used in this chapter to illustrate the various PCB design consider-ations described in Chaps. 5 and 6 and how to use the Layout tools to accomplish the designgoals. The part count in each example is kept to a minimum (all designs have fewer than10 parts and 14 pins/part) so as not to be cumbersome and not to distract the reader fromunderstanding how to route and set up layers and so that the Demo version can be used.In-depth discussion on PCB design manufacturability is covered in Chap. 5 and signal integ-rity and routing are covered in Chap. 6.The following examples use parts that may not be included with your version of OrCAD. Youcan make the parts yourself using the procedures discussed in the previous chapters, or youcan copy the parts and footprints provided in the example libraries located on the CD-ROMincluded with the book.
The ﬁrst example
is a simple analog design using a single op-amp. The design shows how toset up multiple plane layers for positive and negative power supplies and ground. The designalso demonstrates several key concepts in Capture, such as how to connect global nets, howto assign footprints, how to perform design rule checks, how to use the Capture part libraries,how to generate a bill of materials (BOM), and how to use the BOM as an aid in the design process in Capture and Layout. The design also shows how to perform important tasks inLayout such as loading board technology ﬁles, ﬁnding and selecting speciﬁc parts, and modi-fying padstacks. Intertool communication (such as annotation and back annotation) betweenCapture and Layout is also demonstrated.
The second example
is a mixed, digital/analog circuit. In addition to the tasks demonstratedin the ﬁrst example, the design also demonstrates how to set up split planes to isolate analogand digital power supplies and grounds. Other tasks include using copper pours on routinglayers to make partial ground planes, using copper pours on plane layers to make nested power and ground planes, and deﬁning anti-copper areas on plane and routing layers.
The third example
uses the same mixed, digital/analog circuit from the second example butdemonstrates how to use multiple-page schematics and off-page connectors to organize and
PCB Design Examples