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CMOS Processing

CMOS Processing

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Published by aneesh manu.m
CMOS Processing&enhancement
CMOS Processing&enhancement

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Published by: aneesh manu.m on Mar 03, 2013
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03/08/2014

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MicroLab, VLSI-14 (1/32)
 JMM v1.4
VLSI Design IIVLSI Design IIVLSI Design IIVLSI Design II
CMOS Processing CMOS Processing CMOS Processing CMOS Processing 
OverviewOverviewOverviewOverview
Processing stepsProcessing stepsProcessing stepsProcessing steps
processing step sequenceprocessing step sequenceprocessing step sequenceprocessing step sequenceGoal:Goal:Goal:Goal:You know the basics of integrated circuitYou know the basics of integrated circuitYou know the basics of integrated circuitYou know the basics of integrated circuitprocessing steps and you are familiar with theprocessing steps and you are familiar with theprocessing steps and you are familiar with theprocessing steps and you are familiar with theprocessing sequence of a sample CMOS technology.processing sequence of a sample CMOS technology.processing sequence of a sample CMOS technology.processing sequence of a sample CMOS technology.
 
MicroLab, VLSI-14 (2/32)
 JMM v1.4
Introduction Introduction Introduction Introduction 
Complementary MOS (CMOS) technology isComplementary MOS (CMOS) technology isComplementary MOS (CMOS) technology isComplementary MOS (CMOS) technology isbecoming the dominant candidate for VLSIbecoming the dominant candidate for VLSIbecoming the dominant candidate for VLSIbecoming the dominant candidate for VLSIapplicationsapplicationsapplicationsapplications
CMOS provides both nCMOS provides both nCMOS provides both nCMOS provides both n----channel and pchannel and pchannel and pchannel and p----channel MOSchannel MOSchannel MOSchannel MOStransistors on one chiptransistors on one chiptransistors on one chiptransistors on one chip
on extremely expensiveon extremely expensiveon extremely expensiveon extremely expensive fabsfabsfabsfabscheap chips arecheap chips arecheap chips arecheap chips areproducedproducedproducedproduced
each chip passes hundreds of different processingeach chip passes hundreds of different processingeach chip passes hundreds of different processingeach chip passes hundreds of different processingstepsstepsstepssteps
random process disturbances cause electricalrandom process disturbances cause electricalrandom process disturbances cause electricalrandom process disturbances cause electricalparameter variations of the chipsparameter variations of the chipsparameter variations of the chipsparameter variations of the chips
elements are never identicalelements are never identicalelements are never identicalelements are never identical
Process technology pictures and text are copied from:Process technology pictures and text are copied from:Process technology pictures and text are copied from:Process technology pictures and text are copied from:Atlas of IC Technologies, W.Atlas of IC Technologies, W.Atlas of IC Technologies, W.Atlas of IC Technologies, W. MalyMalyMalyMaly, The Benjamin Cummings, The Benjamin Cummings, The Benjamin Cummings, The Benjamin CummingsPublishing Company, ISBN 0Publishing Company, ISBN 0Publishing Company, ISBN 0Publishing Company, ISBN 0----8053805380538053----6850685068506850----7777
 
MicroLab, VLSI-14 (3/32)
 JMM v1.4
VLSI Circuit Fabrication VLSI Circuit Fabrication VLSI Circuit Fabrication VLSI Circuit Fabrication 
depositdepositdepositdepositthin layers of materialthin layers of materialthin layers of materialthin layers of materialandandandandetchetchetchetchinto desired patterninto desired patterninto desired patterninto desired pattern
n+n+n+n+n+n+n+n+pppp
oxidizeoxidizeoxidizeoxidizesilicon to formsilicon to formsilicon to formsilicon to formthin and thick layers of thin and thick layers of thin and thick layers of thin and thick layers of SiOSiOSiOSiO
2222
to serve asto serve asto serve asto serve asinsulators.insulators.insulators.insulators.diffusediffusediffusediffusedopants intodopants intodopants intodopants intosubstrate to createsubstrate to createsubstrate to createsubstrate to createP/N junctionsP/N junctionsP/N junctionsP/N junctionsimplantimplantimplantimplantions to setions to setions to setions to setthresholds and achievethresholds and achievethresholds and achievethresholds and achieveprecise dopant profilesprecise dopant profilesprecise dopant profilesprecise dopant profilesMost fabrication steps require first creating aMost fabrication steps require first creating aMost fabrication steps require first creating aMost fabrication steps require first creating amaskmaskmaskmaskthat determinesthat determinesthat determinesthat determineswhere the operation will occur. Masks can either be existing lawhere the operation will occur. Masks can either be existing lawhere the operation will occur. Masks can either be existing lawhere the operation will occur. Masks can either be existing layers onyers onyers onyers onthe IC (these masks are “self the IC (these masks are “self the IC (these masks are “self the IC (these masks are “self----aligned”) or created using a lithographicaligned”) or created using a lithographicaligned”) or created using a lithographicaligned”) or created using a lithographicprocess andprocess andprocess andprocess and photoresistphotoresistphotoresistphotoresist....Design rulesDesign rulesDesign rulesDesign rulesensure that design is still functional in the face of ensure that design is still functional in the face of ensure that design is still functional in the face of ensure that design is still functional in the face of misalignments and various sidemisalignments and various sidemisalignments and various sidemisalignments and various side----effects of the fabrication process.effects of the fabrication process.effects of the fabrication process.effects of the fabrication process.

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