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Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes (US patent 5838072)

Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes (US patent 5838072)

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Published by PriorSmart
U.S. patent 5838072: Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes. Granted to Li et. al. on 1998-11-17 (filed None). Currently involved in at least 1 patent litigation: Chip Packaging Solutions LLC v. Qualcomm Inc et. al. (California). See http://news.priorsmart.com for more info.
U.S. patent 5838072: Intrachip power distribution package and method for semiconductors having a supply node electrically interconnected with one or more intermediate nodes. Granted to Li et. al. on 1998-11-17 (filed None). Currently involved in at least 1 patent litigation: Chip Packaging Solutions LLC v. Qualcomm Inc et. al. (California). See http://news.priorsmart.com for more info.

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Published by: PriorSmart on Mar 28, 2013
Copyright:Public Domain

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08/30/2014

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