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Introduction to MEMS.

Introduction to MEMS.

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“A (not so) short Introduction to Micro Electromechanical Systems”, F. Chollet, HB. Liu, version 2.0, Aug. 2006, http://memscyclopedia.org/IntroMEMS.html

An introduction to the field of MEMS.


{Document is released under Creative Commons License-Non_Commercial 2.5.
Refer to page 2 of the document for more details.}
“A (not so) short Introduction to Micro Electromechanical Systems”, F. Chollet, HB. Liu, version 2.0, Aug. 2006, http://memscyclopedia.org/IntroMEMS.html

An introduction to the field of MEMS.


{Document is released under Creative Commons License-Non_Commercial 2.5.
Refer to page 2 of the document for more details.}

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Published by: sukuya on Mar 16, 2009
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07/22/2013

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 A(notso)short introductiontoMEMS
FranckCHOLLET,HaobingLIU
MicroMachinesCentre,SchoolofMAE,NanyangTechnologicalUniversity,Singapore
 
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Contents
1.1 What is MEMS and comparison with microelectronics. . . . . . 51.2 Why MEMS technology. . . . . . . . . . . . . . . . . . . . . . . 61.2.1 Advantages offered. . . . . . . . . . . . . . . . . . . . . . 61.2.2 Diverse products and markets. . . . . . . . . . . . . . . . 71.2.3 Economy of MEMS manufacturing and applications. . . 81.3 Major drivers for MEMS technology. . . . . . . . . . . . . . . . 101.4 Mutual benefits between MEMS and microelectronics. . . . . . 11
2.1 Physical scaling laws. . . . . . . . . . . . . . . . . . . . . . . . . 132.2 The principles of design and reliability. . . . . . . . . . . . . . . 152.3 MEMS design tools. . . . . . . . . . . . . . . . . . . . . . . . . . 182.4 MEMS system partitioning. . . . . . . . . . . . . . . . . . . . . 192.5 Sensors technology. . . . . . . . . . . . . . . . . . . . . . . . . . 192.6 Actuator technology. . . . . . . . . . . . . . . . . . . . . . . . . 232.6.1 Magnetic actuator. . . . . . . . . . . . . . . . . . . . . . 242.6.2 Electrostatic actuator. . . . . . . . . . . . . . . . . . . . 252.6.3 Thermal actuator. . . . . . . . . . . . . . . . . . . . . . . 26
3.1 Overview of MEMS fabrication process. . . . . . . . . . . . . . . 293.2 The MEMS materials. . . . . . . . . . . . . . . . . . . . . . . . 303.3 Bulk micromachining, wet and dry etching. . . . . . . . . . . . . 323.3.1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . 323.3.2 Isotropic and anisotropic wet etching. . . . . . . . . . . . 323.3.3 Dry etching. . . . . . . . . . . . . . . . . . . . . . . . . . 363.3.4 Wafer bonding. . . . . . . . . . . . . . . . . . . . . . . . 363.4 Surface micromachining. . . . . . . . . . . . . . . . . . . . . . . 373.4.1 Layer deposition. . . . . . . . . . . . . . . . . . . . . . . 383.4.2 Design limitation. . . . . . . . . . . . . . . . . . . . . . . 403.4.3 Microstructure release. . . . . . . . . . . . . . . . . . . . 413.5 DRIE micromachining. . . . . . . . . . . . . . . . . . . . . . . . 433.6 Other microfabrication techniques. . . . . . . . . . . . . . . . . 453.6.1 Micro-molding and LIGA. . . . . . . . . . . . . . . . . . 453.6.2 Polymer MEMS. . . . . . . . . . . . . . . . . . . . . . . 46
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