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info_iec61188-5-1{ed1.0}b

info_iec61188-5-1{ed1.0}b

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Published by StanVarembe
International Standards of the International Electrotechnical Commission (IEC)
International Standards of the International Electrotechnical Commission (IEC)

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Published by: StanVarembe on Apr 24, 2013
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NORMEINTERNATIONALE
CEIIEC
INTERNATIONALSTANDARD
61188-5-1
Première éditionFirst edition2002-07
Cartes imprimées et cartes imprimées équipées –Conception et utilisation –Partie 5-1:Considérations sur les liaisons pistes-soudures –Prescriptions génériquesPrinted boards and printed board assemblies –Design and use –Part 5-1:Attachment (land/joint) considerations –Generic requirements
Pour prix, voir catalogue en vigueur For price, see current catalogue
IEC 2002 Droits de reproduction réservés
  
Copyright - all rights reserved
 Aucune partie de cette publication ne peut être reproduite niutilisée sous quelque forme que ce soit et par aucun procédé,électronique ou mécanique, y compris la photocopie et lesmicrofilms, sans l'accord écrit de l'éditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotocopying and microfilm, without permission in writing fromthe publisher.
International Electrotechnical Commission, 3, rue de Varembé, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmail@iec.ch Web: www.iec.ch
CODE PRIXPRICE CODE
XB
Commission Electrotechnique InternationaleInternational Electrotechnical Commission
Международная
 
Электротехническая
 
Комиссия
 
 – 2 –61188-5-1 © CEI:2002
SOMMAIRE
 AVANT-PROPOS..................................................................................................................101Domaine d’application et objet.........................................................................................142Références normatives...................................................................................................143Termes et définitions.......................................................................................................164Exigences de conception.................................................................................................284.1Généralités............................................................................................................284.1.1Classification.............................................................................................304.1.2Détermination des zones de report.............................................................304.2Systèmes de dimensionnement..............................................................................324.2.1Tolérancement des composants.................................................................344.2.2Tolérancement des pastilles.......................................................................424.2.3Réserves de fabrication..............................................................................424.2.4Tolérances d’assemblage...........................................................................424.2.5Analyse des dimensions et des tolérances..................................................444.3Possibilide réalisation des conceptions...............................................................604.3.1Zone de report pour montage en surface....................................................624.3.2Choix des composants standard.................................................................624.3.3Développement du substrat du circuit.........................................................624.3.4Considérations d'assemblage.....................................................................624.3.5Prévision des essais automatisés...............................................................624.3.6Documentation du montage en surface.......................................................624.4Contraintes d'environnement..................................................................................624.4.1Composants sensibles à l'humidité.............................................................624.4.2Considérations d'environnement dans l'utilisation finale..............................644.5Règles de conception.............................................................................................664.5.1Espacement des composants.....................................................................664.5.2Assemblage des cartes à simple et double face..........................................704.5.3Conception du stencil de brasage...............................................................704.5.4Hauteur de dépassement des composants pour nettoyage..........................704.5.5Repères conventionnels.............................................................................724.5.6Conducteurs..............................................................................................784.5.7Conseils relatifs aux trous de liaison...........................................................804.5.8Réserves de fabrication normales...............................................................844.5.9Mise en flan...............................................................................................884.6Finitions des couches extérieures..........................................................................944.6.1Finitions des masques de brasage.............................................................944.6.2Espacement du masque de brasage...........................................................944.6.3Finition des zones de report.......................................................................965Validation de la qualité et de la fiabilité............................................................................965.1Techniques de validation........................................................................................966Testabilité.......................................................................................................................986.1Les cinq types d’essai............................................................................................986.1.1Essai de la carte nue..................................................................................986.1.2Essai sur la carte assemblée....................................................................100
 
61188-5-1 © IEC:20023
CONTENTS
FOREWORD.........................................................................................................................111Scope and object............................................................................................................152Normative references......................................................................................................153Terms and definitions......................................................................................................174Design requirements.......................................................................................................294.1General.................................................................................................................294.1.1Classification.............................................................................................314.1.2Land pattern determination.........................................................................314.2Dimensioning systems...........................................................................................334.2.1Component tolerancing..............................................................................354.2.2Land tolerancing........................................................................................434.2.3Fabrication allowances...............................................................................434.2.4Assembly tolerancing.................................................................................434.2.5Dimension and tolerance analysis...............................................................454.3Design producibility................................................................................................614.3.1SMT land pattern........................................................................................634.3.2Standard component selection...................................................................634.3.3Circuit substrate development....................................................................634.3.4Assembly considerations............................................................................634.3.5Provision for automated test.......................................................................634.3.6Documentation for SMT..............................................................................634.4Environmental constraint........................................................................................634.4.1Moisture sensitive components...................................................................634.4.2End-use environment considerations..........................................................654.5Design rules...........................................................................................................674.5.1Component spacing...................................................................................674.5.2Single- and double-sided board assembly...................................................714.5.3Solder paste stencil....................................................................................714.5.4Component stand-off height for cleaning....................................................714.5.5Fiducial marks............................................................................................734.5.6Conductors................................................................................................794.5.7Via guidelines............................................................................................814.5.8Standard fabrication allowances.................................................................854.5.9Panelization...............................................................................................894.6Outer layer finishes................................................................................................954.6.1Solder-mask finishes..................................................................................954.6.2Solder-mask clearances.............................................................................954.6.3Land-pattern finishes..................................................................................975Quality and reliability validation.......................................................................................975.1Validation techniques.............................................................................................976Testability.......................................................................................................................996.1Five types of testing...............................................................................................996.1.1Bare-board test..........................................................................................996.1.2Assembled board test...............................................................................101

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