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JP002 Tin Whiskers Theory

JP002 Tin Whiskers Theory

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Published by: demolinux on Jun 23, 2009
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05/25/2011

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JEDEC/IPCJOINT PUBLICATION
Current Tin Whiskers Theory andMitigation Practices GuidelineJP002
MARCH 2006
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION
IPC ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES®
 
 NOTICEJEDEC and IPC Standards and Publications are designed to serve the public interest througheliminating misunderstandings between manufacturers and purchasers, facilitatinginterchangeability and improvement of products, and assisting the purchaser in selecting andobtaining with minimum delay the proper product for his particular need. Existence of suchStandards and Publications shall not in any respect preclude any member or nonmember of JEDEC or IPC from manufacturing or selling products not conforming to such Standards andPublications, nor shall the existence of such Standards and Publications preclude their voluntaryuse by those other than JEDEC and IPC members, whether the standard is to be used either domestically or internationally.Recommended Standards and Publications are adopted by JEDEC and IPC without regard towhether their adoption may involve patents on articles, materials, or processes. By such action,JEDEC and IPC do not assume any liability to any patent owner, nor do they assume anyobligation whatever to parties adopting the Recommended Standard or Publication. Users arealso wholly responsible for protecting themselves against all claims of liabilities for patentinfringement.The material in this joint standard was developed by theJEDEC JC-14.1 Committee on Reliability Test Methods for Packaged Devicesand theIPC Tin Whiskers Guideline Task Group (5-23e).For Technical Information Contact:JEDEC Solid State Technology Association2500 Wilson Boulevard, Suite 220Arlington, VA 22201Phone (703) 907-7500Fax (703) 907-7583IPC3000 Lakeside Drive, Suite 309SBannockburn, Illinois 60015-1219Tel (847) 615-7100Fax (847) 615-7105©Copyright 2006. JEDEC Solid State Technology Association, Arlington, Virginia, and IPC,Bannockburn, Illinois. All rights reserved under both international and Pan-American copyrightconventions. Any copying, scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutes infringement under the Copyright Law of the United States.
This document may be downloaded free of charge at www.jedec.org; however JEDEC/IPC retains thecopyright on this material. By downloading this file the individualagrees not to charge for or resell the resulting material.Printed in the U.S.A.All rights reserved
 
 PLEASE!DON’T VIOLATETHELAW!This document is copyrighted by JEDEC and IPC and may not bereproduced without permission.Organizations may obtain permission to reproduce a limited number of copiesthrough entering into a license agreement. For information, contact:JEDEC Solid State Technology Association2500 Wilson BoulevardArlington, Virginia 22201-3834or call (703) 907-7559

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