U.S. patent 8283758: Microelectronic packages with enhanced heat dissipation and methods of manufacturing. Granted to Jiang on 2012-10-09 (filed 2010-12-16) and assigned to Monolithic Power Systems, Inc.. Currently involved in at least 1 patent litigation: Monolithic Power Systems, Inc. v. Silergy Corporation et. al. (California). See http://news.priorsmart.com for more info.
Original Title
Microelectronic packages with enhanced heat dissipation and methods of manufacturing (US patent 8283758)
U.S. patent 8283758: Microelectronic packages with enhanced heat dissipation and methods of manufacturing. Granted to Jiang on 2012-10-09 (filed 2010-12-16) and assigned to Monolithic Power Systems, Inc.. Currently involved in at least 1 patent litigation: Monolithic Power Systems, Inc. v. Silergy Corporation et. al. (California). See http://news.priorsmart.com for more info.
U.S. patent 8283758: Microelectronic packages with enhanced heat dissipation and methods of manufacturing. Granted to Jiang on 2012-10-09 (filed 2010-12-16) and assigned to Monolithic Power Systems, Inc.. Currently involved in at least 1 patent litigation: Monolithic Power Systems, Inc. v. Silergy Corporation et. al. (California). See http://news.priorsmart.com for more info.