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HCD-GT555

HCD-GT555

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Published by: rgbelectronics on Aug 27, 2009
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SERVICE MANUAL
Sony Corporation
Audio&Video Business GroupPublished by Sony Techno Create Corporation
HCD-GT111/GT222/GT444/GT555
SPECIFICATIONS
COMPACT DISC DECK RECEIVER
9-889-112-03
2008G05-1
©
2008.07
 AEP Model 
HCD-GT111/GT222/GT444
UK Model 
HCD-GT444
E Model Russian Model 
HCD-GT111/GT222/GT444/GT555 
HCD-GT111 is the ampli
er, USB, CD player, tapedeck and tuner section in MHC-GT111/GT111BP.HCD-GT222 is the ampli
er, USB, CD player, tapedeck and tuner section in MHC-GT222.HCD-GT444 is the ampli
er, USB, CD player, tapedeck and tuner section in MHC-GT444.HCD-GT555 is the ampli
er, USB, CD player, tapedeck and tuner section in MHC-GT555.Photo: HCD-GT555CDSectionModel Name Using Similar MechanismNEWMechanism TypeCDM88A-K6BD93-WODOptical Pick-up Block NameKSM-213DCPTape deckSectionModel Name Using Similar MechanismHCD-EC55/EC77Tape Transport Mechanism TypeTCM-J1 or CS-21SC-900TP
Amplifier section
HCD-GT555
The following are measured at AC 120, 127,220, 230 – 240 V 50/60 HzFront speaker Power output (rated): 110 W + 110 W(at 6
Ω
, 1 kHz, 1% THD)RMS output power (reference):200W + 200 W (per channel at 6
Ω
,1 kHz, 10% THD)Subwoofer RMS output power (reference): 190 W(at 6
Ω
, 100 Hz, 10% THD)
HCD-GT444
The following are measured at AC 120, 127,220, 230 – 240 V 50/60 HzFront speaker Power output (rated): 90 W + 90 W(at 6
Ω
, 1 kHz, 1% THD)RMS output power (reference):150 W + 150 W (per channel at 6
Ω
,1 kHz, 10% THD)Subwoofer RMS output power (reference): 150 W(at 6
Ω
, 100 Hz, 10% THD)
HCD-GT222
The following are measured at AC 120, 127,220, 230 – 240V 50/60 HzPower output (rated): 110 W + 110 W(at 6
Ω
, 1 kHz, 1% THD)RMS output power (reference):200 W + 200 W (per channel at 6
Ω
,1 kHz, 10% THD)
HCD-GT111
The following are measured at AC 120, 127,220, 230 – 240V 50/60 HzPower output (rated): 60 W + 60 W(at 6
Ω
, 1 kHz, 1% THD)RMS output power (reference):100 W + 100 W (per channel at 6
Ω
,1 kHz, 10% THD)
Inputs
AUDIO INPUT L/R : voltage250 mV, impedance 47 kilohmsMIC: sensitivity 1 mV, impedance10 kilohms(USB) port: Type A
Outputs
PHONES: accepts headphones of 8
Ω
or moreFRONT SPEAKER: accepts impedance of 6
Ω
SUBWOOFER (HCD-GT555/HCD-GT444 only): acceptsimpedance of 6
Ω
USB section
Supported bit rateMP3 (MPEG 1 Audio Layer-3):32 – 320 kbps, VBR WMA: 32 – 192 kbps, VBR AAC: 48 – 320 kbpsSampling frequenciesMP3 (MPEG 1 Audio Layer-3):32/44.1/48 kHzWMA: 44.1 kHzAAC: 44.1 kHzTransfer speedFull-SpeedSupported USB deviceMass Storage ClassMaximum current500 mA
CD player section
System: Compact disc and digital audiosystemLaser Diode PropertiesEmission Duration: ContinuousLaser Output*: Less than 44.6
μ
W* Thisoutputisthevaluemeasurementat a distance of 200 mm from theobjective lens surface on the OpticalPick-up Block with 7 mm aperture.Frequency response: 20 Hz – 20 kHzSignal-to-noise ratio: More than 90 dBDynamic range: More than 88 dB
Tape deck section
Recording system: 4-track 2-channel, stereo
Tuner section
FM stereo, FM/AM superheterodyne tuner 
FM tuner section
Tuning range:87.5 – 108.0 MHz (50 kHz step)Antenna: FM lead antennaAntenna terminals: 75 ohms unbalancedIntermediate frequency: 10.7 MHz
AM tuner section
Tuning rangePan American and Oceanian models:530 – 1,710 kHz (with 10 kHz tuninginterval)531 – 1,710 kHz (with 9 kHz tuninginterval)European and Russian models:531 – 1,602 kHz (with 9 kHz tuninginterval)Other models:530 – 1,610 kHz (with 10 kHz tuninginterval)531 – 1,602 kHz (with 9 kHz tuninginterval)Antenna:AMloopantenna,externalantennaterminalIntermediate frequency: 450 kHz
Mexican model: AC 127 V, 60 HzArgentine model: AC 220 V, 50/60 HzOther models: AC 120, 220 or 230 – 240 V, 50/60 Hz, Adjustable withvoltage selector Power consumptionHCD-GT555: 216 WHCD-GT444: 286 WHCD-GT222: 163 WHCD-GT111: 150 WDimensions (w/h/d) (excl. speakers)Approx. 231 × 361 × 437.5 mm(9 1/8 × 14 1/4 × 17 1/4 inch)Mass (excl. speakers)HCD-GT555/GT444/GT222(Except European model),HCD-ZT4: 10.0 kg (22 lb 1 oz)HCD-GT222 (European model):9.6 kgHCD-GT111: 8.0 kgDesign and specifications are subject tochange without notice.
General
Power requirementsEuropean and Russian models:AC 230 V, 50/60 Hz
 
HCD-GT111/GT222/GT444/GT555
1. SERVICING NOTES
............................................. 3
2. GENERAL
.................................................................. 7
3. DISASSEMBLY
3-1. Disassembly Flow ........................................................... 93-2. Side-L/R Case ................................................................. 103-3. Top Panel Block .............................................................. 103-4. Tape Mechanism Deck .................................................... 113-5. Front Panel Block ........................................................... 113-6. Back Panel ...................................................................... 123-7. MAIN Board ................................................................... 123-8. CD Mechanism Block ..................................................... 133-9. POWERAMP Board ....................................................... 133-10. Base Unit......................................................................... 143-11. OP Base Assy (KSM-213D) ........................................... 143-12. Belt (DLM3A) ................................................................ 15
4. TEST MODE
 
............................................................ 16
5. MECHANICAL ADJUSTMENTS
 
...................... 20
6. ELECTRICAL ADJUSTMENTS
 
........................ 21
7. DIAGRAMS
7-1. Block Diagram - CD SERVO, USB Section - ................ 237-2. Block Diagram - MAIN Section - ................................... 247-3. Block Diagram - AMP Section - ..................................... 257-4. Block Diagram- PANEL, POWER SUPPLY Section - ........................... 267-5. Schematic Diagram - CD Board (1/2) - .......................... 287-6. Schematic Diagram - CD Board (2/2) - .......................... 297-7. Printed Wiring Board - CD Board - ................................ 307-8. Printed Wiring Board - TC Board -................................. 317-9. Schematic Diagram - TC Board - ................................... 317-10. Printed Wiring Board - USB Board - .............................. 327-11. Schematic Diagram - USB Board -................................. 337-12. Printed Wiring Boards - REG Section - .......................... 347-13. Schematic Diagram - REG Section - .............................. 347-14. Printed Wiring Board - MAIN Board - ........................... 357-15. Schematic Diagram - MAIN Board (1/4) - ..................... 367-16. Schematic Diagram - MAIN Board (2/4) - ..................... 37
TABLE OF CONTENTS
SAFETY-RELATED COMPONET WARNING!COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINEWITH MARK
0
ON THE SCHEMATIC DIAGRAMS AND INTHE PARTS LIST ARE CRITICAL TO SAFE OPERATION.REPLACE THESE COMPONENTS WITH SONY PARTSWHOSE PART NUMBERS APPEAR AS SHOWN IN THISMANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
Notes on chip component replacement
Never reuse a disconnected chip component.Notice that the minus side of a tantalum capacitor may be dam-aged by heat.
Flexible Circuit Board Repairing
Keep the temperature of soldering iron around 270 °C duringrepairing.Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times).Be careful not to apply force on the conductor when solderingor unsoldering.
This appliance isclassified as a CLASS 1LASER product. Thismarking is located on therear exterior.
CAUTION
Use of controls or adjustments or performance of procedures other thanthose speci
ed herein may result in hazardous radiation exposure.
7-17. Schematic Diagram - MAIN Board (3/4) - ..................... 387-18. Schematic Diagram - MAIN Board (4/4) - ..................... 397-19. Printed Wiring Boards - JACK Section - ........................ 407-20. Schematic Diagram - JACK Section - ............................ 407-21. Printed Wiring Board - POWERAMP Board - ............... 417-22. Schematic Diagram - POWERAMP Board (1/2) - ......... 427-23. Schematic Diagram - POWERAMP Board (2/2) - ......... 437-24. Printed Wiring Board - DISPLAY Board - ..................... 447-25. Schematic Diagram - DISPLAY Board - ........................ 457-26. Printed Wiring Boards - PANEL Section - ..................... 467-27. Schematic Diagram - PANEL Section - .......................... 477-28. Printed Wiring Board- TRANS1 Board (GT111: 120V AC area in E, 240V ACarea in E, Chilean and Peruvian models) - ...................... 487-29. Schematic Diagram - TRANS1 Board(GT111: 120V AC area in E, 240V AC area in E,Chilean and Peruvian models) - ...................................... 497-30. Printed Wiring Board - TRANS2 Board(GT222/GT444/GT555) - ............................................... 507-31. Schematic Diagram - TRANS2 Board(GT222/GT444/GT555) - ............................................... 517-32. Printed Wiring Board - TRANSX Board(GT111: AEP, Russian and Argentina models) - ............. 527-33. Schematic Diagram - TRANSX Board(GT111: AEP, Russian and Argentina models) - ............. 53
8. EXPLODED VIEWS
8-1. Case Section .................................................................... 638-2. Loading Panel Section .................................................... 648-3. DISPLAY Board Section ................................................ 658-4. Front Panel Section ......................................................... 668-5. Meter Display Assy ......................................................... 678-6. Top Panel Section ........................................................... 688-7. Back Panel Section ......................................................... 698-8. MAIN Board Section ...................................................... 708-9. Chassis Section ............................................................... 718-10. CD Mechanism Section (CDM88A-K6BD93-WOD) .... 72
9. ELECTRICAL PARTS LIST
.............................. 73
 
HCD-GT111/GT222/GT444/GT555
3
SECTION 1SERVICING NOTES
ModelPart No.
GT555: E23-287-080-0
[]
GT444: E23-287-080-1
[]
GT222: E23-287-080-2
[]
GT111: E23-287-080-3
[]
GT555: MX3-287-081-0
[]
GT444: MX3-287-081-1
[]
GT222: MX3-287-081-2
[]
GT111: E33-287-082-0
[]
GT555: AR3-287-085-0
[]
GT444: AR3-287-085-1
[]
GT222: AR3-287-085-2
[]
GT111: AR3-287-085-3
[]
GT555: E513-287-086-0
[]
GT444: E513-287-086-1
[]
GT222: E513-287-086-2
[]
GT111: E513-287-086-3
[]
GT111: AEP3-287-088-0
[]
GT222: AEP3-287-088-1
[]
GT444: AEP, UK3-287-088-2
[]
GT111: RU3-287-090-0
[]
GT222: RU3-287-090-1
[]
GT444: RU3-287-090-2
[]
GT555: RU3-287-090-3
[]
MODEL IDENTIFICATION – Back Panel –NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostat-ic break-down because of the potential difference generated by thecharged electrostatic load, etc. on clothing and the human body.During repair, pay attention to electrostatic break-down and alsouse the procedure in the printed matter which is included in therepair parts.The
exible board is easily damaged and should be handled withcare.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focusedon the disc re
ective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-free mark (LF) indicating the solder contains no lead.(Caution: Some printed circuit boards may not come printed withthe lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.Unleaded solder melts at a temperature about 40 °C higher than ordinary solder.Ordinary soldering irons can be used but the iron tip has to beapplied to the solder joint for a slightly longer time.Soldering irons using a temperature regulator should be set toabout 350 °C.Caution: The printed pattern (copper foil) may peel away if theheated tip is applied for too long, so be careful!Strong viscosityUnleaded solder is more viscou-s (sticky, less prone to
ow)than ordinary solder so use caution not to let solder bridgesoccur such as on IC pins, etc.Usable with ordinary solder It is best to use only unleaded solder but unleaded solder mayalso be added to ordinary solder.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstrationdisc in the store is equipped.
Releasing Procedure:
1. Press [
I
/
1
] button to turn the power on.2. Press the [CD] button to select CD function.3. While pressing the [
x
] button, press the [
Z
] button for more 5seconds).4. The message “UNLOCKED” is displayed and the disc tray isunlocked.
Note:
When
LOCKED
is displayed, the slot lock is not released byturning power on/off with the
[
I
/
1
]
button.
MODELNUMBE LABEL
• AbbreviationAR : Argentina modelE2 : 120V AC area in E modelE3 : 240V AC area in E modelE51 : Chilean and Peruvian modelsMX : Mexican modelRU : Russian model

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Espero tener los mejores resultados con este manual Gracias
Rey Orduño Verastegui added this note
buen manual para facilitarnos el trabajo de reparacion,felicidades y muchas gracias por el aporte de informacion.
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