This paper describes the architecture and the implementation of major technologies in HP ProLiantc-Class Server Blades based on Intel® Xeon
and AMD Opteron
processors. These technologiesinclude processors, memory, connections, power, management, and the latest serial input/output(I/O) technologies.This technology brief is written with the assumption that the reader is familiar with HP ProLiant servertechnology and has some knowledge of BladeSystem architecture. For more information about theinfrastructure components, see the HP website at
As HP began planning the next-generation of BladeSystem architecture, it became clear thatsignificant changes affecting I/O, processor, and memory technologies were on the horizon, forexample:
New serialized I/O technologies to meet demands for greater I/O bandwidths
More complex processors using multi-core architectures, providing virtualization, and requiringhigher power loads
Memory formats, such as Fully Buffered DIMMs, providing increased performance and capacityTherefore, HP designed a completely new BladeSystem architecture to accommodate these newtechnologies. The new architecture uses full-featured server blades in a high-density form factor. Forcomplete specifications of each server blade, see the HP website at
ProLiant c-Class Server Blade architecture
An HP ProLiant c-Class Server Blade is a complete server on a blade that slides into an HPBladeSystem c-Class enclosure, which in turn fits in an HP 10000 series rack. A BladeSystem c-Classenclosure can operate with as few as a single server blade installed, but the great advantage ofblade architecture is the easy addition of more server blades. ProLiant c-Class Server Blades are builtin standard form-factors, referred to as
(8U). Both half-height and full-height server blades fit into any blade slot in a BladeSystem c-Class enclosure.
ProLiant c-Class Server Blades include enterprise-class technologies:
Two or four AMD, Intel x86, or Intel Itanium® processors
Hot-plug internal disk drives
Memory modules using advanced memory technologies such as Fully Buffered DIMMs
Multiple slots for I/O cards
Embedded network interconnects that use gigabit Ethernet as well as remote direct memory access(RDMA) and TCP/IP offload engine (TOE) technologies
for improved networking performance
Thermal Logic technologies
Fully Buffered DIMMs are used only on server blades with Intel processors.
Both RDMA and TOE technologies move some of the processing transactions from the main processor on aserver blade to a processor embedded on the network interconnect card. This frees the main processor for otherwork.