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Desktop Board DP35DP may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current
characterized errata are documented in the Intel Desktop Board DP35DP Specification Update.
Intel Desktop Board
DP35DP
Technical Product Specification
Revision History
Revision Revision History Date
-001 First release of the Intel
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Copyright 2007, Intel Corporation. All rights reserved.
iii
Preface
This Technical Product Specification (TPS) specifies the board layout, components,
connectors, power and environmental requirements, and the BIOS for the Intel
Desktop Board DP35DP. It describes the standard product and available
manufacturing options.
Intended Audience
The TPS is intended to provide detailed, technical information about the Desktop Board
DP35DP and its components to the vendors, system integrators, and other engineers
and technicians who need this level of information. It is specifically not intended for
general audiences.
What This Document Contains
Chapter Description
1 A description of the hardware used on the board
2 A map of the resources of the board
3 The features supported by the BIOS Setup program
4 A description of the BIOS error messages, beep codes, and POST
codes
5 Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not
all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings
NOTE
Notes call attention to important information.
INTEGRATORS NOTES
Integrators notes are used to call attention to information that may be useful to
system integrators.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DP35DP Technical Product Specification
iv
Other Common Notation
# Used after a signal name to identify an active-low signal (such as USBP0#)
GB Gigabyte (1,073,741,824 bytes)
GB/sec Gigabytes per second
Gbit Gigabit (1,073,741,824 bits)
KB Kilobyte (1024 bytes)
Kbit Kilobit (1024 bits)
kbits/sec 1000 bits per second
MB Megabyte (1,048,576 bytes)
MB/sec Megabytes per second
Mbit Megabit (1,048,576 bits)
Mbit/sec Megabits per second
xxh An address or data value ending with a lowercase h indicates a hexadecimal value.
x.x V Volts. Voltages are DC unless otherwise specified.
* This symbol is used to indicate third-party brands and names that are the property of their
respective owners.
v
Contents
1 Product Description
1.1 Overview........................................................................................ 10
1.1.1 Feature Summary ................................................................ 10
1.1.2 Board Layout ....................................................................... 12
1.1.3 Block Diagram..................................................................... 14
1.2 Legacy Considerations...................................................................... 15
1.3 Online Support................................................................................ 15
1.4 Processor ....................................................................................... 15
1.5 System Memory .............................................................................. 16
1.5.1 Memory Configurations ......................................................... 17
1.6 Intel
Pentium
Celeron
82566DC
Gigabit Ethernet Controller
BIOS
Intel
Management
Engine in ICH9R
Voltage sense to detect out of range power supply voltages
Thermal sense to detect out of range thermal values
Four fan headers
Three fan sense inputs used to monitor fan activity
Intel Desktop Board DP35DP Technical Product Specification
12
1.1.2 Board Layout
Figure 1 shows the location of the major components.
Figure 1. Major Board Components
Table 2 lists the components identified in Figure 1.
Product Description
13
Table 2. Board Components Shown in Figure 1
Item/callout
from Figure 1
Description
A PCI Conventional bus add-in card connector
B Auxiliary rear chassis fan header
C PCI Express x1 connector
D PCI Express x1 connector
E High Definition Audio Link header
F PCI Conventional bus add-in card connector
G Front panel audio header
H PCI Conventional bus add-in card connector
I PCI Express x1 connector
J Speaker
K PCI Express x16 connector
L Back panel connectors
M Processor core power connector (2 X 2)
N Back panel CIR emitter (output) header
O Rear chassis fan connector
P LGA775 processor socket
Q Intel
82P35 MCH
R Processor fan header
S DIMM Channel A sockets
T Serial port header
U DIMM Channel B sockets
V Front panel CIR receiver (input) header
W Main Power connector (2 X 12)
X Chassis intrusion header
Y Battery
Z Front chassis fan header
AA Intel
82801IR I/O Controller Hub (ICH9R)
BB BIOS Setup configuration jumper block
CC Auxiliary front panel power LED header
DD Front panel header
EE Serial ATA connectors [5]
FF Parallel ATA IDE connector
GG Front panel USB headers [3]
HH External Serial ATA (eSATA) connector
II IEEE-1394a header
Intel Desktop Board DP35DP Technical Product Specification
14
1.1.3 Block Diagram
Figure 2 is a block diagram of the major functional areas.
Figure 2. Block Diagram
Product Description
15
1.2 Legacy Considerations
This board differs from other Intel Desktop Board products, with specific changes
including (but not limited to) the following:
No parallel port
The location of the floppy drive connector has moved
No serial port on the back panel
The serial port header is located between the memory sockets and may require a
specialized chassis or cabling solution to use
1.3 Online Support
To find information about Visit this World Wide Web site:
Intel
QRTD) (optional)
Wake from Consumer IR
1.13.1 ACPI
ACPI gives the operating system direct control over the power management and Plug
and Play functions of a computer. The use of ACPI with the board requires an
operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-on/standby
sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events (see Table 8 on page 31)
Support for a front panel power and sleep mode switch
Table 6 lists the system states based on how long the power switch is pressed,
depending on how ACPI is configured with an ACPI-aware operating system.
Table 6. Effects of Pressing the Power Switch
If the system is in this
state
and the power switch
is pressed for
the system enters this state
Off
(ACPI G2/G5 Soft off)
Less than four seconds Power-on
(ACPI G0 working state)
On
(ACPI G0 working state)
Less than four seconds Soft-off/Standby
(ACPI G1 sleeping state)
On
(ACPI G0 working state)
More than four seconds Fail safe power-off
(ACPI G2/G5 Soft off)
Sleep
(ACPI G1 sleeping state)
Less than four seconds Wake-up
(ACPI G0 working state)
Sleep
(ACPI G1 sleeping state)
More than four seconds Power-off
(ACPI G2/G5 Soft off)
Intel Desktop Board DP35DP Technical Product Specification
30
1.13.1.1 System States and Power States
Under ACPI, the operating system directs all system and device power state
transitions. The operating system puts devices in and out of low-power states based
on user preferences and knowledge of how devices are being used by applications.
Devices that are not being used can be turned off. The operating system uses
information from applications and user settings to put the system as a whole into a
low-power state.
Table 7 lists the power states supported by the board along with the associated
system power targets. See the ACPI specification for a complete description of the
various system and power states.
Table 7. Power States and Targeted System Power
Global
States
Sleeping States
Processor
States
Device States
Targeted System
Power
(Note 1)
G0 working
state
S0 working C0 working D0 working
state.
Full power > 30 W
G1 sleeping
state
S1 Processor
stopped
C1 stop
grant
D1, D2, D3
device
specification
specific.
5 W < power < 52.5 W
G1 sleeping
state
S3 Suspend to
RAM. Context
saved to RAM.
No power D3 no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G1 sleeping
state
S4 Suspend to
disk. Context
saved to disk.
No power D3 no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G2/S5 S5 Soft off.
Context not saved.
Cold boot is
required.
No power D3 no power
except for
wake-up logic.
Power < 5 W
(Note 2)
G3
mechanical off.
AC power is
disconnected
from the
computer.
No power to the
system.
No power D3 no power for
wake-up logic,
except when
provided by
battery or
external source.
No power to the system.
Service can be performed
safely.
Notes:
1. Total system power is dependent on the system configuration, including add-in boards and peripherals
powered by the system chassis power supply.
2. Dependent on the standby power consumption of wake-up devices used in the system.
Product Description
31
1.13.1.2 ENERGY STAR*
In 2007, the US Department of Energy and the US Environmental Protection Agency
revised the ENERGY STAR* requirements. Intel has worked directly with these two
governmental agencies to define the new requirements. Currently Intel Desktop
Boards meet the new requirements.
For information about Refer to
ENERGY STAR requirements and recommended configurations http://www.intel.com/go/energystar
1.13.1.3 Wake-up Devices and Events
Table 8 lists the devices or specific events that can wake the computer from specific
states.
Table 8. Wake-up Devices and Events
These devices/events can wake up the computer from this state
LAN S1, S3, S4, S5
(Note 1)
PME# signal S1, S3, S4, S5
(Note 1)
Power switch S1, S3, S4, S5
PS/2 devices S1, S3
RTC alarm S3, S4, S5
Serial port S3
USB S3
WAKE# signal S1, S3, S4, S5
Consumer IR S1, S3 (S4 and S5)
(Note 2)
Notes:
1. For LAN and PME# signal, S5 is disabled by default in the BIOS Setup program. Setting this option to
Power On will enable a wake-up event from LAN in the S5 state.
2. Wake from S4 and S5 is optional by the specification.
NOTE
The use of these wake-up events from an ACPI state requires an operating system
that provides full ACPI support. In addition, software, drivers, and peripherals must
fully support ACPI wake events.
Intel Desktop Board DP35DP Technical Product Specification
32
1.13.2 Hardware Support
CAUTION
Ensure that the power supply provides adequate +5 V standby current if LAN wake
capabilities and Instantly Available PC technology features are used. Failure to do so
can damage the power supply. The total amount of standby current required depends
on the wake devices supported and manufacturing options.
The board provides several power management hardware features, including:
Power connector
Fan headers
LAN wake capabilities
Instantly Available PC technology
Wake from USB
PME# signal wake-up support
WAKE# signal wake-up support
Intel Quick Resume Technology Drivers (Intel QRTD) (optional)
Wake from Consumer IR
LAN wake capabilities and Instantly Available PC technology require power from the
+5 V standby line.
NOTE
The use of Wake from USB from an ACPI state requires an operating system that
provides full ACPI support.
1.13.2.1 Power Connector
ATX12V-compliant power supplies can turn off the system power through system
control. When an ACPI-enabled system receives the correct command, the power
supply removes all non-standby voltages.
When resuming from an AC power failure, the computer returns to the power state it
was in before power was interrupted (on or off). The computers response can be set
using the Last Power State feature in the BIOS Setup programs Boot menu.
For information about Refer to
The location of the main power connector Figure 10, page 42
The signal names of the main power connector Table 20, page 47
Product Description
33
1.13.2.2 Fan Headers
The function/operation of the fan headers is as follows:
The fans are on when the board is in the S0 state.
The fans are off when the board is off or in the S3, S4, or S5 state.
The processor and Auxiliary fan headers are wired to a fan tachometer input and
the Front and Rear fan headers share the tachometer input of the hardware
monitoring and fan control device.
All fan headers support closed-loop fan control that can adjust the fan speed or
switch the fan on or off as needed.
All fan headers have a +12 V DC connection.
For information about Refer to
The locations of the fan headers and thermal sensors Figure 6, page 28
The signal names of the processor fan header Table 17, page 45
The signal names of the chassis fan headers Table 16, page 45
1.13.2.3 LAN Wake Capabilities
CAUTION
For LAN wake capabilities, the +5 V standby line from the power supply must be
capable of providing adequate +5 V standby current. Failure to provide adequate
standby current when implementing LAN wake capabilities can damage the power
supply.
LAN wake capabilities enable remote wake-up of the computer through a network.
The LAN subsystem PCI bus network adapter monitors network traffic at the Media
Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem
asserts a wake-up signal that powers up the computer. Depending on the LAN
implementation, the board supports LAN wake capabilities with ACPI in the following
ways:
The PCI Express WAKE# signal
The PCI bus PME# signal for PCI 2.3 compliant LAN designs
By Ping
Magic Packet
The onboard LAN subsystem
Wake from CIR
Intel Desktop Board DP35DP Technical Product Specification
34
1.13.2.4 Instantly Available PC Technology
CAUTION
For Instantly Available PC technology, the +5 V standby line from the power supply
must be capable of providing adequate +5 V standby current. Failure to provide
adequate standby current when implementing Instantly Available PC technology can
damage the power supply.
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-to-
RAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the
power supply is off, and the front panel LED is amber if dual colored, or off if single
colored.) When signaled by a wake-up device or event, the system quickly returns to
its last known wake state. Table 8 on page 31 lists the devices and events that can
wake the computer from the S3 state.
The board supports the PCI Bus Power Management Interface Specification. Add-in
boards that also support this specification can participate in power management and
can be used to wake the computer.
The use of Instantly Available PC technology requires operating system support and
PCI 2.3 compliant add-in cards and drivers.
1.13.2.5 Wake from USB
USB bus activity wakes the computer from ACPI S1 and S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB
and support in the OS.
1.13.2.6 PME# Signal Wake-up Support
When the PME# signal on the PCI bus is asserted, the computer wakes from an ACPI
S1, S3, S4, or S5 state (with Wake on PME enabled in BIOS).
1.13.2.7 WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from
an ACPI S1, S3, S4, or S5 state.
Product Description
35
1.13.2.8 +5 V Standby Power Indicator LED
The +5 V standby power indicator LED shows that power is still present even when the
computer appears to be off. Figure 7 shows the location of the standby power
indicator LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit,
disconnect the power cord before installing or removing any devices connected to the
board. Failure to do so could damage the board and any attached devices.
Figure 7. Location of the Standby Power Indicator LED
Intel Desktop Board DP35DP Technical Product Specification
36
37
2 Technical Reference
What This Chapter Contains
2.1 Memory Map................................................................................... 37
2.2 Connectors and Headers................................................................... 40
2.3 Jumper Block.................................................................................. 51
2.4 Mechanical Considerations ................................................................ 52
2.5 Electrical Considerations................................................................... 53
2.6 Thermal Considerations.................................................................... 54
2.7 Reliability ....................................................................................... 56
2.8 Environmental ................................................................................ 56
2.1 Memory Map
2.1.1 Addressable Memory
The board utilizes 8 GB of addressable system memory. Typically the address space
that is allocated for PCI Conventional bus add-in cards, PCI Express configuration
space, BIOS (SPI Flash), and chipset overhead resides above the top of DRAM (total
system memory). On a system that has 8 GB of system memory installed, it is not
possible to use all of the installed memory due to system address space being
allocated for other system critical functions. These functions include the following:
BIOS/ SPI Flash (8 Mbits)
Local APIC (19 MB)
Digital Media Interface (40 MB)
Front side bus interrupts (17 MB)
PCI Express configuration space (256 MB)
MCH base address registers, internal graphics ranges, PCI Express ports (up to
512 MB)
Memory-mapped I/O that is dynamically allocated for PCI Conventional and PCI
Express add-in cards
Base graphics memory support (1 MB or 8 MB)
Intel Management Engine Interface single channel (8 MB) or dual channel (16 MB)
Intel Desktop Board DP35DP Technical Product Specification
38
The amount of installed memory that can be used will vary based on add-in cards and
BIOS settings. Figure 8 shows a schematic of the system memory map. All installed
system memory can be used when there is no overlap of system addresses.
Upper BIOS
area (64 KB)
Lower BIOS
area
(64 KB;
16 KB x 4)
Add-in Card
BIOS and
Buffer area
(128 KB;
16 KB x 8)
Standard PCI/
ISA Video
Memory (SMM
Memory)
128 KB
DOS area
(640 KB)
1 MB
960 KB
896 KB
768 KB
640 KB
0 KB
0FFFFFH
0F0000H
0EFFFFH
0E0000H
0DFFFFH
0C0000H
0BFFFFH
0A0000H
09FFFFH
00000H
FLASH
APIC
Reserved
0 MB
640 KB
1 MB
Top of usable
DRAM (memory
visible to the
operating system)
PCI Memory Range -
contains PCI, chipsets,
Direct Media Interface
(DMI), and ICH ranges
(approximately 750 MB)
DOS
Compatibility
Memory
DRAM
Range
OM18311
~20 MB
8 GB
Top of System Address Space
Upper
4 GB of
address
space
Figure 8. Detailed System Memory Address Map
Technical Reference
39
Table 9 lists the system memory map.
Table 9. System Memory Map
Address Range
(decimal)
Address Range
(hex)
Size
Description
1024 K - 8388608 K 100000 - 1FFFFFFFF 8191 MB Extended memory
960 K - 1024 K F0000 - FFFFF 64 KB Runtime BIOS
896 K - 960 K E0000 - EFFFF 64 KB Reserved
800 K - 896 K C8000 - DFFFF 96 KB Potential available high DOS
memory (open to the PCI bus).
Dependent on video adapter used.
640 K - 800 K A0000 - C7FFF 160 KB Video memory and BIOS
639 K - 640 K 9FC00 - 9FFFF 1 KB Extended BIOS data (movable by
memory manager software)
512 K - 639 K 80000 - 9FBFF 127 KB Extended conventional memory
0 K - 512 K 00000 - 7FFFF 512 KB Conventional memory
Intel Desktop Board DP35DP Technical Product Specification
40
2.2 Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: Back panel
and front panel USB, with support for 1394.
The other internal connectors/headers are not overcurrent protected and should
connect only to devices inside the computers chassis, such as fans and internal
peripherals. Do not use these connectors/headers to power devices external to the
computers chassis. A fault in the load presented by the external devices could cause
damage to the computer, the power cable, and the external devices themselves.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not
meet FCC Class B requirements, even if no device is attached to the cable. Use
shielded cable that meets the requirements for full-speed devices.
This section describes the boards connectors and headers. The connectors and
headers can be divided into these groups:
Back panel I/O connectors (see page 41)
Component-side connectors and headers (see page 42)
Technical Reference
41
2.2.1 Back Panel Connectors
Figure 9 shows the location of the back panel connectors.
Item Description
A IEEE-1394a
B USB ports [2]
C USB ports [2]
D LAN
E USB ports [2]
F Surround left/right channel audio out
G Center channel and LFE (subwoofer) audio out
H Audio line in
I S/PDIF Digital audio out (optical)
J Mic in
K Audio line out
Figure 9. Back Panel Connectors
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
Intel Desktop Board DP35DP Technical Product Specification
42
2.2.2 Component-side Connectors and Headers
Figure 10 shows the locations of the component-side connectors and headers.
Figure 10. Component-side Connectors and Headers
Technical Reference
43
Table 10 lists the component-side connectors and headers identified in Figure 10.
Table 10. Component-side Connectors and Headers Shown in Figure 10
Item/callout
from Figure 10
Description
A PCI Conventional bus add-in card connector
B Auxiliary rear chassis fan header
C PCI Express x1 add-in card connector
D PCI Express x1 add-in card connector
E High Definition Audio Link header
F PCI Conventional bus add-in card connector
G Front panel audio header
H PCI Conventional bus add-in card connector
I PCI Express x1 add-in card connector
J PCI Express x16 add-in card connector
K Processor core power connector (2 X 2)
L Back panel CIR emitter (output) header
M Rear chassis fan header
N Processor fan header
O Serial port header
P Front panel CIR receiver (input) header
Q Main power connector (2 X 12)
R Chassis intrusion header
S Front chassis fan header
T Auxiliary front panel power LED header
U Front panel header
V Serial ATA connectors [5]
W Parallel ATA IDE connector
X Front panel USB header
Y Front panel USB header
Z Front panel USB header
AA External Serial ATA (eSATA) connector
BB Front panel IEEE-1394a header
Intel Desktop Board DP35DP Technical Product Specification
44
2.2.2.1 Signal Tables for the Connectors and Headers
Table 11. HD Audio Link Header
Pin Signal Name Pin Signal Name
1 BCLK 2 Ground
3 RST# 4 3.3 VCC
5 SYNC 6 Ground
7 SDO 8 3.3 VCC
9 SDI0 10 +12 V
11 SDI1 12 Key (no pin)
13 Aud RSVD 14 3.3 V STBY
15 Aud RSVD 16 Ground
Table 12. Front Panel Audio Header
Pin Signal Name Pin Signal Name
1 [Port 2] Left channel 2 Ground
3 [Port 2] Right channel 4 PRESENCE# (Dongle present)
5 [Port 1] Right channel 6 [Port 1] SENSE_RETURN
7 SENSE_SEND (Jack detection) 8 Key (no pin)
9 [Port 2] Left channel 10 [Port 2] SENSE_RETURN
Table 13. Serial ATA Connectors
Pin Signal Name
1 Ground
2 TXP
3 TXN
4 Ground
5 RXN
6 RXP
7 Ground
Table 14. Serial Port Header
Pin Signal Name Pin Signal Name
1 DCD 2 RXD#
3 TXD# 4 DTR
5 Ground 6 DSR
7 RTS 8 CTS
9 RI 10 Key (no pin)
Technical Reference
45
Table 15. Chassis Intrusion Header
Pin Signal Name
1 Intruder
2 Ground
Table 16. Front and Rear Chassis (3-Pin) Fan Headers
Pin Signal Name
1 Control
2 +12 V
3 Tach
Table 17. Processor and Auxiliary Rear Chassis (4-Pin) Fan Headers
Pin Signal Name
1 Ground
2 +12 V
3 FAN_TACH
4 FAN_CONTROL
Table 20. Back Panel CIR Emitter (Output) Header
Pin Signal Name
1 Emitter out 1
2 Emitter out 2
3 Ground
4 Key (no pin)
5 Jack detect 1
6 Jack detect 2
Table 21. Front Panel CIR Receiver (Input) Header
Pin Signal Name
1 Ground
2 LED
3 NC
4 Learn-in
5 5 V standby
6 VCC
7 Key (no pin)
8 CIR Input
Intel Desktop Board DP35DP Technical Product Specification
46
2.2.2.2 Add-in Card Connectors
The board has the following add-in card connectors:
PCI Express x16: one connector supporting simultaneous transfer speeds up to
4 GBytes/sec of peak bandwidth per direction and up to 8 GBytes/sec concurrent
bandwidth
PCI Express x1: three PCI Express x1 connectors. The x1 interface supports
simultaneous transfer speeds up to 250 Mbytes/sec of peak bandwidth per
direction and up to 500 MBytes/sec concurrent bandwidth
PCI Conventional (rev 2.3 compliant) bus: three PCI Conventional bus add-in card
connectors. The SMBus is routed to all PCI Conventional bus connectors. PCI
Conventional bus add-in cards with SMBus support can access sensor data and
other information residing on the board.
Note the following considerations for the PCI Conventional bus connectors:
All of the PCI Conventional bus connectors are bus master capable.
SMBus signals are routed to all PCI Conventional bus connectors. This enables PCI
Conventional bus add-in boards with SMBus support to access sensor data on the
board. The specific SMBus signals are as follows:
The SMBus clock line is connected to pin A40.
The SMBus data line is connected to pin A41.
2.2.2.3 Auxiliary Front Panel Power/Sleep LED Header
Pins 1 and 3 of this header duplicate the signals on pins 2 and 4 of the front panel
header.
Table 18. Auxiliary Front Panel Power/Sleep LED Header
Pin Signal Name In/Out Description
1 HDR_BLNK_GRN Out Front panel green LED
2 Not connected
3 HDR_BLNK_YEL Out Front panel yellow LED
Technical Reference
47
2.2.2.4 Power Supply Connectors
The board has the following power supply connectors:
Main power a 2 x 12 connector. This connector is compatible with 2 x 10
connectors previously used on Intel Desktop boards. The board supports the use
of ATX12V power supplies with either 2 x 10 or 2 x 12 main power cables. When
using a power supply with a 2 x 10 main power cable, attach that cable on the
rightmost pins of the main power connector, leaving pins 11, 12, 23, and 24
unconnected.
Processor core power a 2 x 2 connector. This connector provides power
directly to the processor voltage regulator and must always be used. Failure to do
so will prevent the board from booting.
Table 19. Processor Core Power Connector
Pin Signal Name Pin Signal Name
1 Ground 2 Ground
3 +12 V 4 +12 V
Table 20. Main Power Connector
Pin Signal Name Pin Signal Name
1 +3.3 V 13 +3.3 V
2 +3.3 V 14 -12 V
3 Ground 15 Ground
4 +5 V 16 PS-ON# (power supply remote on/off)
5 Ground 17 Ground
6 +5 V 18 Ground
7 Ground 19 Ground
8 PWRGD (Power Good) 20 No connect
9 +5 V (Standby) 21 +5 V
10 +12 V 22 +5 V
11 +12 V
(Note)
23 +5 V
(Note)
12 2 x 12 connector detect
(Note)
24 Ground
(Note)
Note: When using a 2 x 10 power supply cable, this pin will be unconnected.
For information about Refer to
Power supply considerations Section 2.5.1, page 53
Intel Desktop Board DP35DP Technical Product Specification
48
2.2.2.5 Front Panel Header
This section describes the functions of the front panel header. Table 21 lists the signal
names of the front panel header. Figure 11 is a connection diagram for the front panel
header.
Table 21. Front Panel Header
Pin
Signal
In/
Out
Description
Pin
Signal
In/
Out
Description
Hard Drive Activity LED Power LED
1 HD_PWR Out Hard disk LED
pull-up to +5 V
2 HDR_BLNK_GRN Out Front panel green
LED
3 HDA# Out Hard disk active
LED
4 HDR_BLNK_YEL Out Front panel yellow
LED
Reset Switch On/Off Switch
5 Ground Ground 6 FPBUT_IN In Power switch
7 FP_RESET# In Reset switch 8 Ground Ground
Power Not Connected
9 +5 V Power 10 N/C Not connected
Figure 11. Connection Diagram for Front Panel Header
Technical Reference
49
2.2.2.5.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is
being read from or written to a hard drive. Proper LED function requires one of the
following:
A Serial ATA hard drive connected to an onboard Serial ATA connector
A Parallel ATA IDE hard drive connected to an onboard Parallel ATA IDE connector
2.2.2.5.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type
switch that is normally open. When the switch is closed, the board resets and runs the
POST.
2.2.2.5.3 Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 22 shows the
possible states for a one-color LED. Table 23 shows the possible states for a two-color
LED.
Table 22. States for a One-Color Power LED
LED State Description
Off Power off/sleeping
Steady Green Running
Table 23. States for a Two-Color Power LED
LED State Description
Off Power off
Steady Green Running
Steady Yellow Sleeping
NOTE
The colors listed in Table 22 and Table 23 are suggested colors only. Actual LED
colors are chassis-specific.
2.2.2.5.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The
switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power
supply to switch on or off. (The time requirement is due to internal debounce circuitry
on the board.) At least two seconds must pass before the power supply will recognize
another on/off signal.
Intel Desktop Board DP35DP Technical Product Specification
50
2.2.2.6 Front Panel USB Headers
Figure 12 is a connection diagram for the front panel USB headers.
INTEGRATORS NOTES
The +5 V DC power on the USB headers is fused.
Use only a front panel USB connector that conforms to the USB 2.0 specification
for high-speed USB devices.
Figure 12. Connection Diagram for Front Panel USB Headers
2.2.2.7 Front Panel IEEE 1394a Header
Figure 13 is a connection diagram for the IEEE 1394a header.
INTEGRATORS NOTES
The +12 V DC power on the IEEE 1394a header is fused.
The IEEE 1394a header provides one IEEE 1394a port.
Figure 13. Connection Diagram for IEEE 1394a Header
Technical Reference
51
2.3 Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the
power cord from the computer before changing a jumper setting. Otherwise, the
board could be damaged.
Figure 14 shows the location of the jumper block. The jumper determines the BIOS
Setup programs mode. Table 24 lists the jumper settings for the three modes:
normal, configure, and recovery. When the jumper is set to configure mode and the
computer is powered-up, the BIOS compares the processor version and the microcode
version in the BIOS and reports if the two match.
Figure 14. Location of the Jumper Block
Table 24. BIOS Setup Configuration Jumper Settings
Function/Mode Jumper Setting Configuration
Normal 1-2
3 2 1
The BIOS uses current configuration information and
passwords for booting.
Configure 2-3
3 2 1
After the POST runs, Setup runs automatically. The
maintenance menu is displayed.
Recovery None
3 2 1
The BIOS attempts to recover the BIOS configuration. See
Section 3.7 for more information on BIOS recovery.
Intel Desktop Board DP35DP Technical Product Specification
52
2.4 Mechanical Considerations
2.4.1 Form Factor
The board is designed to fit into an ATX-form-factor chassis. Figure 15 illustrates the
mechanical form factor for the board. Dimensions are given in inches [millimeters].
The outer dimensions are 11.60 inches by 9.60 inches [294.64 millimeters by 243.84
millimeters]. Location of the I/O connectors and mounting holes are in compliance
with the ATX specification.
Figure 15. Board Dimensions
Technical Reference
53
2.5 Electrical Considerations
2.5.1 Power Supply Considerations
CAUTION
The +5 V standby line from the power supply must be capable of providing adequate
+5 V standby current. Failure to do so can damage the power supply. The total
amount of standby current required depends on the wake devices supported and
manufacturing options.
Additional power required will depend on configurations chosen by the integrator.
The power supply must comply with the indicated parameters of the ATX form factor
specification.
The potential relation between 3.3 VDC and +5 VDC power rails
The current capability of the +5 VSB line
All timing parameters
All voltage tolerances
For example, for a system consisting of a supported 65 W processor (see Section 1.4
on page 15 for a list of supported processors), 1 GB DDR2 RAM, one hard disk drive,
one optical drive, and all board peripherals enabled, the minimum recommended
power supply is 300 W. Table 25 lists the recommended power supply current values.
Table 25. Recommended Power Supply Current Values
Output Voltage 3.3 V 5 V 12 V1 12 V2 -12 V 5 VSB
Current 15 A 15 A 10 A 10 A 0.3 A 3.0 A
For information about Refer to
Selecting an appropriate power supply http://support.intel.com/support/motherboards/desktop/sb/
CS-026472.htm
2.5.2 Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan
header. Connecting the processor fan to a chassis fan header may result in onboard
component damage that will halt fan operation.
Table 26 lists the current capability of the fan headers.
Table 26. Fan Header Current Capability
Fan Header Maximum Available Current
Processor fan 3.0 A
Front chassis fan 1.5 A
Rear chassis fan 1.5 A
Auxiliary rear chassis fan 2.5 A
Intel Desktop Board DP35DP Technical Product Specification
54
2.5.3 Add-in Board Considerations
The board is designed to provide 2 A (average) of +5 V current for each add-in board.
The total +5 V current draw for add-in boards for a fully loaded board (all six
expansion slots and the PCI Express x16 connector filled) must not exceed 14 A.
2.6 Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38
o
C at the processor fan
inlet is a requirement. Use a processor heat sink that provides omni-directional
airflow to maintain required airflow across the processor voltage regulator area.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the
processor and/or voltage regulator or, in some instances, damage to the board. For a
list of chassis that have been tested with Intel desktop boards please refer to the
following website:
http://developer.intel.com/design/motherbd/cooling.htm
All responsibility for determining the adequacy of any thermal or system design
remains solely with the reader. Intel makes no warranties or representations that
merely following the instructions presented in this document will result in a system
with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating
temperature. Failure to do so could cause components to exceed their maximum case
temperature and malfunction. For information about the maximum operating
temperature, see the environmental specifications in Section 2.8.
CAUTION
Ensure that proper airflow is maintained in the processor voltage regulator circuit.
Failure to do so may result in damage to the voltage regulator circuit. The processor
voltage regulator area (shown in Figure 16) can reach a temperature of up to 85
o
C in
an open chassis.
Technical Reference
55
Figure 16 shows the locations of the localized high temperature zones.
Item Description
A Processor voltage regulator area
B Processor
C Intel
82P35 MCH
D Intel
82801IR (ICH9R)
Figure 16. Localized High Temperature Zones
Table 27 provides maximum case temperatures for the board components that are
sensitive to thermal changes. The operating temperature, current load, or operating
frequency could affect case temperatures. Maximum case temperatures are important
when considering proper airflow to cool the board.
Table 27. Thermal Considerations for Components
Component Maximum Case Temperature
Processor For processor case temperature, see processor datasheets and
processor specification updates
Intel 82P35 MCH 97
o
C (under bias)
Intel 82801IR (ICH9R) 92
o
C (under bias)
For information about Refer to
Processor datasheets and specification updates Section 1.2, page 15
Intel Desktop Board DP35DP Technical Product Specification
56
2.7 Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and
subassembly random failure rates. The calculation is based on the Bellcore Reliability
Prediction Procedure, TR-NWT-000332, Issue 4, September 1991. The MTBF
prediction is used to estimate repair rates and spare parts requirements.
The MTBF data is calculated from predicted data at 55 C. The Desktop Board DP35DP
MTBF is 133,448 hours.
2.8 Environmental
Table 28 lists the environmental specifications for the board.
Table 28. Desktop Board DP35DP Environmental Specifications
Parameter Specification
Temperature
Non-Operating -40 C to +70 C
Operating 0 C to +55 C
Shock
Unpackaged 50 g trapezoidal waveform
Velocity change of 170 inches/second
Packaged Half sine 2 millisecond
Product weight (pounds) Free fall (inches) Velocity change (inches/sec)
<20 36 167
21-40 30 152
41-80 24 136
81-100 18 118
Vibration
Unpackaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz
20 Hz to 500 Hz: 0.02 g Hz (flat)
Packaged 10 Hz to 40 Hz: 0.015 g Hz (flat)
40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz
57
3 Overview of BIOS Features
What This Chapter Contains
3.1 Introduction ................................................................................... 57
3.2 BIOS Flash Memory Organization....................................................... 58
3.3 Resource Configuration .................................................................... 58
3.4 System Management BIOS (SMBIOS)................................................. 59
3.5 Legacy USB Support ........................................................................ 60
3.6 BIOS Updates ................................................................................. 60
3.7 BIOS Recovery................................................................................ 61
3.8 Boot Options................................................................................... 62
3.9 Adjusting Boot Speed....................................................................... 63
3.10 BIOS Security Features .................................................................... 64
3.1 Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash
Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash
contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN
EEPROM information, and Plug and Play support.
The BIOS displays a message during POST identifying the type of BIOS and a revision
code. The initial production BIOSs are identified as DPP3510J.86A.
When the BIOS Setup configuration jumper is set to configure mode and the computer
is powered-up, the BIOS compares the CPU version and the microcode version in the
BIOS and reports if the two match.
The BIOS Setup program can be used to view and change the BIOS settings for the
computer. The BIOS Setup program is accessed by pressing the <F2> key after the
Power-On Self-Test (POST) memory test begins and before the operating system boot
begins. The menu bar is shown below.
Maintenance Main Advanced Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode.
Section 2.3 on page 51 shows how to put the board in configure mode.
Intel Desktop Board DP35DP Technical Product Specification
58
Table 29 lists the BIOS Setup program menu features.
Table 29. BIOS Setup Program Menu Bar
Maintenance Main Advanced Security Power Boot Exit
Clears
passwords and
displays
processor
information
Displays
processor
and memory
configuration
Configures
advanced
features
available
through the
chipset
Sets
passwords
and security
features
Configures
power
management
features and
power supply
controls
Selects boot
options
Saves or
discards
changes to
Setup
program
options
Table 30 lists the function keys available for menu screens.
Table 30. BIOS Setup Program Function Keys
BIOS Setup Program
Function Key
Description
<> or <> Selects a different menu screen (Moves the cursor left or right)
<> or <> Selects an item (Moves the cursor up or down)
<Tab> Selects a field (Not implemented)
<Enter> Executes command or selects the submenu
<F9> Load the default configuration values for the current menu
<F10> Save the current values and exits the BIOS Setup program
<Esc> Exits the menu
3.2 BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes an 8 Mbit (1024 KB)
flash memory device
3.3 Resource Configuration
3.3.1 PCI* Autoconfiguration
The BIOS can automatically configure PCI devices. PCI devices may be onboard or
add-in cards. Autoconfiguration lets a user insert or remove PCI cards without having
to configure the system. When a user turns on the system after adding a PCI card,
the BIOS automatically configures interrupts, the I/O space, and other system
resources. Any interrupts set to Available in Setup are considered to be available for
use by the add-in card.
Overview of BIOS Features
59
3.3.2 PCI IDE Support
If you select Auto in the BIOS Setup program, the BIOS automatically sets up the
PCI IDE connector with independent I/O channel support. The IDE interface supports
hard drives up to ATA-66/100/133 and recognizes any ATAPI compliant devices,
including CD-ROM drives, tape drives, and Ultra DMA drives. The BIOS determines the
capabilities of each drive and configures them to optimize capacity and performance.
To take advantage of the high capacities typically available today, hard drives are
automatically configured for Logical Block Addressing (LBA) and to PIO Mode 3 or 4,
depending on the capability of the drive. You can override the auto-configuration
options by specifying manual configuration in the BIOS Setup program.
To use ATA-66/100/133 features the following items are required:
An ATA-66/100/133 peripheral device
An ATA-66/100/133 compatible cable
ATA-66/100/133 operating system device drivers
NOTE
Do not connect an ATA device as a slave on the same IDE cable as an ATAPI master
device. For example, do not connect an ATA hard drive as a slave to an ATAPI
CD-ROM drive.
3.4 System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing
computers in a managed network.
The main component of SMBIOS is the Management Information Format (MIF)
database, which contains information about the computing system and its
components. Using SMBIOS, a system administrator can obtain the system types,
capabilities, operational status, and installation dates for system components. The
MIF database defines the data and provides the method for accessing this information.
The BIOS enables applications such as third-party management software to use
SMBIOS. The BIOS stores and reports the following SMBIOS information:
BIOS data, such as the BIOS revision level
Fixed-system data, such as peripherals, serial numbers, and asset tags
Resource data, such as memory size, cache size, and processor speed
Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the
SMBIOS information. The BIOS supports an SMBIOS table interface for such operating
systems. Using this support, an SMBIOS service-level application running on a
non-Plug and Play operating system can obtain the SMBIOS information. Additional
board information can be found in the BIOS under the Additional Information header
under the Main BIOS page.
Intel Desktop Board DP35DP Technical Product Specification
60
3.5 Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating
systems USB drivers are not yet available. Legacy USB support is used to access the
BIOS Setup program, and to install an operating system that supports USB. By
default, Legacy USB support is set to Enabled.
Legacy USB support operates as follows:
1. When you apply power to the computer, legacy support is disabled.
2. POST begins.
3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to
enter and configure the BIOS Setup program and the maintenance menu.
4. POST completes.
5. The operating system loads. While the operating system is loading, USB
keyboards and mice are recognized and may be used to configure the operating
system. (Keyboards and mice are not recognized during this period if Legacy USB
support was set to Disabled in the BIOS Setup program.)
6. After the operating system loads the USB drivers, all legacy and non-legacy USB
devices are recognized by the operating system, and Legacy USB support from the
BIOS is no longer used.
7. Additional USB legacy feature options can be access by using Intel Integrator
Toolkit.
To install an operating system that supports USB, verify that Legacy USB support in
the BIOS Setup program is set to Enabled and follow the operating systems
installation instructions.
3.6 BIOS Updates
The BIOS can be updated using either of the following utilities, which are available on
the Intel World Wide Web site:
Intel
Express BIOS Update utility, which enables automated updating while in the
Windows environment. Using this utility, the BIOS can be updated from a file on a
hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from
the file location on the Web.
Intel
Flash Memory Update Utility, which requires booting from DOS. Using this
utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash
drive or a USB hard drive), or a CD-ROM.
Both utilities verify that the updated BIOS matches the target system to prevent
accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS
update.
For information about Refer to
BIOS update utilities http://support.intel.com/support/motherboards/desktop/sb/CS-
022312.htm.
Overview of BIOS Features
61
3.6.1 Language Support
The BIOS Setup program and help messages are supported in US English. Additional
languages are available in the Integrators Toolkit utility. Check the Intel website for
details.
3.6.2 Custom Splash Screen
During POST, an Intel
Desktop Board DP35DP is in conformity with all applicable essential requirements
necessary for CE marking, following the provisions of the European Council Directive
2004/108/EC (EMC Directive) and 2006/95/EC (Low Voltage Directive).
The product is properly CE marked demonstrating this conformity and is for
distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC and
2006/95/EC.
etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC a
2006/95/EC.
Dansk Dette produkt er i overensstemmelse med det europiske direktiv
2004/108/EC & 2006/95/EC.
Dutch Dit product is in navolging van de bepalingen van Europees Directief
2004/108/EC & 2006/95/EC.
Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC ja 2006/95/EC
kehtestatud nuetele.
Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC & 2006/95/EC mryksi.
Franais Ce produit est conforme aux exigences de la Directive Europenne
2004/108/EC & 2006/95/EC.
Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie
2004/108/EC & 2006/95/EC.
2004/108/EC 2006/95/EC.
Magyar E termk megfelel a 2004/108/EC s 2006/95/EC Eurpai Irnyelv
elrsainak.
Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer
2004/108/EC & 2006/95/EC.
Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC &
2006/95/EC.
Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC un 2006/95/EC
noteikumiem.
Lietuvi is produktas atitinka Europos direktyv 2004/108/EC ir 2006/95/EC
nuostatas.
Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej
2004/108/EC u 2006/95/EC.
Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet
2004/108/EC & 2006/95/EC.
Regulatory Compliance and Battery Disposal Information
73
Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej
2004/108/EC i 73/23/EWG.
Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC
& 2006/95/EC.
Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC &
2006/95/EC.
Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv
2004/108/EC a 2006/95/EC.
Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC in
2006/95/EC.
Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC &
2006/95/EC.
Trke Bu rn, Avrupa Birliinin 2004/108/EC ve 2006/95/EC ynergelerine uyar.
Intel Desktop Board DP35DP Technical Product Specification
74
5.1.3 Product Ecology Statements
The following information is provided to address worldwide product ecology concerns
and regulations.
5.1.3.1 Disposal Considerations
This product contains the following materials that may be regulated upon disposal:
lead solder on the printed wiring board assembly.
5.1.3.2 Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the
Intel Product Recycling Program to allow retail consumers of Intels branded products
to return used products to selected locations for proper recycling.
Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the
details of this program, including the scope of covered products, available locations,
shipping instructions, terms and conditions, etc.
Intel Product Recycling Program
http://www.intel.com/intel/other/ehs/product_ecology
Deutsch
Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel
Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel
Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr
ordnungsgemes Recycling zurckzugeben.
Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte,
verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der
http://www.intel.com/intel/other/ehs/product_ecology
Espaol
Como parte de su compromiso de responsabilidad medioambiental, Intel ha
implantado el programa de reciclaje de productos Intel, que permite que los
consumidores al detalle de los productos Intel devuelvan los productos usados en los
lugares seleccionados para su correspondiente reciclado.
Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles
del programa, que incluye los productos que abarca, los lugares disponibles,
instrucciones de envo, trminos y condiciones, etc.
Regulatory Compliance and Battery Disposal Information
75
Franais
Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis
en uvre le programme Intel Product Recycling Program (Programme de recyclage
des produits Intel) pour permettre aux consommateurs de produits Intel de recycler
les produits uss en les retournant des adresses spcifies.
Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en
savoir plus sur ce programme, savoir les produits concerns, les adresses
disponibles, les instructions d'expdition, les conditions gnrales, etc.
http://www.intel.com/in
tel/other/ehs/product_ecology
Malay
Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran,
Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan
pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke
lokasi-lokasi terpilih untuk dikitarkan semula dengan betul.
Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan
butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi
tersedia, arahan penghantaran, terma & syarat, dsb.
Portuguese
Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o
Programa de Reciclagem de Produtos para que os consumidores finais possam enviar
produtos Intel usados para locais selecionados, onde esses produtos so reciclados de
maneira adequada.
Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls)
para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos,
os locais disponveis, as instrues de envio, os termos e condies, etc.
Russian
, Intel
Intel (Product Recycling Program)
Intel
.
, -
http://www.intel.com/intel/other/ehs/product_ecology
, , , ,
..
Intel Desktop Board DP35DP Technical Product Specification
76
Trke
Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin
Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri
dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya
koymutur.
Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve
artlar v.s dahil btn ayrntlarn grenmek iin ltfen
http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.
5.1.3.3 Lead Free Desktop Board
This Desktop Board is a European Union Restriction of Hazardous Substances (EU
RoHS Directive 2002/95/EC) compliant product. EU RoHS restricts the use of six
materials. One of the six restricted materials is lead.
This Desktop Board is lead free although certain discrete components used on the
board contain a small amount of lead which is necessary for component performance
and/or reliability. This Desktop Board is referred to as Lead-free second level
interconnect. The board substrate and the solder connections from the board to the
components (second-level connections) are all lead free.
China bans the same substances and has the same limits as EU RoHS; however it
requires different product marking and controlled substance information. The required
mark shows the Environmental Friendly Usage Period (EFUP). The EFUP is defined as
the number of years for which controlled listed substances will not leak or chemically
deteriorate while in the product.
Regulatory Compliance and Battery Disposal Information
77
Table 40 shows the various forms of the Lead-Free 2
nd
Level Interconnect mark as it
appears on the board and accompanying collateral.
Table 40. Lead-Free Board Markings
Description Mark
Lead-Free 2
nd
Level Interconnect:
This symbol is used to identify
electrical and electronic
assemblies and components in
which the lead (Pb) concentration
level in the desktop board
substrate and the solder
connections from the board to the
components (second-level
interconnect) is not greater than
0.1% by weight (1000 ppm).
or
or
Intel Desktop Board DP35DP Technical Product Specification
78
5.1.4 EMC Regulations
Desktop Board DP35DP complies with the EMC regulations stated in Table 41 when
correctly installed in a compatible host system.
Table 41. EMC Regulations
Regulation Title
FCC 47 CFR Part 15,
Subpart B
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio
Frequency Devices. (USA)
ICES-003 Issue 4
(Class B)
Interference-Causing Equipment Standard, Digital Apparatus. (Canada)
EN55022: 2006
(Class B)
Limits and methods of measurement of Radio Interference Characteristics
of Information Technology Equipment. (European Union)
EN55024:1998 Information Technology Equipment Immunity Characteristics Limits and
methods of measurement. (European Union)
EN55022:2006
(Class B)
Australian Communications Authority, Standard for Electromagnetic
Compatibility. (Australia and New Zealand)
CISPR 222005
+A1:2005 +A2:2006
(Class B)
Limits and methods of measurement of Radio Disturbance Characteristics of
Information Technology Equipment. (International)
CISPR 24: 1997
+A1:2001 +A2:2002
Information Technology Equipment Immunity Characteristics Limits and
Methods of Measurement. (International)
VCCI V-3/2007.04,
V-4/2007.04, Class B
Voluntary Control for Interference by Information Technology Equipment.
(Japan)
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79
Japanese Kanji statement translation: this is a Class B product based on the standard
of the Voluntary Control Council for Interference from Information Technology
Equipment (VCCI). If this is used near a radio or television receiver in a domestic
environment, it may cause radio interference. Install and use the equipment
according to the instruction manual.
Korean Class B statement translation: this is household equipment that is certified to
comply with EMC requirements. You may use this equipment in residential
environments and other non-residential environments.
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5.1.5 Product Certification Markings (Board Level)
Desktop Board DP35DP has the product certification markings shown in Table 42.
Table 42. Product Certification Markings
Description Mark
UL joint US/Canada Recognized Component mark. Includes adjacent UL file
number for Intel desktop boards: E210882.
FCC Declaration of Conformity logo mark for Class B equipment. Includes
Intel name and DP35DP model designation.
CE mark. Declaring compliance to European Union (EU) EMC directive and
Low Voltage directive.
Australian Communications Authority (ACA) C-tick mark. Includes adjacent
Intel supplier code number, N-232.
Japan VCCI (Voluntary Control Council for Interference) mark.
S. Korea MIC (Ministry of Information and Communication) mark. Includes
adjacent MIC certification number: CPU-DP35DP (B)
Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark.
Includes adjacent Intel company number, D33025.
Printed wiring board manufacturers recognition mark. Consists of a unique
UL recognized manufacturers logo, along with a flammability rating (solder
side).
V-0
China RoHS/Environmentally Friendly Use Period Logo: This is an
example of the symbol used on Intel Desktop Boards and associated
collateral. The color of the mark may vary depending upon the application.
The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has
been determined to be 10 years.
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81
5.2 Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be
recycled where possible. Disposal of used batteries must be in accordance with local
environmental regulations.
PRECAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les
piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des
piles usages doit respecter les rglementations locales en vigueur en matire de
protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier
br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i
overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier
br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras
enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on
mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten
mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie
darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen
Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen
des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto.
Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per
disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice
solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del
equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del
fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type
batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het
weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto.
As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias
usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, .
, , .
.
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon,
baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi
pedpisy o ivotnm prosted.
.
.
.
VIGYAZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket
lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi
elrsoknak megfelelen kell kiselejtezni.
Regulatory Compliance and Battery Disposal Information
83
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri
sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi
peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu
baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi
przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor.
Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s
respecte reglementrile locale privind protecia mediului.
.
.
, .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu.
Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus
vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo.
e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi
okoljevarstvenimi predpisi.
.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri
dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, .
, .
, .
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