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SONY_CDP-CA80ES

SONY_CDP-CA80ES

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Published by: api-19523062 on Dec 03, 2009
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03/18/2014

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CDP-CA80ES
US Model AEP Model E Model 
SERVICE MANUAL
COMPACT DISC PLAYER
MICROFILM
SPECIFICATIONS
Model Name Using Similar MechanismCDP-CA8ESCD Mechanism TypeCDM27IBase Unit NameBU-5BD25Optical Pick-up NameKSS-213B/S-N
Compact Disc Player
LaserSemiconductor laser (
λ
= 780 nm)Emission duration: continuousLaser outputMax 44.6 mW**This output is the value measured at adistance of 200 mm from the objectivelens surface on the Optical Pick-upblock with 7 mm aperture.Frequency response2 Hz to 20 kHz ± 0.3 dBSignal-to-noise ratioMore than 117 dBDynamic rangeMore the 99 dBHarmonic distortionLess than 0.0025%Channel separationMore than 110dB
Output
JackMaximumLoadtypeoutputimpedancelevelLINE OUTPhono2V
Over 10 kilohms
 jacks(at 50 kilohms)DIGITAL OUTOptical18 dBmWave length:(OPTICAL)output660 nmconnectorPHONESStereo15 mW32 ohmsphone jack
GeneralPower requirementsWhere purchasedPower requirements
USA120 V AC, 60 HzEurope220 V 230 V AC, 50/60 HzOther countries110 V – 120 V AC or 220 V – 240 V ACadjustable, 50/60 Hz
Power consumption15WDimensions (approx.)430
×
125
×
400 mm(w/h/d)(17
×
5
×
15
3
 / 
4
in.) incl. projecting partsMass (approx.)7 kg (15 lbs 7 oz)
Supplied accessories
Audio cord (2 phono plugs–2 phono plugs) (1)Remote commander (remote) (1)Sony SUM-3 (NS) batteries (2)Design and specifications are subject to change without notice.
 
 — 2 —
1.GENERAL
······································································7
2.DISASSEMBLY
2-1.Front Panel·······································································112-2.Disc Table Assy································································112-3.Back Panel and Disc Table···············································122-4.Optical Pick-up Block Assembly·····································122-5.Bracket (Gear) Assembly·················································13
3.TEST MODE
································································14
4.ELECTRICAL BLOCK CHECKING
····················17
5.DIAGRAMS
5-1.Circuit Boards Location···················································195-2.Block Diagram·································································215-3.Schematic Diagram — BD Section ·····························235-4.Printed Wiring Board — BD Section ··························255-5.Printed Wiring Board — Main Section ·······················275-6.Schematic Diagram Main Section (1/2)··················295-7.Schematic Diagram Main Section (2/2)··················315-8.Schematic Diagram HP/Function Section ··············335-9.Printed Wiring Board — HP/Function Section —···········345-10.Schematic Diagram — Display Section —······················355-11.Printed Wiring Board — Display Section —···················375-12.IC Block Diagrams···························································395-13.IC Pin Functions·······························································42
6.EXPLODED VIEWS
6-1.Front Panel and Case Section···········································466-2.Back Panel and Disc Table Section··································476-3.Chassis Section·································································486-4.Base Unit Section (BU-5BD22)·······································49
7.ELECTRICAL PARTS LIST
···································50
TABLE OF CONTENTS
PARTS No.MODEL
MODEL IDENTIFICATION — BACK PANEL —
4-998-478-0
π
4-998-478-2
π
4-998-478-4
π
4-998-478-5
π
USESPAEP
,,,,,,,,yyyyyyyy
PART NO.
 
 — 3 —
SAFETY-RELATED COMPONENT WARNING!!COMPONENTS IDENTIFIED BY MARK
!
OR DOTTED LINE WITHMARK
!
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTSLIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESECOMPONENTS WITH SONY PARTS WHOSE PART NUMBERSAPPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTSPUBLISHED BY SONY.
After correcting the original service problem, perform the followingsafety checks before releasing the set to the customer:Check the antenna terminals, metal trim, “metallized” knobs, screws,and all other exposed metal parts for AC leakage. Check leakage asdescribed below.
LEAKAGE
The AC leakage from any exposed metal part to earth ground andfrom all exposed metal parts to any exposed metal part having areturn to chassis, must not exceed 0.5 mA (500 microamperes).Leakage current can be measured by any one of three methods.1.A commercial leakage tester, such as the Simpson 229 or RCAWT-540A. Follow the manufacturers’ instructions to use theseinstruments.2.A battery-operated AC milliammeter. The Data Precision 245digital multimeter is suitable for this job.3.Measuring the voltage drop across a resistor by means of aVOM or battery-operated AC voltmeter. The “limit” indicationis 0.75 V, so analog meters must have an accurate low-voltagescale. The Simpson 250 and Sanwa SH-63Trd are examples of a passive VOM that is suitable. Nearly all battery operateddigital multimeters that have a 2V AC range are suitable. (SeeFig. A)
SAFETY CHECK-OUT
To Exposed Metal Parts on Set 0.15 
µ
1.5 k 
AC Voltmeter (0.75 V)Earth Ground Fig. A. Using an AC voltmeter to check AC leakage.
NOTES ON HANDLING THE OPTICAL PICK-UPBLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electrostaticbreakdown because of the potential difference generated by thecharged electrostatic load, etc. on clothing and the human body.During repair, pay attention to electrostatic breakdown and also usethe procedure in the printed matter which is included in the repairparts.The flexible board is easily damaged and should be handled withcare.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused onthe disc reflective surface by the objective lens in the optical pick-up block. Therefore, when checking the laser diode emission,observe from more than 30 cm away from the objective lens.
CAUTION
Use of controls or adjustments or performance of proceduresother than those specified herein may result in hazardousradiation exposure.
Notes on chip component replacement
Never reuse a disconnected chip component.Notice that the minus side of a tantalum capacitor may bedamaged by heat.
Flexible Circuit Board Repairing
Keep the temperature of soldering iron around 270˚Cduring repairing.Do not touch the soldering iron on the same conductor of thecircuit board (within 3 times).Be careful not to apply force on the conductor when solderingor unsoldering.Laser component in this product is capable of emitting radiationexceeding the limit for Class 1.This appliance is classified asa CLASS 1 LASER product.The CLASS 1 LASERPRODUCT MARKING islocated on the rear exterior.The followingcaution labelis locatedinside of theunit.

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