Assembling Carbon Nanotube Films as Thermal Interface Materials

Zhu, et al.
2007
Challenges of using CNTs as TIMs
o High temperatures that are required to grow CNTs does not allow for direct CNT
growth on electronic packaging systems
o High thermal resistance due to poor adhesion at CNT-substrate interface
o Poor adhesion also effects long-term functionality
Considerations for good thermal performance of a CNT assembly
o Using suitable metals/solders which form good thermal/electrical connection with
CNTs
Experimental
o Silicon wafers coated with SiO
2
by thermal oxidation
o E-beam evaporation to form Al
2
O
3
/Fe catalyst layers
o CNTs grown by CVD (carbon source: ethylene; carrier gases: argon and
hydrogen)
o Open-ended CNT growth conditions:
700C for 10 minutes
o CNT purity and catalyst layer were analyzed with spatially resolved energy-
dispersive X-ray spectroscopy (EDS)
CNT Transfer Technology
o Growth open-ended CNTs
o CNTs grown on silicon substrates
o Substrates to transfer to: copper substrates with stencil-printed eutectic tin-lead
paste
o Silicon-CNT substrates are flipped and placed on the Cu-Sn/Pb assembly
o Seven-zone BTU reflow process (solder reflow process?) to form
electrical/mechanical contacts; silicon chip removed
o Improved adhesion thought to be due to the open channels of the open-ended
nanotubes assist the adhesion between the nanotubes and solders due to strong
capillary forces that draw the molten solder inside the CNTs during the reflow
process
CNT-solder interfaces
o Adhesion between the CNTs and the copper substrate was tested by pulling a
section of CNTs away from the surface with tweezers
o The CNTs broke along their axis and not from the CNT-Cu interface
o Thermal measurement
CNT film height 180 m
Thermal conductivity: 81 W/(m K)
Thermal resistance: 0.43 cm
2
K/W
Affected by CNT quality and solder layer thickness
Conclusions
o Open-ended CNT arrays are fundamental for successful CNT transfer to other
substrates via solder reflow process
o Solves temperature compatibility issue for CNTs as TIMs
o Allows transfer of CNTs to other substrates that arent compatible with
temperatures needed to grow CNTs