Mel i ssa

Peacock
Summer 2013
CARBON NANOTUBE
FILM TIMS
Baratunde A. Col a (2010)
CNT Array TIMs
Silicon, silicon carbide, copper, aluminum
Interface structures
One-sided
Limiting thermal resistance value: 0.1 mm
2
K/W (0.001 cm
2
K/W)
Two-sided
Foil

CARBON NANOTUBE ARRAY TIMS
0.07 cm
2
K/W
0.04 cm
2
K/W
0.08 cm
2
K/W
Why?
Removable
Compliant
Growth on temperature compatible material
Performance i ssues/factors
CNT quality/alignment
CNT density
Thermal resistance of CNT free ends
Thermal resistance at CNT-substrate interface




CNT FOIL TIMS
CNT TRANSFER TECHNOLOGY
Zhu et al . (2007)

CNT TRANSFER TECHNOLOGY
Adhesi on strength tested
Thermal measurements
CNT film height 180 m
Thermal conductivity: 81 W/(m-K)
Thermal resistance: 0.43 cm
2
K/W

CNT-SOLDER INTERFACES RESULTS
Barako et al . (2012)
Two di f ferent metal bi nder
l ayers i nvestigated
Indium thin film binder
A commercial Al/Ni film
(Nanofoil)

SOLDER-BONDED CNT TIMS

Indi um bondi ng
CNT-In-FS
Thermal boundary resistance (bonded): 0.28-0.71 cm
2
K/W
Unbonded versus bonded interface (100 kPa):
From 10 cm
2
K/W to 0.5 cm
2
K/W

THERMAL RESISTANCES
Nanofoi l bondi ng
CNT-NF-FS
Unbonded thermal boundary resistance: 10 cm
2
K/W
Bonded thermal boundary resistance: 0.15-0.5 cm
2
K/W

Anal yze performance based on design metri cs
Col l aborate wi th Charl es El l i s about assembly process
Conti nue pursuing fabrication on ni ckel foi l
FUTURE WORK