Omniscan Techniques For Crack Sizing

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OmniScan MX Phased Array

Techniques for Crack Sizing

ID Creeping Wave, Shear-Wave Tip Diffraction and High Angle
Refracted Longitudinal Wave Technique (HALT)

Chris Magruder
Olympus NDT 281 922 9300
12559 Gulf Fwy chris.magruder@olympusndt.com
Houston, TX 77034 www.rd-tech.com

Chris Magruder Technical Support - Olympus NDT
Page 2

Table of Contents
Overview...................................................................................................................................................3
Equipment Used.......................................................................................................................................4
OmniScan Setup for ID Creeping Wave and High-Angle L-wave Sectorial Scan ............................5
The Basics .................................................................................................................................................6
5570-Degree Refracted Longitudinal Sectorial Scan..........................................................................7
ID Creeping WaveCollateral Echo 1 (CE1) Wave Physics ..............................................................9
ID Creeping WaveCollateral Echo 2 (CE2) Wave Physics ............................................................10
OmniScan ID Creeping Wave Calibration..........................................................................................11
OmniScan ID Creeping Wave Calibration (CE1 and CE2) ..............................................................12
OmniScan Setup for Shear-Wave Tip Diffraction for Crack Sizing ................................................14
Shear-Wave Wedge-Delay (TOF or Zero Offset) Calibration for Tip Diffraction .........................16
Shear-Wave Sensitivity (ACG) Calibration ........................................................................................17
Shear-Wave TCG/DAC Calibration....................................................................................................18
Crack-Sizing Technique Evaluation Procedure (ID Creeper, HALT, and Tip Diffraction).......19
Example of Deep ID-Connected Crack 85 % Through-Wall Dimension......................................24
Example of Shallow ID-Connected Crack 33 % Through-Wall Dimension.................................27
OmniScan MX PA 16:128 vs. 32:128 Power of the Pulsers ..........................................................30
Conclusion ..............................................................................................................................................31
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Overview
The objective of this project is to demonstrate the benefits of the OmniScan MX Phased Array
instrument in crack-sizing accuracy using the following crack-sizing techniques.

ID Creeping Wave (30-70-70)
High Angle L-Wave Technique (HALT)
Shear-Wave Tip Diffraction

Although these inspections have been performed for many years using conventional single-channel
ultrasonic flaw detectors, the results and accuracy are dependent on the skill and experience level of
the inspector. The advantage of the phased array technique is that it allows an inspector to perform
these same techniques with much greater accuracy and less dependency on the skill of the operator.

In fact, several of the techniques are combined together using refracted longitudinal sectorial scans
and shear-wave sectorial scans. Where conventional single-channel UT requires separate probes
and independent calibrations, the phased array sectorial scans combine several of these techniques
and allow them to be performed and analyzed simultaneously.

Although the sizing techniques are explained step by step, this report assumes the operator is
capable of performing basic calibration and setup functions for the sectorial scans including focal law
wizard, wedge delay, sensitivity, TCG/DAC calibrations, etc. These functions are described in the
report but for detailed step-by-step procedures consult the OmniScan PA software manual for version
1.4.

Normally welds requiring a high level of sizing accuracy are left in the As welded condition during
construction. To use this technique the probe must be capable of moving over the flaw sufficiently to
perform the echo-dynamic measurement of CE1 and to optimize a tip signal using a high-angle
L-wave. This technique usually requires flat-topping the weld.

All cracks documented in this report are in carbon-steel materials 25.4 mm (1 inch) thick. Different
material types and thickness ranges require phased array probes of different frequencies, element
pitch, and aperture for optimized results. Consult the Olympus Phased Array Probe catalog for more
details.

With the use of an OmniScan probe-splitter adapter, both the ID creeping wave and shear-wave
sectorial scan probes can be used simultaneously and do not require switching between setup files,
changing probes, or rebooting the OmniScan. This greatly aids the speed and improves
characterization as all inspection methods are available in real-time to the operator.

The calibration blocks and crack samples used for this project were designed and provided by the
Davis NDE Advanced UT Crack Sizing Program and are of similar design to those used in the
EPRI IGSCC training program.

Special thanks to Mark Davis for his assistance and support on this project.

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Equipment Used

Olympus OmniScan PA MX 16:128 Phased Array Acquisition System
Olympus OmniScan PA MX 32:128 Phased Array Acquisition System
Olympus OmniScan Software version 1.4 (Mult-ichannel option enabled)
Olympus 5L64 Phased Array Probe (5 MHz, 0.6 mm element pitch, 64 elements)
Olympus 5L16 Phased Array Probe (5 MHz, 0.6 mm element pitch, 16 elements)
Olympus SA2N55S Phased Array Wedge
Olympus SA2N60L Phased Array Wedge
Olympus SA1N60L Phased Array Wedge
Olympus SA1N60S Phased Array Wedge
Olympus Probe Splitter AAUX202A (allows two PA probes on OmniScan MX PA)

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OmniScan Setup for ID Creeping Wave and High-Angle L-wave Sectorial Scan

The OmniScan set up for the ID creeping wave requires configuring a refracted longitudinal (RL)
sectorial scan from 55 degrees to 70 degrees at a one-degree resolution. Smaller resolutions do not
significantly improve the sizing accuracy or improve the resolution for this application.

12 mm to 25 mm thickness range in carbon and stainless steels
For the 32:128 OmniScan, use the 5L64 probe and the SA2N60L wedge.
For the 16:128 OmniScan, use the 5L16 probe and the SA1N60L wedge.

All cracks documented in this report are in 25.4 mm (1 inch) thick material. Different material types
and thickness ranges require phased array probes of different frequencies, element pitch, and
aperture for optimized results. Consult the Olympus Phased Array Probe catalog for more details.

The beam is focused at approximately to the thickness of the material. There are comments later
in this report describing under what conditions it is beneficial to refocus the beam at a different depth
once the crack is determined to extend to the upper third, middle third, or lower third of the material
volume. This requires recalibrating the wedge delay and will be addressed later.

In the UT -> Advanced -> Points parameter, change the default value of 340 to 640. This will
optimize the resolution on the A-scan display and assist the operator in determining peaks, tips,
facets, etc. The maximum point quantity available for any A-scan is 999 points.

In the Display -> Rulers -> UT Unit, change the default value of True Depth to Half Path. This
application is extremely difficult to complete when working in true-depth mode and the benefits of the
uncorrected displays are explained in the CE1 echo-dynamics calibration and flaw-interpretation
sections of this report.

Using the calibration wizards, perform wedge delay and sensitivity calibration on any 1.52 mm side-
drilled hole at the approximate depth of the material. This step is critical and accurate results are only
possible when using a calibrated sectorial scan. The focal law calculator will not provide the accuracy
required without fine-tuning the wedge delay and equalizing the sensitivity of the RL sectorial scan.

The TCG/DAC is not required for the RL sectorial-scan channel. The TCG/DAC is only required on
the shear-wave sectorial- and linear-scan channels and is critical on these channels for accurate
results.

The RL sectorial scan is used only for depth and height measurements and requires adjusting the
gain on the relative focal law for each flaw. This component of this sizing technique does not require
amplitude calibration beyond ACG calibration on one side-drilled hole in the range of the material
thickness.

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The Basics
Any RL (refracted longitudinal) beam in the range of 55 degrees to 75 degrees produces the CE1 and
CE2 shear wave components at slightly different angles, signal/noise, and velocities. The
conventional ID Creeping Wave UT technique primarily uses the 70-degree refracted L-wave. The
phased array technique allows us to see several aspects of the crack by visualizing all the RL angles
between 55 and 70 degrees and provides a CE1 and CE2 component on each of these angles as
well. This provides an advantage over the conventional UT because the crack can be seen in several
aspects from the same probe position. It also makes it easier to differentiate CE1 and CE2 from
geometric reflectors and other signals present on the A-scan and sectorial scan. These are described
in detail in the ID Creeping-Wave section of this report.

The four basic components of the phased array ID Creeping-Wave Sizing Technique
L-wave signal from the crack tip
L-wave signal from the crack base
Collateral Echo 1 (CE1 30-70-70 signal)
Collateral Echo 2 (CE2 ID Creeper)

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5570-Degree Refracted Longitudinal Sectorial Scan
Two of the four relative signals required in this application are direct longitudinal signals from the
base and the tip of the crack. The tip of the crack will always be at a higher angle or focal law than the
base. With the phased array sectorial scan, these two signals can be seen at the same time from the
same probe position and optimized by moving the probe forward and backward perpendicular to the
crack.

For the purposes of this application, all direct L-waves are analyzed in the first leg of the inspection.
In general, RL angle beams are limited to the first leg and lose most of their energy when striking any
surface making skipping impractical.

Identifying the deepest ligament or crack tip from the high angle L-wave is the most critical part of this
technique. Extreme care should be taken to ensure that you are analyzing a true tip and not a facet or
branch of a larger flaw.

All measurements taken from the L-wave signals are based on peaked signals. Use of the envelope
feature in the OmniScan is essential when performing through-wall measurements on phased array
crack tips. This is critical. Only use peaked signals for tip measurements.

Properly peaked signal in green gate with A-scan envelope measuring crack tip at 13.97 mm.

The operator must familiarize himself or herself with both the A-scan of a single focal law, and the
corrected or uncorrected sectorial-scan image when performing analysis of the L-waves to benefit
from the phased array technique. All the information from an individual A-scan or focal law is present
in the sectorial scan but has been color-coded based on amplitude. In other words, with a little
practice, by looking at a sectorial scan, the operator should be able to visualize each A-scan without
the A-scan display.

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Below is the 5570 degree sectorial scan visualizing the tip and base of the crack on different focal
laws from the same probe position. The spatial separation between the tip and base of the crack in
the uncorrected sectorial scan below is the through-wall dimension of the crack. This is also the same
basic technique as the AATT (Absolute Arrival Time Technique) but instead of using one angle from
different probe positions, the phased array allows both the base and tip to be seen at the same time
from different focal laws or angles.

The signal in the green gate on the A-scan is peaked and measured using the BD (green gate)
reading and is the through-wall dimension of the crack (in this case 13.17 mm or 46 % through-wall
dimension).

Volume corrected 5570-degree RL sectorial scan visualizing tip of crack at 21.38 mm and
base of crack at 24.87 mm. In this case the crack is 21.38 mm or 9 % through-wall dimension.

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ID Creeping WaveCollateral Echo 1 (CE1) Wave Physics
The CE1 signal is usually referred to as the 30-70-70 signal. The CE1 is produced when the direct
shear wave strikes the ID at a critical angle and the mode converts to a 70-degree longitudinal wave.
This mode-converted L-wave strikes the face of a shallow to mid-wall crack and reflects a 70-degree
refracted longitudinal-wave signal back to the probe receiver.

With any RL beam, an associated direct shear-wave signal of approximately 30 degrees is also
produced. This shear-wave beam is called Collateral Echo 1 (CE1). The main purpose of CE1 is to
move the probe across the flaw and measure the echo-dynamics or signal-walk distance to provide
an approximation of the through-wall dimension of the flaw (20%, 40%, 60%, or 80%). This is done on
the 70-, 60-, and 55-degree focal laws for all calibration notches and a chart is developed to use for
comparison against the echo-dynamic measurement of the crack. The deeper the crack, the more
echo-dynamic or signal-walk distance on the A-scan.

Echo-dynamic measurements of the CE1 signal are performed on the 70-degree focal law for the
20%, 40%, 60%, and 80% calibration notches. A benefit of the phased array technique is that a
relationship to the calibration notches can also be trended using the 55- and 60-degree focal laws (or
any other focal laws in the RL sectorial scan).

In other words, based on the amount of echo-dynamic travel or walk that a flaw produces on CE1,
an estimation of crack depth can be made when comparing this information to the echo-dynamic
chart created using the 20%, 40%, 60%, and 80% calibration notches.

Echo-dynamic measurement of a 40 % through-wall crack. The U(r-m) displays the delta
between the measure and reference cursor on the ultrasound axis where the signal rises and
falls below 20 % threshold of gate A (red gate).
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ID Creeping WaveCollateral Echo 2 (CE2) Wave Physics

The IDCR (Inside-Diameter Creeping Wave) is produced using a high-angle refracted longitudinal
wave in the range of approximately 5570 degrees.

In addition to the CE1 signal, an OD Creeping Wave at an angle slightly above the 70-degree L-wave
releases another indirect shear-wave component at approximately 31.5 degrees. This angle changes
slightly for focal laws below 70 degrees. This indirect shear wave strikes the ID surface and the mode
converts to a longitudinal wave that moves or creeps along the ID surface towards the base of the
crack. This signal is called Collateral Echo 2 (CE2). Presence of CE2 on a crack confirms that the
crack is propagating or connected to the inside diameter. An embedded mid-wall crack or OD-
connected crack will have no CE2 component as the ID creeper passes under the flaw.

The CE2 signal is a short-lived energy that travels along the ID surface to detect the base of an ID-
connected flaw. CE2 has a very short echo-dynamic pattern and is extremely sensitive to very
shallow cracks. A low amplitude signal at a signal-to-noise ratio of 3 or 4 to 1 is normal for analysis on
CE2. Again, the presence of this signal confirms that the flaw is propagating from the ID. The
absence of this signal indicates that the flaw is not ID connected. No other analysis on CE2 is
required.

The CE2 signal will pass over most counter-bore configurations and geometric reflectors on the ID
surface. Inadequate penetration and pipe-to-pipe mismatch will also produce a large amplitude CE2
signal and care should be taken not to confuse these conditions with the base of a crack.

The primary purpose of CE2 is to confirm that the crack is ID-connected. The only analysis required is
the confirmation that CE2 is present or absent at any amplitude.

Another difference in the phased array technique is that the CE1 signal is found to be much stronger
than the CE2 across all focal laws in the RL sectorial scan. In conventional UT, the CE2 or ID creeper
usually has a much higher amplitude regardless of the cracks through-wall dimension.

Confirmation of ID-connected crack
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OmniScan ID Creeping Wave Calibration

This calibration block for this sizing technique is made from the same material and thickness as the
cracked specimens. Through wall notches at 80 %, 60 %, 40 %, and 20% are cut into the material
with sufficient distance between them to ensure the 5570-degree RL sectorial scan can visualize the
base and tip of each notch without interference from the corners or adjacent notches.

A larger calibration block, to include notches at 90%, 80%, 70%, etc., can produce more accurate
echo-dynamic curves but are generally not necessary for 5 % through-wall accuracy in material
thicknesses up to 25.4 mm.

ID Creeping Wave 25.4 mm Calibration Block designed by Mark Davis, Inc.

The 60 % and 40 % notches are on the other side of the calibration block.

The L-wave tip signal should be 0.003 inch on each of the four calibration target tips. The L-wave
base signal should be 25.4 mm on the base of each notch. The CE1 echo-dynamic is measured and
recorded on all notches. CE2 is present at varying amplitudes on all reflectors as they all represent
ID-connected targets.

All readings and measurements should be taken from the digital readings available on the top of the
OmniScan display. These measurements are most commonly the result of the highest amplitude or
shortest time of flight of the signal in the gate. Gate positions are constantly adjusted throughout the
procedure to isolate signals for measurement. Do not read measurements directly off of the rulers in
the A-scan and S-scan displays as this will not allow the accuracy that justifies this technique.

80%
20%
60%
40%
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OmniScan ID Creeping Wave Calibration (CE1 and CE2)

The calibration for this technique requires that the 5570 RL sectorial scan L-waves have a calibrated
wedge delay or time of flight with a precision of 0.003 in. All focal laws must also have been
calibrated for ACG on one side-drilled hole at the approximate target depth (usually within 75 % to
125 % of the material thickness). TCG or DAC for the ID creeper and L-waves is not required as it is
for the shear-wave tip diffraction.

The IDCR or CE2 does not require any calibration. You should note the amplitude of the CE2 signal
during calibration but it will be present on all calibration targets and its amplitude is not a critical
parameter. Only its presence or absence is relevant in determining if the flaw is ID-connected.

Calibrating CE1 requires building an echo-dynamic chart for comparison to the echo dynamic of the
flaw. CE1 measurements and analysis are performed on the 70-degree focal law only.

1. Select the 70-degree focal law and place the probe on the 40 % calibration notch and optimize
the CE1 signal by moving the probe toward and away from the notch while observing the A-
scan envelope. With CE1 peaked, adjust the gain so that CE1 is at 100 % screen-height. This
will be the CE1 reference sensitivity for all echo-dynamic measurements on the other
remaining calibration notches and on the crack. For the examples listed in this report the
reference sensitivity measured on the 40 % notch is 10 dB.

At the reference sensitivity, CE1 will be the largest amplitude signal on the screen and easily
distinguished from CE2, both tip and base L-wave signals, and geometric reflectors.

2. Set the red gate A threshold to 20 % and ensure that it is long enough to capture the entire
echo- dynamic measurement from where the signal rises above 20 %, peaks, and falls back
below 20 % as the probe is moved over the calibration notch.

3. Display the Um-r reading and position the Ultrasound measure and reference cursors where
the envelope signal breaks the gate on the rise and fall points of the echo dynamic. Record the
Um-r measurement and repeat on the 20 %, 60 %, and 80 % notches.

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4. Repeat the process for every calibration notch. Record the echo-dynamic measurements on all
4 calibration notches using the 70-degree focal law as in the chart below.

CE1 Echo-dynamic measurements for 25.4 mm calibration block
80 % 60 % 40 % 20 %
70 degree 34.7 mm 32 mm 25.4 mm 0 mm

5. At this point the calibration for the 5570-degree RL sectorial scan is complete and includes
calibrated time of flight for the L-waves, a CE1 echo-dynamic chart for comparison against the
flaw data, and a CE2 signal-present confirmation from every calibration notch.

For thicker components it may be beneficial to build the above chart on CE1 signals using the
55, 60, and 60 degree focal laws. For materials under 25.4 mm, the separation in these echo-
dynamic measurements is not significant and does not provide useful information.
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OmniScan Setup for Shear-Wave Tip Diffraction for Crack Sizing

The shear-wave sectorial-scan channel compliments the RL sectorial scan in several ways. One way
is that it helps characterize the flaw and identify conditions that can make the ID creeping wave
mislead the inspector. Complex root geometry, sharp or steep counter bore in the weld bevel, pipe or
plate mismatch, etc. can be easily sorted out with an understanding of the sectorial scan. In addition,
stacked flaws, embedded cracks, pre-service defects, and other types of flaws all have a specific
signature in the phased array sectorial scan that can help the operator in determining flaw type and
through-wall dimension.

Shear-wave tip diffraction alone will not provide the same level of sizing accuracy except in shallow
flaws. In mid-wall flaws and deep flaws, shear- wave tip diffraction in this application is approximately
2 mm.

In addition to the 4570-degree shear-wave sectorial scan, linear scans can be programmed and
calibrated to aid in characterization and sizing tip diffraction.

A complete 4-channel setup to cover most phased array applications includes the following channels:

Group 1 Sectorial Scan 4570-degree shear wave (full volume)
Group 2 Linear Scan 70-degree shear wave (lower of weld)
Group 3 Linear Scan 60-degree shear wave (full volume)
Group 4 Linear Scan 52-degree shear wave (upper of weld)

Up to 8 channels can be programmed on an OmniScan MX PA and three channels can be displayed
simultaneously. The preferred inspection method is to display only the sectorial scan for detection
and switch between linear-scan channels to optimize and characterize defects.

The primary OmniScan display view for this application is the S-scan and A-scan.
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Use of the OmniScan Y adapter AAUX202A allows multiple probes to be connected and active on the
same setup file or inspection. This permits both the longitudinal-wave sectorial-scan probe/wedge
and shear-wave probe/wedge to be used simultaneously for both manual and automated
applications.

Without the use of the multiple-probe adapters, the longitudinal- and shear-wave channels must be
on separate setup files and the probe/wedge changed in between techniques.

Shear-Wave Tip Diffraction signal on 61-degree focal law of 4570-degree sector scan.
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Shear-Wave Wedge-Delay (TOF or Zero Offset) Calibration for Tip Diffraction

As with the basic calibration rules of any code, every focal law or A-scan within the 4570-degree
sectorial scan must meet the same criteria as a single-channel conventional flaw detector for linearity,
sensitivity, wedge delay, or time of flight. It must be capable of an independent DAC/TCG on each
focal law to cover the inspection range.

For the 32:128 OmniScan, use the 5L64 probe and the SA2N55S wedge.
For the 16:128 OmniScan, use the 5L16 probe and the SA1N60S wedge.

The use of wizards in the OmniScan software allows these functions to be performed simultaneously
on all the focal laws within a channel or group. Again, the end result of these calibrations is that each
component or focal law is the direct equivalent of a single-channel conventional A-scan for linearity,
sensitivity, time of flight, and TCG/DAC.

If you do not calibrate this channel for wedge delay, sensitivity, and a TCG/DAC, you will not be able
to achieve the flaw-sizing accuracy and defect characterization that is detailed in this report. All
measurements on side-drilled holes used for wedge-delay calibration (time of flight or zero offset)
should have an accuracy of 0.003 in. or .100 mm. This is critical to achieving 1-mm sizing accuracy
in this thickness range.

Wedge delay or zero offset is calibrated using the OmniScan calibration wizard and an IIW block or
any side-drilled hole at a known depth in the range of the material thickness.

A side-drilled hole allows for calibrating wedge delay on all focal laws simultaneously. As the probe is
moved over the side-drilled hole, the 4570-degree beams are exposed to the hole and an
independent beam offset is calculated for each focal law. As the A-scan tracks the hole in the gated
area, the depth of each focal law is available in the DA reading window. In other words, every angle
from 4570-degrees in one-degree increments is calibrated on a side-drilled hole and an independent
wedge lay in s is saved in the software.

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Shear-Wave Sensitivity (ACG) Calibration
Sensitivity or ACG (Angle-Corrected Gain) is calibrated using the OmniScan calibration wizard and a
side-drilled hole at a known depth. Typical ACG calibration is done using 1.5- or 2 mm- side- drilled
holes such as 2 mm hole found at 15 mm from the surface on IIW block or similar block with multiple
side drilled holes at different depths covering the thickness range of the material.

As the probe is moved over the side-drilled hole, the 4570-degree beams (at one-degree
increments) of the focal laws are exposed to the hole and a curve is created that displays the
amplitude of the hole on each focal law. An independent gain offset is calculated and added to the
hardware gain.

The end result of this calibration is that focal laws 4570 will detect the hole with amplitude of 80 %.
Without an independent focal-law gain, it would be impossible to set the correct sensitivity for each
angle of inspection. One side of the array would be too sensitive and the other side not sensitive
enough.

Sectorial-scan curve prior to calibration.

Sectorial-scan curve equalized after calibration. An independent gain offset is calculated and
added to the UT gain so that all focal laws detect the side-drilled hole at 80 % amplitude.

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Shear-Wave TCG/DAC Calibration
Continuing the same process over a series of side-drilled holes or ID/OD notches creates a
DAC/TCG (Distance-amplitude correction and time-corrected gain).

This corrects calibration reflectors at different depths or sound paths so they are all detected at 80 %
amplitude.

As the probe is moved exposing all focal laws to the calibration reflectors, the calibration wizard, in
the OmniScan, stores an independent gain offset for every A-scan at every TCG/DAC point.

The end result of the sensitivity, wedge delay, and TCG calibrations is that the side-drilled holes or
notches at different metal paths can be detected at the same amplitude and correct time of flight.

Every A-scan on every channel has to be the equivalent of a single-channel conventional flaw
detector. To do this quickly and accurately requires using the software tools and a familiarity with the
OmniScan user interface.

Page 19
Crack-Sizing Technique Evaluation Procedure (ID Creeper, HALT, and Tip
Diffraction)

1. Select the ID creeping-wave channel and add 6 dB to the reference sensitivity. Display the S-
scan and A-scan view and select the 70-degree focal law to be displayed on the A-scan. Do
not use the Smart A-scan (Highest %) feature for this application.

2. Move the probe towards and away from the flaw until CE1 is peaked and observe the
presence and/or absence of CE2 and the crack base and tip L-wave signals in the uncorrected
sectorial scan. Move the probe side to side, on and off of the flaw to distinguish geometric
reflectors on the ID surface from CE1, CE2, and the base and tip L-wave signals.

3. With the gain at +6 dB above reference sensitivity, record the presence or absence of CE2.
The presence of CE2 indicates that the crack is connected to the ID. The absence of CE2
indicates that the crack is not connected to the ID. This assists the inspector in determining if
the flaw is embedded, stacked, etc.

4. Lower the gain-to-reference sensitivity. The A-scan should still display the 70L focal law. At
reference sensitivity, CE1 should be the highest amplitude signal on the A-scan at over 100 %
amplitude. This is true even on shallow cracks. This is different from the conventional UT
technique where CE2 usually has much higher amplitude than CE1.
CE2 present at +6 dB
over reference
sensitivity.

Confirms crack is ID-
connected.
Page 20

5. Using the envelope feature on the 70-degree A-scan, record the echo-dynamic travel of CE1
by moving the probe forward over the flaw until the envelope signal rises, peaks, and falls back
below 20 % amplitude threshold in gate A (red gate).

6. In the 70-degree A-scan display, place the Amplitude Reference cursor (red cursor) at the
point where the envelope signal rises through gate A at 20 %.

7. In the 70-degree A-scan display, place the Amplitude Measure cursor (green cursor) at the
point where the envelope signal falls through gate A at 20 %.

8. In the Readings menu, display the U(r-m) reading and record the value. This is the echo
dynamic of the flaw. Compare this with the echo-dynamic chart that was created with the
calibration block. Based on the reading, an estimation of the crack depth is now possible. You
should be able to determine if this is a shallow, mid-wall, or deep-crack. In the example above
the echo dynamic is 29.32 mm, therefore between a 4060 % through-wall dimension is
suspected. This information would correlate to a crack depth from between 1015 mm from the
surface. Stacked flaws or embedded flaws in the same thickness range do not have echo-
dynamic measurements supporting an ID-connected crack.

CE1 Echo-dynamic measurements for 25.4 mm calibration block
80 % 60 % 40 % 20 %
70 degree 34.7 mm 32 mm 25.4 mm 0 mm

9. Repeat this process on the 55-, 60-, and 65-degree focal laws if the measurements have been
recorded on the calibration block. On material 25 mm and thinner, this is not necessary or
CE1 at reference
displaying echo
dynamic of 70L focal
law over the crack.
Page 21
useful as the echo-dynamic curves between these angles are very similar and do not provide
significantly different data. On thicker samples the echo dynamics between these angles will
be greater and comparison to the calibration block on these additional angles will help quantify
the depth of the crack prior to searching for the tip signal.

10. Using the envelope feature on the 70-degree A-scan, move the probe towards and away from
the crack to the position where CE1 is peaked.

11. With CE1 peaked, hold the probe perfectly still and add 18 dB to the reference sensitivity.
DONT MOVE THE PROBE. From the probe position where CE1 is peaked, both the crack tip
(6570 degree focal law) and the crack base (5565-degree focal law) are visible in the
uncorrected sectorial scan. The tip always appears on a higher focal law in the uncorrected
sectorial scan than the base or corner-trap signal. The spatial separation between these two
signals in True Depth is the equivalent sizing technique as the Absolute Arrival Time or AATT.

12. CE1 peaks when it is skipping into the face of the crack on the second skip. This means that
the probability that CE1 has a center beam directly in the middle of the flaw is high. From this
position it is natural that the lower angle 55-60 degree focal laws will be aimed at the crack
base or corner trap and the 6070-degree focal laws will be aimed toward the crack tip.

13. For material thicknesses too large for the base and tip to be seen simultaneously, a connected
planer crack will be detected and visible at varying amplitude and time of flight on all focal
laws.

At ref +18 dB both the
crack base and tip are
easily detected.

CE1 is also the highest
amplitude signal on the
display.
The tip will require
peaking and
optimization and at
this point the signal
is for reference only.
Do not assume this
is the true depth yet.

Page 22
14. Slowly and carefully move the probe in and out from the weld, observing the L-wave signal
from the tip of the crack. Observe the tip signal walking in and out of the low-level noise that is
present. Observe the A-scan and sectorial scan and pay attention to the spatial separation
between the base signal and the tip signal.

15. Adjust the gain so you are evaluating the tip signal above 30 % amplitude with at least 2 or 3 to
1 signal-to-noise ratio. It is not unusual for the tip signal to decrease in amplitude and then
increase in amplitude as the beams are exposed to different aspects and ligaments of the
crack.

Your ability to size cracks accurately in this application depends on your ability to identify and
peak the tips and separate them from base material and wedge noise. Extreme care should be
taken to differentiate low-level noise, wedge echoes, and base-material responses from a
small amplitude crack-tip signal that is walking in the A-scan. Once you believe you have
identified the deepest tip or facet of the crack, rapidly move the probe forward and backward
and observe the tip walking on the A-scan. The noise, low-level base-metal indications, and
standing waves will remain at the same time of flight and the crack tip will walk forward and
backward through them. This phenomenon can only be visualized dynamically while the probe
is moving.

16. After confirming that you have identified the tip, place gate B (green gate) over the peaked-tip
signal and record the BD reading. This is the true-depth value of the crack tip (13.17 mm or
48 % through-wall dimension).

Do not take
measurements off
the ruler bars. Use
the DB or DA
reading and
position the gate
over the tip signal.
Tip signal peaked in
green gate B.

This is the crack depth or
Page 23
17. Everything beyond this point is for secondary confirmation and to ensure that the flaw is a
single-connected crack and not a stacked flaw, or an embedded flaw on top of a geometric
reflector from the ID such as mismatch, counter bore, root concavity, or excessive root
reinforcement.

18. Switch channels to the shear-wave sectorial scan and place the reference cursor (red cursor)
on the ultrasound axis in the sectorial scan at the depth of the signal recorded from the L-wave
tip. This is the position that you have determined as the maximum through-wall dimension and
the sectorial scan will ensure that no other tip signals can be detected above the reference
cursor on the ultrasound axis of the sectorial scan.

4570-degree sectorial scan detecting deepest crack tip at 61 degrees. Notice multiple
branches and ligaments visible in the A-scan and S-scan.

19. Repeat this process on both sides of the weld and repeat using the linear-scan channels as
further confirmation. If the flaw tip is best detected on the 61-degree focal law of the sectorial
scan it is natural that the 60-degree linear scan will provide a dynamic side view with optimum-
flaw orientation to the beam.

At this point the technique has provided over 5 levels of characterization/detection/sizing that should
all support each other. No other single factor should be weighted more heavily than the High Angle L-
wave on the crack tip in step 16.
Move the probe back and
forth and side to side to
ensure no tip signals are
detected above the depth of
the recorded L-wave sector
scan in step 16 above.

It is normal if shear-wave tips
are only detected within
several mm beneath the
recorded L-wave depth.

The linear 55-degree
channel detecting the
same crack tip at the
same depth as the
sectorial scan.

Page 24
Example of Deep ID-Connected Crack 85 % Through-Wall Dimension

CE1 Echo dynamic at reference sensitivity = 31.94 mm (Suspect 70-90 % through-wall
dimension)

+18 dB CE2 present (ID connected) L-wave crack tip and crack base detected.

Page 25
L-wave peaked on tip of crack (green gate) and L-wave base signal present (red gate). Crack
depth = 3.58 mm or 86 % through-wall dimension.

Shear-wave tip diffraction prove up using 4570-degree sectorial scan.

Page 26
Shear-wave tip diffraction prove up using 55-degree linear scan. Easily characterized as one
continuous crack and not stacked defects or embedded flaw on top of geometric reflector.

Shear-wave tip diffraction prove up using 65-degree linear scan.

Page 27
Example of Shallow ID-Connected Crack 33 % Through-Wall Dimension

CE1 echo dynamic at reference sensitivity = 19.77 mm (30-40% through-wall dimension)

+18 dB CE2 present (ID connected) L-wave crack tip and crack base present

Page 28
L-wave peaked on crack tip and L-wave base signal present. Crack depth = 17.02 mm or 33%

Shear-wave tip diffraction prove up using 4570-degree sectorial scan.

Page 29
Shear-wave tip diffraction prove up using 55-degree linear scan.

Shear-wave tip diffraction prove up using 55-degree linear scan from opposite side of crack.

Page 30
OmniScan MX PA 16:128 vs. 32:128 Power of the Pulsers
In both 55-degree longitudinal A-scan displays below, the signal in the red gate A is the same crack
tip peaked at 14 mm in depth and 23 mm in sound path. The sensitivity on both A-scans is adjusted
to 80 % amplitude to compare signal-to-noise ratio and crack-tip signal characterization. The 16-
pulser A-scan requires an additional 8.4 dB to bring the crack tip to 80% amplitude. The 32-pulser
instrument with approximately the same aperture (within 3 mm) allows a much clearer tip signal and
higher signal-to-noise ratio for improved sizing accuracy. The 32-pulser instrument can focus twice
the energy at the selected focal depth as the 16-pulser version of this application resulting in more
efficient beam steering and clearer tips that are easier to identify.

Increasing the number of elements or pulsers for a given aperture is even more beneficial when
performing this technique on austenitic materials and welds, inconel cladded components and
dissimilar metal welds.

In the 16-pulser A-scan displays below, the multiple signals and higher noise make it more difficult to
correctly identify and peak the true-tip signal of the crack. These multiple signals can confuse the
inspector. It would be a common mistake to confuse the small signal identified by the green arrow
with the true peaked-tip signal identified by the blue arrows.

5 MHz 32 elements .6 mm pitch probe = 19 mm aperture (OmniScan MX PA 32:128)

5 MHz 16 elements 1 mm pitch probe = 16 mm aperture (OmniScan MX PA 16:128)

Page 31
Conclusion

The benefits of the phased array technology are enormous for reducing the dependency on the skill
of the inspector and increasing the accuracy in crack sizing, defect characterization, and recognizing
geometric conditions that can confuse the operator and result in inaccurate inspection results.

Combining the ID creeping wave, high angle L-waves, and shear-wave tip diffraction on 2-4 sectorial-
scan and linear-scan channels, this technique provides over 5 levels of crack-depth verification that
should all support each other.

In addition to ID-connected cracks, these techniques are also useful in the detection, characterization,
and sizing of embedded and surface-connected flaws as well. Within this procedure there are
components of many typical phased array applications for pre-service construction and in-service
inspection techniques.

These applications can by automated with the use of semi-mechanized one-line encoded scanners,
and/or computer based full mechanized bi-directional scanners using the same OmniScan
instrument. Use of encoders, acquisition of bi-directional data, and the ability to perform analysis
using off-line computer software greatly enhances the inspection results and documentation capability
of all phased array and conventional UT applications.

Training for this application is available through the Davis NDE Advanced UT Crack Sizing
Training Program.

Information for this course and other phased array training courses is available at:
http://www.olympusndt.com/en/training-academy/

Please forward questions and comments regarding this inspection technique to
Chris.magruder@olympusndt.com or mkdavis@mindspring.com

The old way The new way

Omniscan Techniques For Crack Sizing

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