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Seminar Report ‘08

Seminar Report ‘08

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Published by: Mounikac on Mar 09, 2010
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05/12/2014

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3
- D ICsSeminar Report
08
ABSTRACT
The unprecedented growth of the computer and the Informationtechnology industry is demanding Very Large Scale Integrated (VLSI) circuitswith increasing functionality and performance at minimum cost and powedissipation. VLSI circuits are being aggressively scaled to meet this Demand,which in turn has some serious problems for the semiconductor industry.Additionally heterogeneous integration of different technologies in onesingle chip (SoC) is becoming increasingly desirable, for which planar (2-D) ICsmay not be suitable.3-D ICs are an attractive chip architecture that can alleviate theinterconnect related problems such as delay and power dissipation and can alsofacilitate integration of heterogeneous technologies in one chip (SoC). Themulti-layer chip industry opens up a whole new world of design. With theIntroduction of 3-D ICs, the world of chips may never look the same again.
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- D ICsSeminar Report
08
 
INDEX
 
1. Introduction
 1.1. Limitaions of 2D ICs
2.
 
Motivation for 3-D ICs
 2.1. Interconnect limited VLSI2.2. Physical limitations of copper interconnects2.3. SoC design
3. Architecture of 3D IC
 3.1. Heterogeneous3.2. Advantages of 3D architecture
4. Scope of this study5. 3-D IC technology
5.1. Beam Recrystallization5.2. Processed Wafer Bonding5.3. Silicon Epitaxial Growth5.4. Solid Phase Crystallization
6. Performance Characteristics 
6.1. Timing Variability6.2. Energy
7. Concerns in 3D Circuit 
7.1. Thermal Issues7.2. EMI7.3. Reliability Issues
8. Implications on Circuit Design and Architecture
8.1. Buffer Insertion8.2. Layout of Critical Paths
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- D ICsSeminar Report
08
8.3. Microprocessor Design8.4. Mixed Signal ICs8.5. Physical Design and Synthesis
9. Present Scenario of 3D ICs10. Advantages of 3-D ICs11. Applications of 3-D ICs12. Future of 3-D IC industry13. Conclusion14. Reference
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