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Pcb Design Basics - Mallek AbdeRRAHMANE

Pcb Design Basics - Mallek AbdeRRAHMANE

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Published by zeroscope
By Mallek AbdeRRAHMANE
paradox19@hotmail.com
The printed-circuit-board
design infrastructure has
grown, and PCBs themselves
will face future challenges.
By Mallek AbdeRRAHMANE
paradox19@hotmail.com
The printed-circuit-board
design infrastructure has
grown, and PCBs themselves
will face future challenges.

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Categories:Types, Maps
Published by: zeroscope on Mar 19, 2010
Copyright:Attribution Non-commercial

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05/28/2012

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BASICS
o
PCBs
Design
 A Supplement to Electronic Design/January 19, 2004Sponsored by Mentor Graphics
rinted-circuitboards (PCBs)are at the heartof the modernelectronic packagingfound in almost everyconsumer electronics product.In essence, a PCB creates theconnections betweencomponents within asystem.Mass reproducibili-ty for circuits witheven a modicum of complexity and/orspeed requires a PCB-based packagingscheme. Whendesigned correctly,PCBs bring predictability. A correct design mini-mizes wiring lengths and lays out the board so sig-nal-integrity issues are controlled. It also makes itmuch easier to find components during trou-bleshooting and repair. Even high-pin-count ICscan be removed, if necessary, and replaced.Up to about 10 years ago,advanced PCB design technologieslike microvias, high-density inter-connects (HDIs), embedded pas-sives, and high-pin-count FPGAswere available primarily to powerusers in global organizationsdesigning bleeding-edge products.But these design technologies arerapidly entering the mainstream, making themchallenges for a broader spectrum of PCB design-ers than ever before.
 Today’s PCB Design Environment
Most of today’s PCBs are pushing if not exceed-
David Maliniak, ElectronicDesign Automation Editor 
The printed-circuit-boar design infrastructure has grown, and PCBs themselveswill face future challenges.
PCBs Are
Not 
SoSimple Anymore
 
Sponsored by Mentor Graphics
ing the limits of classic board design
(Fig. 1)
. In mobile telecom, intercon-nect and board dimensions areshrinking rapidly, while designs areusing fewer but more complex com-ponents with higher pin counts. Atthe same time, boards for network-ing and computer applications aregrowing, with more interconnect andground plane layers.Data rates of up to 10 Gbits/s areresetting frequency standards forICs. As IC vendors replace parallelbus architectures with serial asyn-chronous architectures (Third Gen-eration I/O or 3GIO”), challengessuch as jitter, lossy lines, and biterror rates are replacing delay, timing, crosstalk,overshoot, and other traditional high-speeddesign challenges. In other words, it’s no longerreliable or viable to follow “rules of thumb” in today’s high-speed rout-ing and verification.
The relatively new 3GIO technol-ogy uses standards for encoding anddecoding electrical signals in serialasynchronous architectures. Already,Intel Corp. has incorporated 3GIOtechnology into its PCI Express stan-dardization environment. A signifi-cant percentage of today’s PCBs arecurrently operating in a frequencyrange of 1 to 10 GHz.
From a PCB design perspective,most of today’s high-speed designtools lack the advanced modelingand verification requirements uti-lized by 3GIO technology. With theonset of serial asynchronous archi-tectures, these tools must furtheraccommodate new design conceptsfor routing highly constrained dif-ferential pairs
(Fig. 2).
Understanding current and future PCB designchallenges in all areas of PCB design (from high-speed design, FPGA-on-board integration, teamdesign, and PCB fabrication, design, and inter-connect to library, constraint, and data manage-ment) is a critical aspect of a company’s invest-ment in a PCB design solution. This pulloutlooks at each of these challenges.
1. PCB design complexity is increasing at an accelerated rate with the addition of high-densityinterconnects, embedded components, gigabit data rates, and other technologies.2. Connections between ICs using the 3GIO architecture are routed using carefully matcheddifferential pairs.

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