High Quality
Open the downloaded document, and select print from the file menu (PDF reader required).
Reflow SolderingProcesses andTroubleshooting:SMT, BGA, CSP andFlip Chip Technologies
To my mother, Shu-shuen Chang, for her care and encouragementTo my wife, Shen-chwen Lee, for her understanding and full support
Reflow SolderingProcesses andTroubleshooting:SMT, BGA, CSPand Flip ChipTechnologies
Ning-Cheng Lee
BOSTON OXFORD AUCKLAND JOHANNESBURGMELBOURNE NEW DELHI
Reflow Soldering Book by Ning Cheng Lee
Info and Rating
Sections
« prev | next »- Preface
- 1.1 Surface mount technology
- 1.1.2 Surface mount components
- 1.1.3 Types of surface mount assembly technology
- 1.1.4 Surface mount soldering process
- 1.1.5 Advantages of solder paste technology in SMT
- 1.2 Surface mount technology trends
- 1.2.1 Technology driving force
- 1.2.2 Area array packages
- 1.3 Conclusion
- 2.1 Soldering theory
- 2.1.1 Spreading
- 2.1.3 Dissolution of base metal
- 2.1.4 Intermetallics
- 2.2 Effect of elemental constituents on wetting
- 2.3 Phase diagram and soldering
- 2.4 Microstructure and soldering
- 2.4.1 Deformation mechanisms
- 2.4.2 Desirable solders and the soldering process
- 2.4.3 Effect of impurities on soldering
- 2.5 Conclusion
- Appendix 2.1 Effect of flux surface tension on the spread of molten solder
- 3.1 Fluxing reactions
- 3.1.3 Fluxes for reflow soldering
- 3.2 Flux chemistry
- 3.2.1 Resins
- 3.2.2 Activators
- 3.2.3 Solvents
- 3.2.4 Rheological additives
- 3.3 Solder powder
- 3.3.1 Atomization
- 3.3.2 Particle size and shape
- 3.4 Solder paste composition and manufacturing
- 3.5 Solder paste rheology
- 3.5.1 Rheology basics
- 3.5.2 Solder paste viscosity measurement
- 3.6 Solder paste rheology requirement
- 3.6.1 Effect of composition on rheology
- 3.7 Conclusion
- 4.1 Solder paste materials
- 4.1.1 Paste handling and storage
- 4.1.2 Paste deposition
- 4.2 Printer level consideration
- 4.2.1 Stencil
- 4.2.2 Squeegee
- 4.2.3 Printing and inspection process
- 4.3 Pick-and-place
- 4.4.4 In-line-conduction reflow
- 4.5 Effect of reflow atmosphere on soldering
- 4.6 Special soldering considerations
- 4.6.1 Step soldering
- 4.6.3 Paste-in-hole
- 4.7 Solder joint inspection
- 4.8 Cleaning
- 4.9 In-circuit-testing
- 4.10 Principle of troubleshooting reflow soldering
- 4.11 Conclusion
- 5.1 Flux separation
- 5.2 Crusting
- 5.3 Paste hardening
- 5.4 Poor stencil life
- 5.5 Poor paste release from squeegee
- 5.6 Poor print thickness
- 5.9 Needle clogging
- 5.11 Low tack
- 5.12 Short tack time
- 5.13 Conclusion
- 6.1 Cold joints
- 6.2 Nonwetting
- 6.3 Dewetting
- 6.4 Leaching
- 6.5 Intermetallics
- 6.5.1 General
- 6.5.2 Gold
- 6.6 Tombstoning
- 6.7 Skewing
- 6.8 Wicking
- 6.9 Bridging
- 6.10 Voiding
- 6.11 Opening
- 6.11.1 Pillowing
- 6.11.2 Other openings
- 6.11.3 Fillet lifting
- 6.11.4 Projected solder
- 6.12 Solder balling
- 6.13 Solder beading
- 6.14 Spattering
- 6.15 Conclusion
- 7.1 White residue
- 7.2 Charred residue
- 7.3 Poor probing contact
- 7.3.1 Flux residue content
- 7.3.4 Residue hardness
- 7.3.6 Metal content
- 7.3.7 Soft-residue versus low-residue
- 7.3.8 Soft-residue versus RMA residue
- 7.3.9 Multiple cycles probing testability
- 7.4 Surface insulation resistance or electrochemical migration failure
- 7.4.1 Surface insulation resistance (SIR)
- 7.4.2 Electrochemical migration (EM)
- 7.4.3 Effect of flux chemistry on IR values
- 7.4.4 Effect of soldering temperature
- 7.4.5 Effect of cleanliness of incoming parts
- 7.4.6 Effect of conformal coating/encapsulation
- 7.4.7 Effect of interaction between flux and solder mask
- 7.4.8 Effect of interaction between solder paste flux residue and wave flux
- 7.5 Delamination/voiding/non-curing of conformal coating/encapsulants
- 7.5.1 Voiding
- 7.5.2 Delamination
- 7.5.3 Incomplete curing
- 7.6 Conclusion
- 8.1 Solder criteria
- 8.1.1 Alloys used in flip chip solder bumping and soldering
- 8.1.2 Alloys used in BGA and CSP solder bumping and soldering
- 8.1.3 Lead-free solders
- 8.2 Solder bumping and challenges
- 8.2.1 Build-up process
- 8.2.2 Liquid solder transfer process
- 8.2.3 Solid solder transfer processes
- 8.2.4 Solder paste bumping
- 8.3 Conclusion
- 9.1 Assembly process
- 9.1.1 General stencil design guideline
- 9.1.2 BGA/CSP placement
- 9.1.4 Inspection
- 9.2.2 Pre-baking
- 9.2.3 Component removal
- 9.2.5 Site preparation
- 9.2.6 Solder replenishment
- 9.2.7 Placement of component
- 9.3 Challenges at assembly and rework stages
- 9.3.1 Starved solder joint
- 9.3.2 Poor self-alignment
- 9.3.3 Poor wetting
- 9.3.4 Voiding
- 9.3.5 Bridging
- 9.3.6 Open
- 9.3.7 Uneven joint height
- 9.3.8 Solder webbing
- 9.3.9 Solder balling
- 9.3.10 Popcorn and delamination
- 9.4 Conclusion
- 10.1 Flip chip attachment
- 10.1.1 Conventional flip chip attachment
- 10.1.2 Snap cure
- 10.1.6 Fluxless soldering
- 10.2.1 Misalignment
- 10.2.2 Poor wetting
- 10.2.3 Solder voiding
- 10.2.5 Bridging
- 10.2.6 Open
- 10.2.8 Delamination
- 10.2.9 Filler segregation
- 10.3 Conclusion
- 11.1 Flux reaction
- 11.1.1 Time/temperature requirement for the fluxing reaction
- 11.1.2 Fluxing contribution below the melting temperature
- 11.2 Peak temperature
- 11.2.1 Cold joint and poor wetting
- 11.2.2 Charring, delamination, and intermetallics
- 11.2.3 Leaching
- 11.3 Cooling stage
- 11.3.1 Intermetallics
- 11.3.2 Grain size
- 11.3.3 Internal stress-component cracking
- 11.3.4 Deformation of joints
- 11.3.5 Internal stress solder or pad detachment
- 11.4 Heating stage
- 11.4.1 Slumping and bridging
- 11.4.2 Solder beading
- 11.4.3 Wicking
- 11.4.4 Tombstoning and skewing
- 11.4.5 Solder balling
- 11.4.6 Poor wetting
- 11.4.7 Voiding
- 11.4.8 Opens
- 11.5 Timing considerations
- 11.5.1 Ramp-up stage
- 11.5.2 Soaking zone
- 11.5.3 Onset temperature of spike zone
- 11.6.1 Summary of desired profile feature
- 11.6.2 Engineering the optimized profile
- 11.7.2 Background of conventional profiles
- 11.7.3 Approach of conventional profiles
- 11.7.4 Compromise of conventional profiles
- 11.7.5 Earlier mass reflow technologies
- 11.7.6 Forced air convection reflow technology
- 11.7.7 Defect potential associated with conventional profiles
- 11.8 Discussion
- 11.8.1 Profiles for low temperature solder pastes
- 11.8.2 Profiles for high temperature solder pastes
- 11.8.3 Limited oxidation tolerance
- 11.8.4 Unevenly distributed high thermal mass systems
- 11.8.5 Nitrogen reflow atmosphere
- 11.8.7 Adjustment of optimal profile
- 11.9 Implementing linear ramp-up profile
- 11.10 Conclusion
- 12.1 Initial activities
- 12.2 Recent activities
- 12.3 Impact of Japanese activities
- 12.4 US reactions
- 12.5 What is lead-free interconnect?
- 12.6 Criteria of lead-free solder
- 12.7 Viable lead-free alloys
- 12.7.1 Sn96.5/Ag3.5
- 12.7.2 Sn99.3/Cu0.7
- 12.7.3 Sn/Ag/Cu
- 12.7.4 Sn/Ag/Cu/X
- 12.7.5 Sn/Ag/Bi/X
- 12.7.6 Sn/Sb
- 12.7.7 Sn/Zn/X
- 12.7.8 Sn/Bi
- 12.8 Cost
- 12.10 Components
- 12.11 Thermal damage
- 12.12 Other problems
- 12.13 Consortia activity
- 12.14 Opinions of consortia
- 12.15 The selections of pioneers
- 12.16 Possible path
- 12.17 Is lead-free safe?
- 12.18 Summary of lead-free adoption
- 12.19 Troubleshooting lead-free soldering
- 12.19.1 Compatibility with reflow process
- 12.19.2 Fillet lifting
- 12.19.3 Conductive anode filament
- 12.19.4 Grainy surface
- 12.19.5 Sn/Pb/Bi ternary low melting eutectic phase
- 12.20 Conclusion
- Index
Add a Comment