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REFLOW AND WAVE SOLDERING PROCESS DOCUMENTATION SHEET

REFLOW AND WAVE SOLDERING PROCESS DOCUMENTATION SHEET

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Published by smtdrkd

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Published by: smtdrkd on May 06, 2008
Copyright:Attribution Non-commercial

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11/21/2012

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REFLOW SOLDERING PROFILE DOCUMENTATION
CUSTOMER NAME :IS IT TIN-LEAD OR LEAD-FREE BUILD ?BUILD DATE :PRODUCT NAME :PRODUCT CODE:WORK ORDER #
MACHINE PARAMETERSREFLOW PROCESS PARAMETERS
ZONESTEMPERATUREPROCESS T/C #1T/C #2T/C #3T/C #4T/C #5T/C #6AVG
ZONE 1
Peak temperature
#DIV/0! 
ZONE 2
Time above 217°C
#DIV/0! 
ZONE 3
Time - 50°C to 220°C
#DIV/0! 
ZONE 4
Gradient in Preheat
#DIV/0! 
ZONE 5
Max gradient in reflow
#DIV/0! 
ZONE 6
Max gradient in Cooling
#DIV/0! 
ZONE 7DRAW THE PICTURE OF PCB PANEL WITH T/C LOCATIONS BELOW:ZONE 8
.
ZONE 9ZONE 10ZONE 11ZONE 12CONVEYOR SPEEDCOMMENTS:
 
PC INDEX#DIV/0!

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