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Convection Correlations for PCB

Convection Correlations for PCB

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Published by Dan Wolf
This problem demonstrates the convection correlation feature of SOL 400 RC Network Solver.
This problem demonstrates the convection correlation feature of SOL 400 RC Network Solver.

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Published by: Dan Wolf on Jun 19, 2010
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12/24/2013

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Chapter 65: Convection Correlations forPCB
65
Convection Correlations forPrinted Circuit Board (PCB)
 
1209
CHAPTER 65
Convection Correlations for Printed Circuit Board (PCB)
Summary
Title Chapter 65: Convection Correlations for PCBFeatures Natural convection correlation 701 by using
PCONV1
entryForced convection correlation 507 by using
PCONV1
entryContact loads by using
PRJCON
and
SET3
cardsGeometryThe dimension of PCB is 9 x 6 x 0.0093 inches (copper thickness)Material propertiesPCB: Copper K = 9.9 W/in C°; Copper Thickness = 0.0093 inChips: K = 2.24 W/in°CAir: K = 6.66e-4 W/in°C; Cp = 456.2 J/lbm°C;
ρ
= 5.01e-5 lbm/in³;
μ
= 1.03e-6 lbm/ins,
β
= 3.43e-3/°CAnalysis characteristics Solution 400/RC Network solver. Steady state thermal analysis.Boundary conditionsWall temperature = 25°CFor Natural convection model: Tair = 20°CFor Forced convection: Inlet Air Temperature = 20°CApplied loadsTotal surface heat = 5W, Total Heat on chips: 7.5W, 5W, 5WContact load between PCB and chips with coefficient =12 W/in² °CConvection with correlation 701 for natural convection modelCoupled advection with correlation 507 for forced convection modelMass flow rate = 3.2E-3 lbm/sHydraulic Diameter = 0.2 inFlow Cross Section = 0.6 in²Interval between chips and next PCB = 0.1 inElement typeCQUAD4 for PCBCTETRA for chipsCHBDYP/FTUBE for air flow (for natural convection model)FE resultsTemperature result:
 
MD Demonstration ProblemsCHAPTER 65
1210
Introduction
This problem demonstrates the convection correlation feature of SOL 400 RC Network Solver.
Modeling Details
The dimension of PCB is 9 x 6 x 0.0093 inches (copper thickness). The two edges are fixed to the slots and have aconstant boundary temperature of 25°C. The total circuit power on the PCB is 5W, and the total power of the threechips is 7.5W, 5W, and 5W, respectively. The PCB mesh and chip mesh do not match each other. RC Network Solver has a special contact algorithm to deal with that.The convection correlation 701 is used to simulate the natural convection of PCB and chips. The air temperature is20°C. The convection correlation 507 is used to simulate the forced convection. The forced convection is applied to both sides of the PCB and outer side of the chips. The inlet air temperature is 20°C.
Figure65-1 PCB and Chips ModelFigure65-2 Natural and Forced Convection Models
Solution Highlights
Convection correlations are used to calculate the convection coefficients in different situations. MD Nastran RC Network Solver supports 44 convection correlations. Each convection correlation consists of three tabs: CorrelationView, Variables, and Additional Coefficient. Correlation View form includes the description, formula, illustration, and
5 WConstant Boundary Temperature = 25
 
C
o
Contact Coefficient = 1.2 W/in C
2o
 
20 C
o
20 C
o
Inlet T = 20 Co0.1 in

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