MD Demonstration ProblemsCHAPTER 65
This problem demonstrates the convection correlation feature of SOL 400 RC Network Solver.
The dimension of PCB is 9 x 6 x 0.0093 inches (copper thickness). The two edges are fixed to the slots and have aconstant boundary temperature of 25°C. The total circuit power on the PCB is 5W, and the total power of the threechips is 7.5W, 5W, and 5W, respectively. The PCB mesh and chip mesh do not match each other. RC Network Solver has a special contact algorithm to deal with that.The convection correlation 701 is used to simulate the natural convection of PCB and chips. The air temperature is20°C. The convection correlation 507 is used to simulate the forced convection. The forced convection is applied to both sides of the PCB and outer side of the chips. The inlet air temperature is 20°C.
Figure65-1 PCB and Chips ModelFigure65-2 Natural and Forced Convection Models
Convection correlations are used to calculate the convection coefficients in different situations. MD Nastran RC Network Solver supports 44 convection correlations. Each convection correlation consists of three tabs: CorrelationView, Variables, and Additional Coefficient. Correlation View form includes the description, formula, illustration, and
5 WConstant Boundary Temperature = 25
Contact Coefficient = 1.2 W/in C