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Table Of Contents

Formation of Energy Bands
Doping of Semiconductors
The Fermi Level Concept
Surface Properties of Semiconductors
Semiconductor Junctions
pn Junctions
Forward Bias
Reverse Bias
Metal–Semiconductor Junctions
Forward Bias (VA>0) and Reverse Bias (VA<0)
Real Diode Characteristics
Capacitance
Dynamic Switching
Design Tradeoffs
Conclusion
References
Thermal Models
Case–Mounted Rectifiers
Lead–Mounted Parts
Multiple Chip Devices
Transient Response of Semiconductors
Thermal Response
Use of Thermal Response Data
Handling Nonrectangular Pulses
Example Peak Temperature Calculations
Thermal Runaway
The SPICE Diode Model
Introduction
The Large–Signal DC Model
The Small–Signal AC Model
Temperature and Area Effects
The Noise Model
The Diode Model versus a Real Diode
SPICE Diode Model Parameter Extraction Methods
Reverse Recovery Time Characteristics (TT)
Temperature Characteristics (EG, XTI)
Reverse Breakdown Characteristics (BV, IBV)
Forward DC Characteristics (IS, RS, N)
Summary
Temperature
Thermal Resistance
Voltage Ratings
Peak Repetitive Reverse Voltage (VRRM)
Peak Working Reverse Voltage (VRWM)
DC Reverse Blocking Voltage (VR)
Peak Nonrepetitive Reverse Voltage (VRSM)
Reverse Current
Maximum or Peak Reverse Current (IRRM)
Average Reverse Current IR(AV)
DC Reverse Current (IR)
Reverse Breakdown Voltage V(BR)
Forward Voltage
Maximum (Peak) Forward Voltage (VFM)
Average Forward Voltage (VF(AV))
DC Forward Voltage (VF)
Forward Power Dissipation
Current Ratings
Average Forward Current (IO)
Peak Surge Forward Current (IFSM)
Switching
Reverse Recovery
Forward Recovery
Basic Operation
Current Relationships
Form Factor
Utilization Factor
Harmonics
Ripple Factor
Rectification Ratios
Voltage Relationships
Circuit Variations
General Relationships in Polyphase Rectifiers
Transformer Utilization
Ripple
Rectification Ratio
Overlap
Common Polyphase Rectifier Circuits
Three–Phase Half–Wave Star Rectifier Circuit
Three–Phase lnter–Star Rectifier Circuit
Three–Phase Full–Wave Bridge Circuit
Six–Phase Full–Wave Bridge Circuits
Comparison of Circuits
High–Current Parallel–Connected Diodes
Behavior of Rectifiers with Choke–Input Filters
Voltage Regulation in Choke Input Systems
Design of Capacitor–Input Filters
Diode Peak Inverse Voltage
Transformer Considerations
Harmonic
Surge Current
Filter Sections
Voltage and Current Relations in Filters
Graded Filters
Filter Component Selection
Example of Power Supply Design
Passive Component Selection
Transformer Selection
Diode Selection
Voltage–Doubling Circuits
“Universal” Input Circuit
Voltage Tripling Circuits
Voltage Quadruples
High–Order Cascade Voltage Multipliers
Externally Generated Voltage Surges
Internally Generated Voltage Surges
Surge Protection Circuits
Surge Current Protection
Fusing Considerations
Rectification, Discontinuous Mode
Catching
Clipping
Clamping
Freewheeling
Rectification, Continuous Mode
Forced Commutation Analysis
The Diode Snubber
Drive Circuits for Power MOSFETs
Drive Circuits for Bipolar Power Transistors
Baker Clamp
Fixed Drive Circuit
Proportional Drive Circuit
Overvoltage Snubbers
Snubber Diode Requirements
Power Conversion Circuits
Flyback Converter
Forward Converter
Push–Pull DC–DC Converters
Off–Line AC–DC Converters
Synchronous Rectification
General References
Concepts
Design for Reliability
System Architecture and Device Specification
Stress Analysis
Derating
Stress Screening
Failure Data Collection and Analysis
Practical Aspects of Semiconductor Reliability
Electrical Overstress
Second Breakdown
Ionic Contamination
Electromigration
Hillock Formation
Contact Spiking
Metallization Migration
Corrosion of Metallization and Bond Pads
Stress Corrosion in Packages
Wire Fatigue
Wire Bond Fatigue
Die Fracture
Die Adhesion Fatigue
Cracking in Plastic Packages
Reliability Testing
High–Temperature Operating Life
Temperature Cycle
Thermal Shock
Temperature/Humidity Bias (THB)
Autoclave
Pressure/Temperature/Humidity Bias (PTHB)
Cycled Temperature Humidity Bias
Power Temperature Cycling
Power Cycling
Low–Temperature Operating Life
Mechanical Shock
Constant Acceleration
Solder Heat
Lead Integrity
Solderability
Variable Frequency Vibration
Statistical Process Control
Process Capability
SPC Implementation and Use
Thermal Resistance Concepts
Conduction
Convection
Natural Convection
Forced Convection
Radiation
Fin Efficiency
Application and Characteristics of Heatsinks
Heatsinks for Free Convection Cooling
Heatsinks for Forced Air Cooling
Fan Laws
Liquid Cooling
Component Placement
Insertion Mounting
Surface–Mount Technology
Surface–Mount Rectifier Packages
Board Materials
Surface–Mount Assembly
Flux and Post Solder Cleaning
Semiaqueous Cleaning Process
Mounting Surface Preparation
Surface Flatness
Surface Finish
Mounting Holes
Surface Treatment
Interface Decisions
Thermal Compounds (Grease)
Conductive Pads
Insulation Considerations
Tab Mount
Appendix B
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7255003 Rectifier Handbook

7255003 Rectifier Handbook

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Published by: jhvfbuio5485 on Aug 24, 2010
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