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SMT Soldering Handbook

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Preface to the ﬁrst edition
Preface to the second edition
Glossary
1 Why SMDs?
References
2 The SMD family
2.1 Shapes,sizesand construction
2.1.1 Melfsand chips
2.2 High-pincountcomponents
2.2.1 TABs
2.2.2 Flip-chipsand BGAs
2.3 Multichip modules
2.4 The solderable surfacesofSMDs
2.4.1 Melfsand chips
2.4.2 Componentswithlegs
2.5 SMDshapesand wavesoldering behaviour
2.7 References
3 Soldering
3.1 The nature ofsoldering and ofthe soldered joint
3.1.1 The rolesofsolder, ﬂux and heat
3.1.2 Soldering methods
3.1.3 Soldering success
3.2 The solder
3.2.1 Constituents, melting behaviourand mechanicalproperties
3.2.3 Lead-free solders
3.2.4 Solderimpurities
3.3.3 Mechanicalpropertiesofsoldered joints
3.3.4 Soldering on surfacesotherthan copper
3.3.5 Long-term behaviourofsoldered joints
3.3.6 Long-term reliability ofsoldered joints
3.4 The ﬂux
3.4.1 Tasksand actionofthe soldering ﬂux
3.4.2 Wetting and interfacialtension
3.4.3 Propertiesrequired in a ﬂux
3.4.4 Rosin ﬂuxes
3.4.5 Low-solidsand no-cleanﬂuxes
3.4.6 Watersoluble ﬂuxes
3.4.7 Solventsused in ﬂuxes
3.4.8 Flux standards
3.4.9 Testing soldering ﬂuxes
3.5 Soldering heat
3.5.2 Heating options
3.6 Solderability
3.6.1 Wetting and dewetting
3.6.2 Capillarity and itseffects
3.6.3 Capillarity and joint conﬁguration
3.6.4 The importance ofsolderability
3.6.5 Oxide layers
3.6.6 Solderability-enhancing surface coatings
3.6.8 Measuring solderability
3.7 References
4 Wavesoldering
4.1 The wave concept
4.1.1 Wavesoldering before SMDs
4.2.2 Monitoring and controlling ﬂux quality
4.3 Preheating the board
4.3.1 Heatrequirements
4.3.2 Heatemittersand theircharacteristics
4.3.3 Temperature control
4.4 The solderwave
4.4.1 Constructionofthe soldering unit
4.4.2 Thermalrole ofthe solderwave
4.4.4 Chipwaves
4.5 Wavesoldering in an oxygen-free atmosphere
4.5.1 Originsand development
4.5.2 Wavesoldering in nitrogen
4.6 Board conveyorsystems
4.6.1 Functionalrequirements
4.6.2 Board-handling systems
4.7 Wavesoldering practice
4.7.1 Operating parametersand theirrole
4.7.2 Choosing and monitoring operating parameters
4.7.3 Optimizing machine parameters
4.7.4 Machine maintenance
4.7.5 Check-analysisofthe solderbath
4.7.6 Dealing with dross
4.7.7 Hygiene and safety
4.8 The role ofadhesivesin wavesoldering
4.8.1 Demandson the adhesive and the glued joint
4.8.2 Storage and handling behaviourofadhesives
4.8.3 Applying the adhesive
4.8.4 Curing the adhesive joint
4.8.5 The glasstransition temperature
5 Reﬂowsoldering
5.1 The reﬂow concept
5.1.1 SMDsand reﬂowsoldering
5.1.2 Reﬂowsoldering versuswavesoldering
5.2 Solderpaste
5.2.1 Operationalrequirements
5.2.2 Standard speciﬁcations
5.2.3 Solderpowder
5.2.4 The ﬂux and itsresidue
5.2.5 Printing and dispensing properties
5.2.6 The solderballtest
5.3 Putting the solderpaste on the board
5.3.1 Single-spotdispensing
5.3.2 Stencilling and screen printing
5.4 Vapourphase soldering
5.4.1 The basic concept
5.4.2 Vapourphase working ﬂuids
5.4.3 The physicsofvapourphase soldering
5.4.4 Vapourphase soldering equipment
5.4.5 ‘New-generation’vapourphase soldering systems
5.5 Infrared soldering
5.5.1 Working principle
5.5.4 Operationofinfrared ovens
5.5.5 Oven design
5.5.6 Infrared soldering in a controlled atmosphere
5.6.1 Convectionversusradiation
5.6.2 The physicsofconvectionreﬂowsoldering
5.6.3 Convectionreﬂow ovens
5.6.4 Developmentpotentialofconvectionreﬂowsoldering
5.6.5 Convectionsoldering ofsingle components
5.7 Lasersoldering
5.7.1 How a laserworks
5.7.2 Nd:YAG and CO2 lasers
5.7.3 Lasersoldering in practice
5.7.4 Laser-soldering equipment
5.8 Impulse soldering
5.8.1 Operating principle
5.8.2 The solderdepot
5.8.3 The thermode and itsheating cycle
5.8.4 Impulse-soldering equipment
5.10 References
6 The circuit board
6.1 The beginnings
6.2 SMD-speciﬁc demandsona circuitboard
6.3 Thermalmanagement
6.3.1 Thermalexpansionmismatch
6.4 Solderable surfaces
6.4.1 Galvanic coatings
6.4.2 Hottinning
6.4.3 Organic coatings
6.5 The soldermask
6.6 Layout
6.6.1 Layoutforwavesoldering
6.6.2 Layoutforreﬂowsoldering
6.7 References
7 Component placement
7.1 The task
7.2 Reliability ofplacement
7.3 Placementoptions
7.3.1 Fully manualplacement
7.3.2 Semi-automatic placement
7.3.3 Fully automatic sequentialsystems
7.3.4 Simultaneousplacementsystems
7.4 The practice ofautomatic componentplacement
7.4.1 The range ofchoice
7.5 Reference
8 Cleaning aftersoldering
8.1 Basic considerations
8.1.1 Reasonsforcleaning
8.1.2 Designing forcleanability
8.1.3 Whatmustbe removed?
8.2 The theory ofcleaning
8.2.1 The physicsofcleaning
8.2.2 The chemistry ofcleaning
8.3.1 Organic solvents
8.3.2 Solvent-cleaning installations
8.3.3 In-line cleaning plants
8.3.4 Halogenated solvents:safety and health
8.3.5 The three environmentalthreats
8.3.6 Restrictionson solventusage
8.3.7 Non-ﬂammable organic solventswith reduced environmentalrisks
8.3.8 Flammable solvents
8.4 Cleaning with water
8.4.2 Waterquality
8.4.3 Waterrecycling and efﬂuent problems
8.4.4 Removalofresidue from watersoluble ﬂuxes
8.4.5 Removalofresidue from resinousﬂuxes
8.4.6 Waterwashing installations
8.5 Semi-aqueouscleaning
8.5.1 The concept
8.5.2 The cleaning solvents
8.5.3 Semi-aqueouswashing installationsforwater-immiscible solvents
8.5.4 Semi-aqueouswashing installationsforwater-miscible solvents
8.6 Testing forcleanliness
8.6.1 The meaning ofcleanliness
8.6.2 Measuring ionic contamination(MILtest)
8.6.3 Measuring surface insulation resistance (SIR)
8.7 The future ofcleaning and ofﬂuxing
8.8 References
9 Quality control and inspection
9.1 The meaning of‘quality’
9.1.1 Productquality and productreliability
9.1.2 Classiﬁcationaccording to reliability requirements
9.2 Soldering successand soldering perfection
9.2.1 Soldering successand soldering faults
9.2.2 Soldering perfectionand soldering imperfections
9.3 Practicalexamplesofsoldering faults
9.5 Inspection
9.5.1 When to inspect
9.5.2 Visualinspection
9.5.3 Automated opto-electronic inspection
9.5.4 X-ray inspection
9.5.5 Electronic inspection
9.5.6 Thermographic inspection
9.6 References
10 Rework
10.1 The unavoidability ofrework
10.1.1 Rework in the productionprocess
10.1.2 Desoldering and resoldering
10.2 Basic considerations
10.2.1 Metallurgicaland mechanicalconsequencesofrework
10.2.3 Lessonsto be learned
10.3 Rework equipment
10.3.1 Heatsources
10.3.2 Rework stations
10.4 Rework tasksand procedures
10.4.1 Removing bridgesand solderballs
10.4.2 Desoldering SMDs
10.4.3 Filling empty joints
10.4.4 Resoldering SMDs
10.4.5 Cleaning afterrework
10.4.6 Semi-mechanized work stations
10.5 Integrating rework into the productionprocess
10.5.1 Rework personnel
10.5.2 Closed-loop soldering
10.6 References
Index

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