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E-Book Proof of Design DFM and Concurrent Engineering

E-Book Proof of Design DFM and Concurrent Engineering

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Published by smtdrkd
An Excellent book on Design for Manufacturing and Concurrent Engineering as it pertains to PCB Fab and Assembly Operations.
An Excellent book on Design for Manufacturing and Concurrent Engineering as it pertains to PCB Fab and Assembly Operations.

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Published by: smtdrkd on Jul 03, 2008
Copyright:Attribution Non-commercial

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08/22/2014

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1 Proof Of Design DFM/CE PART 3POD DFM/CE - REVISION 3
PROOF OF DESIGN (POD) – THE DFM/CE BOOK FORPRINTED CIRCUIT BOARDS, ASSEMBLIES, AND ALLMANNER OF OTHER THINGS TECHNICAL(PART 3)
Revision 3 provides more detailed supplier evaluation/qualification guidelines,checklists, procedures, and requirements. It includes PCB/PCBA operationalinformation, Manufacturing Operations Procedures, Failure Analysisinformation, requirements, and details. It has a complete section on LeanManufacturing – plus much more DFM/CE and other vital information for those
needing/wishing/wanting/desiring 
to manage processes instead of reacting toresults as poor quality and reliability.byMoonMan
The MoonMan without DFM/CEThe MoonMan with DFM/CEProduct without DFM/CEProduct with DFM/CE
 
2 Proof Of Design DFM/CE PART 3POD DFM/CE - REVISION 3
FORWARD (advance – or move positively in one direction – or never move backward - or never do it over – or never effect defect and have to correct it): THIS BOOK IS ABOUTDOING IT RIGHT THE FIRST TIME, ON TIME, EVERY TIME, AT THE LOWEST COST. THISSIMPLY IS DONE BY MANAGING PROCESSES INSTEAD OF RESULTS. Nike says Just do it.MoonMan says Just do it but do it right. MoonMan also says let’s Boogie (MoonMan’sexpression for let’s move forward or let’s get it on) and get down to it. You should ask theMoonMan about product with DFM/CE above.
IMPORTANT NOTES:
THOUGH THIS BOOK FOCUSES MOSTLY ON ELECTRONICS, WITH PRINTED CIRCUITRY  AT ITS CORE, ALL THE PRINCIPLES APPLY TO ALL APPLICATIONS WHETHER TELCCOMMUNICATIONS, AUTOMOTIVE, MEDICAL, MILITARY, AEROSPACE, OR WHATEVER PRODUCT DEMANDING QUALITY AND RELIABILITY.THIS BOOK IS DESIGNED TO BE USED ANY WAY ONE SEES FIT. IF YOU NEED TO USE  ANY INFORMATION HEREIN – SIMPLY COPY AND PASTE IT INTO YOUR DOCUMENTS OR PROCESSES.THIS BOOK IS DIVIDED INTO FOUR SEPARATE PARTS TO FACILITATE USE BY ANYONE WITH A COMPUTER SYSTEM CAPABLE OF MANAGING IT. EACH PART SHOULD BE LOADED SEPARATELY TO ENSURE COMPUTERS WITH LIMITED RESOURCES CAN READ AND USE THE FILES. EACH PART (PODDFMCE 1 -4) HAS A SEPARATE TABLE OF CONTENTS AND EACH PART BEGINS ON PAGE ONE.THIS BOOK IS WRITTEN USING MS WORD 97 AND APPEARS TO BE UNIVERSALLY  ACCEPTABLE TO ALL. I TRIED WRITING IT USING XP PROFESSIONAL BUT IT DID NOT TRANLATE EXACTLY TO 97.THIS IS PART 3... IT CONTAINS 94.6MB (99,202,560 bytes).YOU NEED TO ASSESS YOUR COMPUTERS' CAPABILITIES AS AMOUNT OF RAM, HARD DRIVE CAPACITY, AND VIDEO CARD.
 
 
3 Proof Of Design DFM/CE PART 3POD DFM/CE - REVISION 3
POD - DFM/CE PART 3 TABLE OF CONTENTSSECTION PAGE
12.0 PCBA MANUFACTURING OPERATION PROCEDURES 412.1 SOLDER PASTE AND STENCILS 512.2 STENCILPRINTING 1912.3 A FEW WORDS ABOUT THROUGH HOLE TECHNOLOGY 5712.4 SMT COMPONENT PLACEMENT 6012.5 REFLOW SOLDERING 12412.6 WAVE SOLDERING 16012.7 HAND SOLDERING 20212.8 WINESCO REPAIR/REWORK 23412.9 SRM4 REPAIR/REWORK 24612.10 BGA REPAIR/REWORK 26412.11 MSD AND VACUUM SEALING PROCEDURES 35012.12 LIQUID SOLDER MASKING PROCEDURES 36612.13 PANELIZATION AND DE-PANELIZING 38512.14 FINAL ASSEMBLY (SYSTEM OR "BOX" BUILD) 38912.15 CLEANING AND CLEANLINESS 39912.16 INSPECTION AND TEST 407NOTE: PCB FABRICATION PROCEDURES ALSO AVAILABLE ON A CUSTOM BASIS THOUGH I HAVE MANYOF THESE FOR VARIOUS SHOPS THROUGHOUT THE WORLD. HOWEVER, THERE ARE SO MANYPROCESSES AND DIFFERENT WAYS OF DOING THEM, I CANNOT POSSIBLY INCLUDE THEM HEREIN.

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