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surface mounting technlogy

surface mounting technlogy

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Published by hariharasankar

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Published by: hariharasankar on Jul 17, 2008
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09/06/2012

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E-BOOK ON
 
SURFACE MOUNT TECHNOLOGYCOMPILED BYDR. KANTESH DOSSELCOTEQ, INC.
 
LIST OF ARTICLES IN THIS E-BOOK ONSURFACE MOUNT TECHNOLOGY
1. Technical paper about Stencil Design2. Fiducial Mark Design Guidelines3. Volume Assembly Qualification for 0201 Packages4. Causes and Cures of Tombstoning Chip Components5. Technical paper about Printing of SMT Solderpaste6. Suggestions for layout of "rat-bite" breakaway tabs7. What does X-ray inspection of hidden BGA solder joints reveal?8. The benefits of v-scoring (Pocket Guide to Excellent V-Scoring)9. About ESD (Everything You Ever Wanted to Know About Air ionization).10. Soldering to Gold over Nickel surfaces.11. Process Parameters Wave soldering.12. Technical paper about Printing of SMT Adhesives13. Metal Stencil Overview.14. The Benefits of a Ramp-to-Spike Reflow Profile.15. Minimizing defects on board assemblies by reflow profile adjustments.16. Reducing solder microballs in innert wave soldering.17. What is Nitrogen?18. Matte-surface solder masks reduce solder ball defects.19. Achieving Long-term stability in the SMD placement Process.20. Flip chip interconnect21. Nitrogen in refow
 
STENCIL DESIGN GUIDELINES
Considerations with Stencil Design:
Aperture Size vs Pad Size, Aperture Shape, Stencil Thickness, Adhesives Printing,Stencil Manufacturing Method, Stencil Thickness, Aperture Design, etc.
Aperture Size vs Pad Size
It is recommended that finer pitch aperture openings be slightly smaller than the landingpad size. This is primarily for:.
Improved gasketing between the landing pad and the underside of the stencil
Prevent bridging on fine pitch component
Recommended Pad and Aperture Size:
 ComponentPitchIndustry StandardPad WidthIndustry StandardAperture Width50 mil 25 mil 25 mil40 mil 20 mil 20 mil31 mil 17 mil 16 mil25 mil 15 mil 12 mil20 mil 12 mil 10 mil16 mil 10 mil 8 mil12 mil 8 mil 6 milAperture width reductions must be taken equally from each side so that aperture iscentered on the pad. (Fig 1.)Aperture lengths can be reduced by similar dimensions to reduce the potential of solderballing.Fig 1.Apertures can be shifted to the outside edge of a pad to reduce potential for "underchip"solder balls. (Fig. 2)

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