1. PREAMBLESilicon-on-insulator (SOI)
technology provides opportunities to increasetransistor switching and at the same time to improve performance for low-power, battery-driven electronics. With its ability to increase device density through reduction inisolation area, SOI can postpone the need to shift to smaller scale transistors. SOI cancontribute to reduced manufacturing costs by simplifying IC fabrication processes,through the elimi-nation of high-energy implantation for well doping and simplificationof device isolation. SOI also provides opportunities beyond conventional semiconductor devices. SOI is a key method for fabricating
devices, which havethe potential to integrate communications, smart cards, sensors and displays withportable, low-power memory and logic devices, as in Figure 1.
Figure 1. SOI technology enables major performance advances in numerous applications
Using a fully-integrated, proprietary SOI manufacturing process, calledNanoCleave, advanced corporations have recently begun production of SOI wafers whichoffers lower cost and higher wafer quality than earlier generations of SOI fabricationmethods.