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HTC Blackstone Service Manual & Repair Guide

HTC Blackstone Service Manual & Repair Guide

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Published by Repair Pro TM
HTC Blackstone Service Manual & Repair Guide
HTC Blackstone Service Manual & Repair Guide

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Published by: Repair Pro TM on Mar 02, 2011
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03/02/2011

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Doc. No. DOC-00045694
 
REV.Issued Date 2008/8/21
.
Revised Date 2008/11/6A01
Doc. Title
Blackstone Service Manual
Page 1  of  96
 
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
 
BlackstoneService Manual
 
U
HTC ProprietaryConfidential Treatment Requested
Rev. A01 
HTC Corp.
Engineering Mobility 
 
 
Doc. No. DOC-00045694
 
REV.Issued Date 2008/8/21
.
Revised Date 2008/11/6A01
Doc. Title
Blackstone Service Manual
Page 2  of  96
 
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
  REVISION CONTROL TABLEREV DATE CONTENTS DEPT. REVISED STAGE
AX01 2008/8/21 Fist Draft. PSE Leo Wei DVTAX02 2008/10/21 Chapter 3 to 10 are created in SM. PSE Leo Wei PVTA01 2008/11/061. Chapter 4.1 added the engineer ID indiagnostic program.2. Chapter 5.2 added the value for Idle/sleepcurrent test.3. Chapter 9.2 revised the L2.5 component part.PSE Leo Wei MV
 
 
Doc. No. DOC-00045694
 
REV.Issued Date 2008/8/21
.
Revised Date 2008/11/6A01
Doc. Title
Blackstone Service Manual
Page 3  of  96
 
HTC CONFIDENTIAL
SM-TP001-0704
HTC Corporation
 
1.
 
INTRODUCTION
....................................................................................................................................................................4
 
1.1
 
P
RODUCT
F
EATURES
..........................................................................................................................................5
 
1.2
 
P
RODUCT OVERVIEW
........................................................................................................................................10
 
2.
 
DEVICE DISASSEMBLING AND ASSEMBLING PROCEDURE
................................................................................17
 
2.1
 
T
OOLS LIST
......................................................................................................................................................17
 
2.2
 
D
ISASSEMBLING PROCEDURE
............................................................................................................................18
 
2.3
 
A
SSEMBLING PROCEDURE
................................................................................................................................28
 
3.
 
ROM RE-FLASH PROCEDURE
........................................................................................................................................42
 
3.1
 
ROM
UPGRADE THRU
RUU
 
(R
E
-
FLASH
U
PGRADE
U
TILITY
)................................................................................42
 
3.2
 
ROM
 
I
MAGE UPGRADE THRU
SD
CARD
.............................................................................................................46
 
4.
 
DIAGNOSTIC PROGRAM
..................................................................................................................................................48
 
4.1
 
L
IST OF
D
IAGNOSTIC
T
EST
I
TEMS
......................................................................................................................48
 
5.
 
POWER MEASUREMENT TEST
......................................................................................................................................62
 
5.1
 
M
AIN BOARD LEAKAGE CURRENT
T
EST
P
ROCEDURE
..........................................................................................62
 
5.2
 
B
ATTERY RUNDOWN TEST PROCEDURE
..............................................................................................................66
 
6.
 
COSMETIC INSPECTION CRITERIA
...............................................................................................................................71
 
6.1
 
C
LASSES DEFINITION OF INSPECTIVE AREA
.........................................................................................................71
 
6.2
 
D
ISPLAY INSPECTION
........................................................................................................................................74
 
6.3
 
M
AIN UNIT INSPECTION
.....................................................................................................................................75
 
7.
 
GENERIC TROUBLESHOOTING
.....................................................................................................................................78
 
8.
 
GENERIC LABELING PLAN
..............................................................................................................................................83
 
9.
 
GENERIC SPARE PART LIST AND PHOTOS
................................................................................................................87
 
9.1
 
SPL
FOR
R
EPAIR
..............................................................................................................................................87
 
9.2
 
B
OARD
L
EVEL
2.5
 
R
EPAIRS
..............................................................................................................................92
 
10.
 
RF ANTENNA SPECIFICATION
...................................................................................................................................95
 

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