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) Increasingly larger substrate requirements have spurred advances in semiconductor manufacturing, explaining the increasing importance of the pumping performance of vacuum pumps in etching, chemical vapor deposition (CVD), and physical vapor deposition (PVD) to satisfy ultraclean environment requirements. However, using oil-free backing pumps in combination with the TMP to satisfy ultraclean environment requirements is problematic.
Therefore, this work describes a novel vacuum performance system (based on OR according to) ISO standards with automatic testing and human-machine interface functions.
Pumping performances are evaluated based on the flow meter method. The flow rate is then adjusted to obtain a balanced inlet pressure. Next, the pumping speed based on the difference of inlet pressure and ultimate pressure is divided by the throughput. Additionally, results of the experimental pumping speed are compared with those of the simulations.