Nu Horizons April 2011 Edition of Portal

April 2011
Americas Edition
Your
Gateway
to Today’s
Leading
Technology
Products
FOCUS ON
MEMORY
GSI Technology
36Mbit SyncBurst and NBT
SRAMs
ISSI
High Speed Low Power 4Mb
SRAM
MICRON
Parallel NOR Flash for
Embedded Applications
Phase Change Memory
RealSSD™ C400 Solid State

Drives
Serial NOR Flash for Embedded

Applications
STMICROELECTONICS
Dual Interface EEPROM
In
AUDIO/VIDEO DISPLAYS
Gennum Sharp
This
DEVELOPMENT TOOLS MICROCONTROLLERS
Exar Nuvoton
Lattice Semiconductor STMicroelectronics
Simple.
STMicroelectronics
Issue:
Useful.
Power Management Programmable.
DATACOM Lineage Power
Micrel Linear Technology
SMSC See page 15
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PO R TAL CONTENTS
FEATURED APPLICATION - FOCUS ON MEMORY
Memory Applications Overview 4-5
Nu Horizons Wireless Product Matrix 6
GSI Technology 36Mbit SyncBurst and NBT SRAMs 7
ISSI High Speed Low Power 4Mb SRAM 8
Nu Horizons Electronics is a leading Micron Parallel NOR Flash for Embedded Applications 9
distributor of advanced technology
Micron Phase Change Memory 10
semiconductor, display, illumination,
Micron RealSSD™ C400 Solid State Drives 11
power, system and telecommunication
solutions to a wide variety of commercial
Micron Serial NOR Flash for Embedded Applications 12
original equipment manufacturers STMicroelectronics Dual Interface EEPROM 13
(OEMs) and electronic manufacturing
services providers (EMS). DEVELOPMENT TOOLS
Exar Programmable Power Controller, Configuration 14
With sales facilities in 45 locations Board, and PowerArchitect ™ 3.0 Software
across North America and Asia and
Lattice Semiconductor Lattice Semiconductor Breakout Boards 15
regional logistics centers throughout
STMicroelectronics STM8L-DISCOVERY 15
the globe, Nu Horizons partners with
a limited number of best-in-class
suppliers to provide in-depth product FEATURED COMPONENTS
development, custom logistics and Audio / Visual Gennum’s 3rd Generation Video Optical Modules 16-17
life-cycle support to its customers.
Micrel — Low-power, Highly Integrated, 4/5-port
Datacom 18
Layer-2 Switch-on-a-Chip ICs
SMSC — Hi-Speed USB 2.0 to 10/100/1000 Gigabit
Datacom 19
Ethernet Controller
Nuvoton — High Precision 24-bit ADC for Weight
Microcontrollers 20
Scales and Precision Measurement Markets
STMicroelectronics — 32-bit Flash microcontrollers,
Microcontrollers 120 MHz/150 DMIPS with ART Accelerator™ and 21
advanced peripherals
Lineage Power — Barracuda™ Power Modules;
Power Management 22
DC-DC Converters
Linear Technology — Octal PMBus Power Supply
Power Management 23
Monitor and Controller with EEPROM
Linear Technology — Offline Isolated Flyback LED
Need more information Power Management 24
Controller with Active PFC
right away?
APPLICATION NOTES
Lattice Semiconductor, Micrel, Using a Micrel Ethernet PHY and a Lattice ECP3
25
Wurth Midcom FPGA to Create an Ethernet Subsystem
Lattice Semiconductor, Creating a Power Subsystem for Lattice XP2 FPGAs
25
Linear Technology using Linear Technology Power Devices
Just use your smartphone to

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this publication and you'll link Linear Technology Cooking with LTspice Seminar Series 2
to more detailed information. The PN-E Series High Performance Professional
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LCD Monitors
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Nu Horizons 27-31
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does not assume any liability for its accuracy. Prices are
subject to change without notice.
Memory Applications
FOC U S ON MEMORY
We will review a few common applications to illustrate how the different

memory technologies advantages and disadvantages influence device
selection.
Microprocessor / Microcontroller Data Storage
Many Microprocessor (MPU) or External data memory capacity and low cost. NAND Flash
Microcontroller (MCU) applications MC U /MPU SRAM/PSRAM Using MCU/MPUs SRAM Interface is block oriented and thus can’t be
require external data memory to Dat a St or age used directly for Execute in Place
store intermediate data used during (Data used for small computation) applications, but is well suited for
computations or data transfer. Transfer and Execute architectures.
Large audio files or video frames External data memory Code can be transferred a block at a
will typically require more memory MC U /MPU
DRAM Dat a Using MCU/MPUs DRAM Interface time into DRAM (or even low power
that an MCU or MPU has internally. St or age SRAM) and if a simple memory
If large amounts of data need to be (Data used for large computation) management controller is used not
accessed then DRAM is usually the all the code needs to reside in the
best alternative. For small amounts External data memory
DRAM (or SRAM). This approach can
of data SRAM or PSRAM (DRAM EEPROM Dat a Using MCU/MPUs EEPROM Interface further reduce power consumption
MC U /MPU
with an SRAM interface and hidden St or age since a smaller execution memory
refresh for those of you who skipped (Data used for Configuration) can be used.
the memory Technology overview) are
Figure 1: MCU/MPU Data Storage Examples
good choices.
Communications
Data that needs to be modified as well may make sense. If the low
Microprocessor / power modes of the DRAM can Interface Memory
frequently, like intermediate data Communications processors,
Microcontroller Code reduce power significantly this can
during computation most will usually in the form of a specialized
Storage be an improvement over the use of
most likely need to use a Volatile high-performance processor with
One of the more common applications a separate code only storage device.
technology- SRAM or DRAM. If the integrated communications oriented
for semiconductor memory is The data transfer from code storage
data is written to less frequently, peripherals, form the backbone of
as external code storage for to DRAM will require a small boot
perhaps to store configuration data most modern communications
Microprocessors or Microcontrollers. loader and will extend the initialization
that needs to be saved between
Most Microprocessors units (MPU)
power cycles (like brightness levels
require external code storage
for LEDs displays in a kiosk) then
while most MCUs have internal DRAM Dat a
EEPROM devices are a good fit. Small Code is accessed directly by the
code storage. In some applications St or age
amounts of data can be easily written processor
however MCU internal code is not
to, typically at the byte level, using MCU/MPU
large enough for the application (Execute in Place)
EEPROM. NOR Flash Code
making it necessary to add external St or age
Many times the external memory code storage to the design.
controller within the MCU/MPU may
dictate the choices available to the Deciding on the type of memory
DRAM or SRAM
designer. Some processors have device to use for external storage MCU/MPU Dat a/Code Code is transferred to the Data
built-in SRAM, DRAM or EEPROM will depend whether the processor St or age Memory and then accessed by the
will need to execute code directly processor
interfaces or even Flash controllers.
Determine the types of interfaces your out of the external device (Execute NAND Flash (Transfer and Execute)
MCU/MPU supports (or even better in Place) or if the code can first be Code St or age
select an MCU/MPU with your optimal read out of the code storage device
memory interface in mind) and and loaded into another memory Figure 2: MCU/MPU Code Storage Examples
then select the best memory device from which the processor accesses
from those supported by your MCU/ code (Transfer and Execute). Many
MPU. Figure 1 shows three common times the additional memory is a time of the processor, but if these systems. These data hungry
architectures- one where a small high capacity DRAM, perhaps with considerations are not critical then algorithms typically require external
amount of external data is required extra low power features. Initially the Transfer and Execute approach memory to buffer data and to
and an SRAM/PSRAM is sufficient, it might seem like this takes an can provide advantages. help route packet data to the right
one where the data requirement is additional memory device, but if the receiving process. The example
larger and a DRAM is needs and processor needs an external data For Execute in Place code storage communications system in Figure 3
one where the data is modified memory anyway (perhaps for storing Flash memory with random access, shows a communications processor
infrequently and an EEPROM is the large intermediate video or audio like that found with NOR devices between multiple asynchronous
best choice. files), the use if it for code execution can be utilized and provides high communications channels and a
4
FOC U S ON MEMORY
Memory applications are as varied as memory technologies, but have
some common considerations (performance, cost, power and memory
use model) that can be used to help select the right technology for a
specific application.
high-speed Gigabit Ethernet port. During packet processing it will be Applications for this type of design convenient option for Instrumentation
The communications channels need important for the Communications include environmental sensors (like designs that need to move captured
to be consolidated, packetized and Processor to have fast access to temperature, chemical or radiation data to a laptop computer for further
transferred over the Gigabit Ethernet the routing tables and various QoS detectors), medical instruments (like processing is a USB Flash drive. The
port. Communications traffic needs to metrics needed to route packets blood glucose meters or heart rate drive can be easily removed from the
meet specific Quality of Service (QoS) efficiently. These tables will need monitors), inventory control scanner/ handheld device and inserted into a
requirements so the Communications to be updated frequently as traffic recorders, or automotive sensors laptops USB port.
Processor needs to prioritize traffic in rates changes and sender/receiver (tire pressure or air bag deployment
order to achieve the required service pairs attach and detach. An RLDRAM devices)- just to name a few. The intermediate data used by the
levels. is a good choice for the high- data processing algorithm can be
stored in low-power Mobile DDR
SDRAM. In between measurements
High-speed Communications the Mobile DDR SDRAM can be put
Processor FIFO into a low-power mode that disables
Gigabit
Ethernet memory accesses to save power.
Channel Data in the memory is retained
Consolidation and and can be accessed when a new
Multiple measurement is required. Some
RLDRAM Packet Processing
FPGA Communications applications might be able to save
Routines data from the SDRAM to Flash
Channels
and then power down both the
SDRAM and the MPU completely,
Figure 3: Example Communication System Memory Requirements
reducing power consumption even
more. When operation resumes the
Communication systems speed, low latency and random Hundreds of applications will use MPU will wake-up, read data from
typically require synchronization access requirements of this type of architectures similar to that shown in Flash and load it into SDRAM so
between various asynchronous algorithm. Many Communications Figure 4. processing can continue.
communications channels and so Processors have RLDRAM interfaces
it is in the example design. A FIFO built-in, making it easy to implement The data storage memory needs to
memory is an excellent way to RLDRAM-based packet processing be removable and easily read/written
transition from one clock domain to systems. to by the MPU. Standard interfaces
another since the write port of the like those used for Memory Cards
FIFO can run independently from the (like CompactFlash, Secure Digital,
Handheld
read port. The FIFO also provides or MicroSD) are possible options and
Instrumentation- Code
the needed buffering so that data provide a significant amount of data
can be transferred at different burst and Data Storage in a small and compact format. A
rates, since channel inputs will not A variety of battery operated hand-
always be delivered at the same rate held instrumentation applications-
that the channel output needs to from simple power meter monitors
to complex automatic electronic LCD Panel Mobile
process data. In our example design
an FPGA is used to consolidate the defibrillators- use MCU or MPU Low-Power MPU DDR
multiple Communications Channels, based processors to run the SDRAM
algorithms required to capture,
USB Flash
and then to transfer the data to LCD Control,
process and record data from a Memor y
the FIFO one buffer at a time. The Data Processing,
Communications Processor reads variety of inputs that are usually User Interface Keypad
the data from the FIFO, consolidates analog. In the example design Analog LEDs
and packetizes the data for optimal shown in Figure 4, a low-power Inputs Switches
transmission over the Gigabit MCU is used to sense analog inputs,
Ethernet port. The FIFO effectively process the inputs to create a digital
‘bridges’ the processor time domain recording and store a summary of Battery Charger/ Batter y
from the communications time the measurement in non-volatile Power Manager
domain. memory that can be removed
from the instrument for archival
storage or further processing. Figure 4: Example Low-Power Data Memory for Example Handheld Instrumentation Application
5
Memory Offering Matrix
Non-Volatile Volatile Specialty
EEPROM EPROM Flash DRAM SRAM Memory
Serial EEPROM
Parallel EEPROM
Serial EPROM
Parallel EPROM
Serial NAND Flash
Serial NOR Flash
Parallel NOR Flash
Flash Cards
SSD Flash
DRAM
SDRAM
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
RLDRAM
Mobile DDR SDRAM
PSRAM
SRAM
DDR SRAM
QDR SRAM
FIFO
NVRAM
Storage Controllers
X
X X X X X X
X X X
X X X X X X X
X
X X X X X X X X X X X X
X X X X
X X X X X
X X X
X X
X
X X X X X
X X X X X X X X
EEPROM: Electrically Erasable Programmable Read Only Memory DDR2 SDRAM: Double Data Rate Two SDRAM transfers data at twice the rate of DDR.
EPROM: Erasable Programmable Read Only Memory DDR3 SDRAM: Double Data Rate Three SDRAM transfers data at twice the data rate of DDR2.
Flash: EEPROM type memory erased in large blocks RLDRAM: Reduced-Latency DRAM offers fast SRAM-like random access and provides sustained bandwidth over that available from DDR3-type devices.
NOR: A Flash implementation where the memory cells are interconnected using a NOR topology that provides a random access capability, similar to standard memories. Mobile DDR SDRAM: Low Power SDRAM designed for battery operated hand-held mobile devices
NAND: A Flash implementation where the memory cells are interconnected using a NAND topology that provides block-based access capability, similar to hard disks and memory cards. PSRAM: Pseudo Static DRAM uses DRAM technology for high density but implements a standard SRAM interface, hidden refresh and SRAM pin compatibility to simplify design and
Serial Interface: An interface method where data is read/written serially, over a small number of pins to minimize device cost. reduce power.
Parallel Interface: An interface method where data is read/written in parallel, over a large number of pins to maximize bandwidth. SRAM: Static Random Access Memory
Flash Cards: Are high capacity data storage in a card format typically used in hand-held devices like cameras, cell phones and portable instruments. DDR SRAM: Double Data Rate SRAM transfers data in bursts at twice the rate of SRAM by using both edges of the clock.
SSD Flash: Solid State Drive Flash devices offer ultra-high capacity in a solid state format to replace traditional mechanical (disk) storage systems. QDR SRAM: Quad Data Rate SRAM transfers data in bursts at twice as fast as SRAM using both edges of the clock and can read and write simultaneously.
DRAM: Dynamic Random Access Memory- High capacity memory where data is stored on a capacitor and must be periodically refreshed or data will be lost (therefore dynamic). FIFO: First In First Out memory is used to buffer data between two different time domains like those frequently encountered in communications application.
SDRAM: Synchronous DRAM uses a clocked interface (synchronous) to simplify system timing. NVRAM: Non-Volatile SRAM provides battery back-up when power is removed to keep data from being lost.
DDR SDRAM: Double Data Rate SDRAM clocks data on both edges of the clock to improve bandwidth without large increases in pin count. Storage Controllers: Provide the control necessary to create NAND Flash-based USB memory systems.
36Mbit SyncBurst and NBT
SRAMs
FOC U S ON MEMORY
With speeds up to 400MHz, these SRAMs are a perfect fit for
upgrades to current designs that are needing a bit more speed, or
for new designs that require higher speed bins.
GSI Technology has introduced a new sampling now. Pricing ranges from $40.00 to
screaming fast 36Mbit SyncBurst/NBT family $60.00 in 1,000 piece quantities, depending on
of SRAMs. GSI’s GS832xA family includes speed and configuration.
pipelined, flow through, and NBT™ Fast A complete set of design options:
SRAMs with speeds up to 400 MHz in TQFP and  SCD Burst, DCD Burst, NBT
BGA packages. Both commercial and industrial  x18, x32, x36 data bus widths
temperature ranges are offered as standard  2.5 V/3.3 V & 1.8 V/2.5 V supply options
products.  FLXDrive™ Programmable outputs
GSI Technology’s 36Mbit SyncBurst™  IEEE 1149.1 boundary scan
and NBT™ products are ready for customer  Industrial temperature range = standard
Package Supply
Functions: Organizations: Speeds (MHz): GSI Part#s:
Options: Voltage:
GS8320xxAGT-nnn
2.5–3.3 V 400–150 GS8320ExxAGT-nnn
SyncBurst™ (SCD) 2Mb x 18 GS8320ZxxAGT-nnn
SyncBurst™ (DCD) 1Mb x 32 100 TQFP
1Mb x 36 GS8320xxAGT-nnnV
NBT™
1.8–2.5 V 333–150 GS8320ExxAGT-nnnV
GS8320ZxxAGT-nnnV
GS8321xxA(G)D-nnn
2.5–3.3 V 400–150 GS8321ExxA(G)D-nnn
SyncBurst™ (SCD) with JTAG 2Mb x 18 GS8321ZxxA(G)D-nnn
SyncBurst™ (DCD) with JTAG 1Mb x 32 165 BGA
1Mb x 36 GS8321xxA(G)D-nnnV
NBT™ with JTAG
1.8–2.5 V 333–150 GS8321ExxA(G)D-nnnV
GS8321ZxxA(G)D-nnnV
2.5–3.3 V 400–150 GS8322xxA(G)B-nnn
119 BGA
2Mb x 18 1.8–2.5 V 333–150 GS8322xxA(G)B-nnnV
SyncBurst™ (SCD/DCD) with JTAG 1Mb x 36 2.5–3.3 V 400–150 GS8322xxA(G)D-nnn
165 BGA
and FlexDrive™ 1.8–2.5 V 333–150 GS8322xxA(G)D-nnnV
2.5–3.3 V 250–133 GS8322xx(G)C-nnn
512K x 72 209 BGA
1.8–2.5 V 250–133 GS8322xx(G)C-nnnV
2.5–3.3 V 400–150 GS8322ZA(G)B-nnn
119 BGA
2Mb x 18 1.8–2.5 V 333–150 GS8322ZA(G)B-nnnV
1Mb x 36 2.5–3.3 V 400–150 GS8322ZA(G)D-nnn
NBT™ with JTAG and FlexDrive™ 165 BGA
1.8–2.5 V 333–150 GS8322ZA(G)D-nnnV
2.5–3.3 V 250–133 GS8322Z(G)C-nnn
512K x 72 209 BGA
1.8–2.5 V 250–133 GS8322Z(G)C-nnnV
Scan barcode for more GSI SyncBurst and

NBT SRAM information
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal 7
High Speed Low Power 4Mb SRAM
FOC U S ON MEMORY
SRAM with Error Correction
ISSI’s latest Error Correction based 4Mb High Speed Low Power SRAM
is currently sampling. This innovative design reinforces ISSI’s long-term
commitment to SRAMs with the highest quality and performance. This
industry’s first Error Correction Code (ECC) based Asynchronous SRAM meets
high quality requirements in automotive, industrial, military-aerospace, and
other applications.
Error Detection and Error Correction
 Independent ECC with hamming code for each byte

APPLICATIONS:
 Detect and correct one bit error per each byte
 Automotive
 Better reliability than parity code schemes which can only detect an  Military-Aerospace/Medical
error but not correct an error  Industrial
 Backward Compatible: Drop in replacement to current in industry  Telecom/Networking
standard devices (without ECC)
FEATURES:
IS64WV25616EDBLL (A1) IS64WV25616EDBLL (A3) Comments

Industrial Automotive Contact ISSI for military
Temperature Support
(-40oC to +85oC) (-40oC to +125oC) temperature
Technology 65nm 65nm
Standby Current 9mA 20mA Typical value 2mA
Operating Current 45mA 65mA Typical value 25 mA
Data Retention Current 9mA 15mA Typical value 2mA

TSOP-II (44 pins) TSOP-II (44 pins) Pin compatible with industry
Packaging
BGA (48 pins) BGA (48 pins) standard 4Mb Async. SRAM
Speed 10ns 10ns
Improved thermal
Copper Leadframe Yes Yes
performance
Lead-free and Leaded Yes Yes RoHS Compliant
Availability Sampling Sampling
Memory ECC - Memory ECC -

A0-A17 Lower I-O Array Upper I-O Array
Decoder 256K 256K
Array Array
x4 x4
256Kx8 256Kx8
8 4 8 4
IO0 -7 8 8 12
I/O Data ECC
8 8 12 Column I/O
IO8 -15 Circuit ECC
/CE
/OE
Scan barcode for more information on ISSI's /WE Control
4Mb SRAM solutions /UB
/LB
Circuit
8 For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Parallel NOR Flash for Embedded
Applications
FOC U S ON MEMORY
Fast, Dependable Performance
Today’s applications demand an and mobile products such as cell phones,

unprecedented combination of features—high smartphones, e-readers, GPS/navigation,
performance, high density, high reliability, and and other portable, handheld, multitasking
low-power operation. Strike a balance among applications. With high densities, execute-in-
performance needs, design requirements, and place (XIP) performance, architectural flexibility,
cost by equipping your demanding platforms and a track record of proven reliability, our
with our reliable, high-performance parallel parallel NOR solutions are also ideal for long-
NOR. term placement in rigorous industrial settings.
Our parallel NOR solutions are constructed

to meet the design requirements of consumer
FEATURES: BENEFITS:
Density 2Mb–1Gb Industry-standard densities
Performance Burst, Page, Multibank, & Multi I/O A broad range of performance options across the product line
Block/Sector Locking
OTP Protection Register
Smart Secure Krypto® Encrypted Access
Security HW/SW Protection
Modifiable Security Device State
Protection After Power-Up
Krypto® Password Access Write Protection
Voltage 1.8V VDD, 3.0V VDD, 1.8V I/O, 3.0V I/O, 5.0V I/O Full product voltage range
PARALLEL NOR PRODUCT FAMILY OVERVIEW

Core Multibank Security
Family I/O Voltage Bus Width Density Range Burst Access Time Package Options
Voltage Option Features
P30 1.7-2.0 1.7-3.6 x16 64Mb–2Gb† X X 52 MHz burst TSOP, eBGA, QUAD+
P33 2.3-3.6 2.3-3.6 x16 64Mb–2Gb †
X X 52 MHz burst TSOP, eBGA
100-110ns
M29EW 2.7-3.6 1.65-3.6 x8, x16 32Mb–2Gb† X TSOP, BGA
25ns page
M29W 2.7-3.6 2.7-3.6 x8, x16 4Mb–256Mb X 45-90ns TSOP, TBGA
M29DW 2.7-3.6 2.7-3.6 x8, x16 32Mb, 128Mb–256Mb X 90ns TSOP, TFBGA
M29F†† 5 5 x16 2Mb–16Mb 55ns TSOP, SO, KGD
75ns
J3 2.7-3.6 2.7-3.6 x8, x16 32Mb–256Mb X TSOP, eBGA
95ns (256Mb)
M28W 2.7-3.6 1.65-3.6 x16 16Mb–64Mb X 70-100ns TSOP, TFBGA
2.7-3.6 2.7-3.6
45-70ns
M58BW 2.5-3.3 2.5-3.3 x32 16Mb–32Mb X PQFP, LBGA
56-75 MHz burst
(55ns) (55ns)
85ns
M58LT 1.7-2.0 2.7-3.6 x16 128Mb–256Mb X X X TBGA
52 MHz burst
†
Stacked solution
††
Automotive temp available
Scan barcode for more Paralell

NOR Flash information
Phase Change Memory
FOC U S ON MEMORY
Change your design, change the world
Are the constraints of traditional memory architectures holding back your groundbreaking
designs? New, revolutionary phase change memory (PCM) merges the best attributes of
NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory
chip.
With byte alterability (or overwrite capability), Micron PCM improves system-level
performance and simplifies software design. Higher endurance further reduces software
management and improves system-level reliability.
FEATURES:
Parallel PCM Before
P5Q Serial PCM
Micron’s 128Mb 90nm serial device is purpose-built to meet the memory requirements
of embedded systems, delivering multiple I/O capability and compatibility with familiar
SPI NOR interfaces. Combining NOR and EEPROM technology benefits into one, P5Q
serial PCM provides solutions for today and beyond.
 Byte alterable: overwrite capability
 Endurance: 1 million WRITE cycles
 Density: 128Mb (90nm lithography)
 I/O bus width: quad (single/dual supported)
 66 MHz (maximum) single/dual I/O
 50 MHz (maximum) quad I/O
 Programming time: 0.9 MB/s Parallel PCM After
 Single supply voltage: 2.7–3.6V
 Package: SOIC-16
 Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C
P8P Parallel PCM

Micron’s128Mb 90nm parallel device is designed to meet the memory requirements
of embedded systems. P8P parallel PCM enhances overall performance, simplifies
software management, and improves system-level reliability.
 Byte alterable: overwrite capability
 Endurance: 1 million WRITE cycles
 Density: 128Mb (90nm lithography)
 Programming time: 0.9 MB/
 Voltage range: 2.7–3.6V VCC; 1.7–3.6V VCCQ
 Packages: 56-pin TSOP; 64-ball Easy BGA (8x10mm)
 Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C
Serial PCM Before
APPLICATIONS:
 Power grid/power metering
 Medical monitoring
 Network/security cameras
 Display systems
 Industrial printers
 Network routers
 Data logging intensive applications
Scan barcode for more Micron

Phase Change Memory information
Serial PCM After

RealSSD™ C400 Solid State
Drives
FOC U S ON MEMORY
Design In Industry-Leading PC Performance
Our RealSSD™ C400 SSDs are client- Our global network of experts are dedicated
focused hard drive replacements that provide to resolving issues and ensuring optimum
dramatic improvements in power, performance, solutions. We control the SSD BOM for easy
and reliability.These SSDs provide breakthrough supply chain management and our
performance for notebook and desktop applications. extensive product qualification
By combining our MLC NAND technology and translates to predictably reliable,
optimized NAND management algorithms, we’re high-quality drives.
able to improve boot and application load times
and lower power consumption to create a better
overall user experience.
C400 ADVANTAGES FOR CLIENT APPLICATIONS:

Performance
 Improves boot times and speeds application launches, delivering information on demand. APPLICATIONS:
Reliability  Notebooks
 Withstands extreme shock and vibration, ensuring higher reliability in the most demanding environments.
 Consumer applications
Low Power  High-performance desktops
 Consumes significantly less power than typical hard drives.
 Industrial computing
Lightweight
 Weighs less than HDDs, providing high-capacity storage with maximum portability.
Compatibility
 Backward compatible to SATA 3 Gb/s, making them easy-to-adopt, drop-in HDD replacements.
NAND Expertise
 Leverages Micron’s proven quality and test capabilities to provide best-in-class drive reliability.
Part Density Version Size* Voltage Read (MAX) Write (MAX)

MTFDDAA064MAM-1J1 64GB C400v 1.8“ (5mm) 3.3V 415 MB/s 95 MB/s
MTFDDAA128MAM-1J1 128GB C400 1.8“ (5mm) 3.3V 415 MB/s 175 MB/s
MTFDDAA256MAM-1K1 256GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s
MTFDDAA512MAM-1K1 512GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s
MTFDDAC064MAM-1J1 64GB C400v 2.5” (9.5mm) 5V 415 MB/s 95 MB/s
MTFDDAC128MAM-1J1 128GB C400 2.5“ (9.5mm) 5V 415 MB/s 175 MB/s
MTFDDAC256MAM-1K1 256GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s
MTFDDAC512MAM-1K1 512GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s
MTFDDAK064MAM-1J1 64GB C400v 2.5” (7mm) 5V 415 MB/s 95 MB/s
MTFDDAK128MAM-1J1 128GB C400 2.5” (7mm) 5V 415 MB/s 175 MB/s
MTFDDAK256MAM-1K1 256GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s
MTFDDAK512MAM-1K1 512GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s
*Package height in millimeters.

RealSSD™ C400 information
Serial NOR Flash for Embedded
Applications
FOC U S ON MEMORY
High-performance serial Flash memory with maximum design

flexibility for the most demanding applications
Micron offers the industry’s most Five serial NOR Flash lines are offered—the requirements for automotive-grade and industrial
comprehensive portfolio of serial NOR Flash N25Q, M25P, M25PX , M25PE, and M45PE—to applications.
memory, delivering a flexible spectrum of provide a complete choice of densities, feature
performance features and a broad density range sets, and packaging options. With its broad
to deliver long-term architectural continuity for portfolio and multiple subsector erase
embedded designs. options, Micron’s serial NOR Flash meets the
requirements of many segments, including
Micron serial Flash delivers flexibility and
consumer electronics, handheld gaming,
scalability with standard interfaces, enriched
computing, networking, and enterprise
features, and backward compatibility to simplify
applications. In addition, the N25Q, M25P, and
your design and help you get to market quickly.
M25PX families are AEC-Q100 qualified
What’s more, it's a product line that offers longevity
to meet the most exacting
and reliability.
ADVANTAGES FOR NEW MULTI-I/O N25Q FAMILY:

Best Performance in the Market: Enhanced Flexibility:
 Max clock 108 MHz in all conditions  Configurable number of dummy cycles
 Quad I/O equivalent clock frequency up to 432 MHz  Output buffer strength configurable
 54MB read throughput  Volatile and nonvolatile configurability
Voltage: Advanced Write Protections:
 3V and 1.8V supply voltage  UID preprogrammed in factory and 64-byte OTP area; user lockable,
Multi I/O Support: nonvolatile protection and permanent block lock
 Legacy x1, dual, and quad I/O Program/Erase Suspend
Erase Capability: Packaging focus is on footprint compatibility, reliability, and time-to-market
 Uniform subsector (4KB) and uniform sector 64KB granularity Automotive grade products qualified to +125ºC
APPLICATIONS:
Due to its diverse attributes, serial Flash memory has found its way into several embedded applications, from printers to graphic cards; gaming consoles to
PC BIOS; DVD/Blu Ray writers and players to answering machines; as well as video recorders, routers, Bluetooth devices, and Wi-Fi modules. Applications that
require speed can use serial Flash with quad I/O or XIP mode. Applications not requiring high performance can take advantage of the simplicity of a single I/O
implementation. New applications using serial Flash memory include WiMAX devices, set-top-boxes, low-end cellular phones, and netbooks.
Max Clock /
Product Density
Power Erasable Sectors Temp (°C) Max Transfer Package Technology
Family Range
Rate
2.7–3.6V; 108 MHz/
N25Q 4KB Uniform, 64KB Uniform –40 to +85 32–256Mb MLP, SO, TBGA 24 65nm
1.7–2.0V 54 MB/s
50, 75 MHz/
M25P 2.3–3.6V* 32KB or 64KB Uniform –40 to +85 512KB–16Mb SO, MLP, TBGA 24 110nm, 150nm
6, 9 MB/s
75 MHz/
M25PX 2.3–3.6V* 4KB Uniform, 64KB Uniform –40 to +85 8–16Mb SO, MLP, TBGA 24 110nm
19 MB/s
75 MHz/
M25PE 2.3–3.6V* 256B, 4 KB, 64KB Uniform –40 to +85 1–16Mb SO, MLP 110nm
9 MB/s
75 MHz/
M45PE 2.3–3.6V* 256B, 64KB Uniform –40 to +85 1–16Mb SO, MLP 110nm
9 MB/s
*2.7 –3.6V supported by all densities; 2.3–3.6V supported only for specific densities.

Serial NOR Flash Memory information
Dual Interface EEPROM
FOC U S ON MEMORY
M24LR64, 64-Kbit EEPROM with I²C and 13.56 MHz
ISO 15693 RF interfaces
The innovative family of Dual Interface EEPROM provides new features

and capabilities. The EEPROM memory bank can be accessed either by a
standard I²C interface or by an ISO 15693 RF interface operating at 13.56
MHz. In addition, the family features a 32-bit password protection mechanism.
FEATURES:
 Industry standard interfaces:

 I2C: 400 kHz, from 1.8 to 5.5 V
 ISO 15693: 53 Kbit/s data rate, up to 1 m remote access range
APPLICATIONS:
 64-Kbit EEPROM user memory
 64-bit unique identifier Two worlds connected
 32-bit password protection The ability to program or read a memory using either an RF or
 13.56 MHz carrier frequency a wired interface enables designers to imagine and develop
new functions and capabilities for their products. It is a good fit
for a wide range of applications including:
BENEFITS:  medical equipment
 industrial equipment
 Most flexible solution for parameter updates
 factory and building automation
 Passive RFID technology: no onboard power required to access the device in RF mode
 computers and peripherals
 High reliability EEPROM
 consumer electronics
 Flexible password protection scheme
 Simple and cost-effective implementation
DUAL INTERFACE EEPROM TOOLS
 Enabling new functions and capabilities for:
 Starter kit: RF-I²C enabled programmer with reference
 parameter update
antenna (order code: STARTKIT-M24LR-A)
 firmware update
 Development kit: extensive tool for supporting product
 device calibration
integration (order code: DEVKIT-M24LR-A)
 product activation
 traceability information management
 asset tracking
 identification
DEVICE SUMMARY:
Clock
RF Serial Memory Size Supply Voltage
Part Number Frequency Password Package
Interface Interface (Kbit) (V)
(kHz)
M24LR64-RMN6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 SO8
M24LR64-RDW6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 TSSOP8
M24LR64-RMB6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 MLP2X3
Scan barcode for more ST

Dual Interface EEPROM information
Programmable Power Controller,
D EVELOP MEN T TOOLS
Configuration Board, and

PowerArchitect ™ 3.0 Software
Everything You Need to Become an Expert Digital Power Designer!
Exar’s Programmable Power Development Kit affords the user a quick on- Power Controller Features:
ramp to finalizing digital power designs for a host of applications spanning
 Three or Four switching buck (step-down) controllers with internal FETs
mobile to industrial to high-performance computing. The XRP7713 device  Output voltages programmable from 0.9V to 5.1V
in the development kit is part of the PowerXR programmable power product  Up to Six reconfigurable GPIO pins
portfolio of highly configurable digital power step-down controllers that more  Fully programmable via the I²C interface
intelligently manage today’s power systems with up to four independent  Complete power monitoring and reporting
digital-control loops while integrating an on-board standby power LDO. With
Benefits:
four 12-bit resolution digital pulse width modulators (DPWM) with integrated
gate drivers, the XRP7713 uses a digital PID control algorithm to perform  PowerXR integrate the best of both worlds – the low cost and flexibility of
digital power management and control, and the robust power capabilities
full digital loop control at switching frequencies up to 1.5MHz. These power
of analog switching power supplies.
system controllers are fully addressable and configurable via an I²C interface
 Use of PowerXR devices reduce development time from weeks to hours
for monitoring, control and management of DC to DC pointof- load power enabling a significant time-to-market advantage.
conversions.  PowerXR devices permit real-time power system adjustments during
design, in response to changing requirements or even after field-
deployment.
These power ICs integrate the best of both worlds – the low cost and flexibility Applications:
of digital power management and control, and the robust power capabilities of
 Consumer: Set-top box, IP Cameras, Servers
analog switching power supplies. PowerXR products will reduce development
 Industrial – Medical Equipment
time from weeks to hours enabling a significant time-to-market advantage.  Medical Equipment
Both PowerXR devices permit real-time power system adjustments during  Networking and Telecommunications Equipment
design, in response to changing requirements or even after field-deployment.  Point-of-Sale
Order Number Price

Scan barcode for more
Exar Programmable Power XRP7713EVB-DEMO-1-KIT $90
Development Kit information
XRP7714EVB-DEMO-2P-KIT $90
14 Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development
Lattice Semiconductor
D EVELOP MEN T TOOLS

Breakout Boards
Simple. Useful. Programmable.
The Lattice Breakout Boards are simple evaluation kits that allow the user to quickly
evaluate the capabilities of the POWR104A, LC4256ZE or LCMXO2280C devices.
Each board includes 8 LEDs which can be used for implementing simple counters
or similar functionality. With a majority of the I/O accessible to the user through
headers on the board, it is possible for a user to interface the Breakout Board with
a current design or even other evaluation boards. Programming is achieved through
the USB interface, and a USB cable is provided so users can begin working with the
boards right away. A quick start guide is also included with each Breakout Board to
shorten the learning curve.
Order Number Description Price

POWR1014A-B-EVN POWR 1014A Breakout Board $29.99
Breakout Boards LC4256ZE-B-EVN ispMACH4000ZE Breakout Board $29.99
information
LCMXO2280C-B-EVN MachXO Breakout Board $29.99
STM8L-DISCOVERY
The STM8L-DISCOVERY helps you to discover the STM8L ultralow power features
and to develop and share your applications. It is based on an STM8L152C6T6
and includes an ST-Link embedded debug tool interface, LCD (24 segments, 4
commons), LEDs and push buttons.
Features:
 STM8L152C6T6 microcontroller, 32 KB Flash, 2 KB RAM, 1 KB EEPROM in
48-pin LQFP
 On-board ST-Link with selection mode switch to use the kit as a stand-
alone ST-Link (with SWIM connector for programming and debugging)
 Two red LEDs; LD1 for USB communication, LD2 for 3.3 V power on
 Designed to be powered by USB or an external supply of 5 V or 3.3 V
 Can supply target application with 5 V and 3 V
 Two user LEDs, LD3 and LD4 (green and blue)
 Two push buttons (User and Reset)
 IDD current measurement
 LCD 28-pin DIP (24 segments, 4 commons)
 Extension header for all QFP48 I/Os for quick connection to prototyping
board for easy probing
Order Number Description Price Scan barcode for more information regarding
the STM8L-Discovery Kit
STM8L-DISCOVERY Discovery board for STM8L15x (32KB flash) MCUs $9.99
Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development 15
Gennum’s 3rd Generation
Video Optical Modules (VOMs)
AU D I O / VI D EO
The continued transition to HDTV within the professional broadcast industry, the advent of
1080p50/60 production, D-Cinema production and higher resolution / bit depth formats, are all
factors driving the widespread adoption and build out of 3G SDI capable broadcast infrastructure.
As this build out continues, broadcasters are increasingly looking to optical fiber interfaces for the
carriage and distribution of 3G SDI signaling within the plant. At these higher data rates, fiber optic
systems provide a number of advantages (to coax cabling), especially for long links. Optical fiber
installations also promise smaller and lighter trunking and in large installations on green-field sites,
the cost of installing a fiber infrastructure can be less than an equivalent coax cable installation.
Gennum’s video optical modules are engineered to provide industry leading optical performance
and robustness for mission-critical broadcast applications. The recently released second generation
offering extends Gennum’s leadership by providing new receiver technology with unmatched
overload, sensitivity and signal integrity.
Ro bust Performance
Not all optical modules are created equal. Gennum’s optical modules are built upon Gennum’s
excellence in both SDI and optical technology. Incorporating custom receiver silicon, Gennum
modules feature an exceptional dynamic range ensuring maximum interoperability with SMPTE297
compliant transmitters. Additionally, Gennum’s modules provide robust performance across all
operating conditions thereby ensuring a highly reliable optical link.
THIRD GENERATION PRODUCTS FEATURES:
BENEFITS:
 Robust performance across all operating conditions thereby ensuring a highly reliable optical link
 Optimized for short reach optical applications and offer design improvement and enhanced functionality
 Exceptional optical performance with pathological data:
AU D I O / VI D EO
 Receiver overload: 0dBm
 Best in class Receiver sensitivity: -23dBm
 Digital diagnostic interface for monitoring and control of module

 User writable EEPROM where equipment manufacturers can program their own information within the SFP to enable their equipment to identify
qualified modules
 SMPTE 297 compatible
 Small Form Pluggable (SFP) package saves board space requirements
 SFPs offer an improved mechanical design with a superior latching and delatching mechanism
 Pin-out designed so that one slot can be populated with a dual transmitter, dual receiver, single transmitter, single receiver, or a transceiver
 Both video and datacom pinout variants are available for all VOM products. This allows network equipment manufacturers to add optical SDI interfaces
to any existing products that were designed per the SFP MSA pinout rather than the defacto standard Video SFP pinout.
 Telecordia GR-468-CORE compliant
APPLICATIONS:
3G-SDI End Applications
 Any professional video broadcast SMPTE compatible optical-to-electrical interfaces
 High density video routers
 Professional video cameras and monitors
Scan barcode for more information regarding

Gennum's Video Optical Modules
Micrel’s Low-power, Highly
Integrated, 4/5-port Layer-2
Switch-on-a-Chip ICs
D ATAC OM
The KSZ8895/8864 product family achieves a 50 percent reduction

in power consumption compared to the previous generation.
Micrel’s KSZ8895/8864 family are low-power,

highly integrated, 4/5-port Layer-2 switch-on-a-chip
ICs. Leveraging Micrel’s latest green physical transceiver
and switch technology, the product family achieves a 50
percent reduction in power consumption compared to the
previous generation. Meeting the increasing demands
for Ethernet connectivity in consumer and industrial
applications, the family features advanced power
management and sophisticated Quality of Service (QoS)
capabilities.
QoS features such as tag and port-based VLAN
support and IPv6 priority classification make these
devices ideal for today's most demanding IP content
based applications in the digital home; IPTV, IP-STB (set
top box), VoIP (voice over IP), residential gateways and
GPON. The low emissions and Micrel's signature high
reliability and quality also make these devices suitable
for connectivity applications in the fast growing industrial
automation and automotive markets.
FEATURES: BENEFITS:
 Standard compliance ensures to work with other standard compliant,
 Fully-compliant to IEEE 802.3/802.3u Standard
already deployed devices.
 Single 3.3v supply with internal 1.2V LDO controller, and optional 3.3V,
 Enables low-power design and offers flexibility in design.
2.5V or 1.8V VDDIO
 On-chip termination (eliminating 4 external resistors/transceiver) not
 Integration of termination resistors on the chip only simplifies PCB design and reduces system BOM, but also
improves overall signal integrity and EMI emission.
 Energy Detect Power Down when the cable is not plugged; and power  Power consumption is optimized based on the status of the link or the
down/ slow oscillator mode when the device is not in use device.
 Provides faster spanning tree convergence after network topology
 Rapid spanning tree (RSTP) support
change (<6 sec vs. 30-50 sec for STP).
 2K Byte maximum packet size  Improves the efficiency of bulk data transfer, and system performance
 The use of 25MHz crystal as input reference clock no longer
 Internally generated 50Hz RMII reference clock eliminates the need for external oscillator. It reduces the system BOM
in the RMII mode.
 Auto-MDI/MDIX eliminates the need for cross-over cable, thus reduces
 HP Auto MDI/MDIX crossover support
installation costs. Easy to use.
APPLICATIONS:
 Digital TV / IP-STB  Broadband Gateway/router
Scan barcode for more  VoIP Gateway  GPON ONU
KSZ8895/8864 family information  Industrial Ethernet  Automotive
 Industrial Control
Hi-Speed USB 2.0 to 10/100/1000
Gigabit Ethernet Controller
SMSC Introduces the LAN7500
D ATAC OM
SMSC’s LAN7500 is a Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller providing a high-
performance and cost-effective USB to Ethernet connectivity solution. The LAN7500 contains an integrated
10/100/1000 Gigabit Ethernet PHY, USB PHY, Hi-Speed USB 2.0 device controller, 10/100/1000 Gigabit Ethernet
MAC, TAP controller, EEPROM controller and a FIFO controller with a total of 32KB internal packet buffering. The
device supports 10BASE-T, 100BASE-TX and 1000BASE-T Ethernet and implements Control, Interrupt, Bulk-in
and Bulk-out USB endpoints. The Ethernet controller supports auto-negotiation, auto-polarity correction, HP
Auto-MDIX* support and is compliant with IEEE 802.3/802.3u/802.3ab standards.
USB-based networking provides flexibility for the routing and placement of network connections anywhere
in the system. USB-based solutions leverage the existing USB stack for the Ethernet driver. The LAN7500 is also
available with a wide range of drivers including Windows®, Mac® and Linux®.
The LAN7500 also offers SMSC’s NetDetach™ and UniClock™ technologies. NetDetach allows for up to a
25% reduction in power by enabling the host CPU to enter a low-power state when Ethernet is inactive. UniClock
simplifies the clocking scheme and reduces system BOM cost by using a single 25MHz crystal for both USB and Ethernet connectivity. Multiple power management
features are provided, including various low-power modes and Magic Packet™, Wake-on LAN (WOL) and Link Status Change wake events. These wake events can be
programmed to initiate a USB remote wakeup. The device is available in commercial (0º to 70ºC) and industrial temperature range (-40º to 85ºC) options.
HIGHLIGHTS:
 Single-chip, Hi-Speed USB 2.0 to 10/100/1000 Gigabit  Easy upgrade for USB-based 10/100 Ethernet
Ethernet controller (LAN9500/9500A) to 10/100/1000 Gigabit Ethernet
 Implements NetDetach technology for reduced system power  Supports IEEE 802.3/802.3u/802.3ab standards
consumption  Industrial temperature range option available (LAN7500i)
 Supports EEPROM-less operation for reduced BOM costs  8x8mm, 56-pin QFN, lead-free RoHS-compliant package
 Requires only a single 25MHz crystal
FEATURES & BENEFITS:

 NetDetach technology allows the CPU to enter a low-power state when Ethernet is inactive
 UniClock technology utilizes a single 25MHz crystal, reducing BOM component count and cost
 Multiple Operating Systems are supported, including: Windows 7, Windows XP, Windows Vista®, Windows CE, PXE, DOS ODI, Mac and Linux – enabling
support for a wide variety of applications
 PME pin wake-up support reduces system power requirements
 Supports TCP segmentation offload and full hardware TxRx check–sum offloads (IPV4, IPV6, TCP, UDP), reducing CPU loading
APPLICATIONS:
 Embedded Systems  Digital TVs (DTVs)  USB Port Replicators
 Consumer Electronics Devices  Set-top Boxes  Stand-alone USB to Ethernet Dongles
 Netbooks/Smartbooks/MIDs  Personal Video Recorders (PVRs)  Industrial Designs
 Docking Stations  Network Printers
LAN7500 BLOCK DIAGRAM:

LAN7500 information
*HP Auto-MDIX eliminates the need for special “crossover” cables when connecting LAN devices together.
**LANCheck and USBCheck online design review services require an SMSC e-Services account and are subject to the terms and conditions listed on SMSC’s website. 19
High Precision 24-bit ADC for Weight
Scales and Precision Measurement
MI C R OC ON TR OLLER S
Markets– NAU7801 / NAU7802

The NAU780X is a high-performance, cost-effective, low-power
24-bit sigma-delta ADC designed specifically for Weight Scales,
Industrial Process Control, Strain Gauges, Data Acquisition,
Portable Instrumentation and Fluid/Gas Analyzers.
The NAU780X is a high-performance, cost- capable of up to 23-bit ENOB (Effective Number The Programmable Gain Amplifier (PGA)
effective, low-power 24-bit sigma-delta ADC Of Bits) performance. This device provides a provides selectable gains from 1 to 128,
designed specifically for Weight Scales, Industrial complete front-end solution for bridge/sensor depending on the usage of different applications.
Process Control, Strain Gauges, Data Acquisition, measurement such as in weigh scales, strain The A/D conversion is performed with a Sigma-
Portable Instrumentation and Fluid/Gas Analyzers. gauges, and many other high resolution, low Delta modulator and programmable FIR filter that
It delivers exceptional flexibility in performance sample rate applications. provides a simultaneous 50Hz and 60Hz notch
and optimization of power consumption, while filter to effectively improve interference immunity.
The many built-in features enable high
providing designers with development and test
performance applications with very low external The NAU780X’s powerful development
tools that can dramatically accelerate time to
parts count. NAU780X includes low drop-out platform and simple graphical user interface
market. With the on-chip LDO and less external
regulator and high precision oscillator. Moreover, development tools enable designers to efficiently
components, NAU780X can greatly reduce the
this device provides a standard 2-wire interface generate new designs, giving them interactive
BOM cost and PCB complexity.
compatible with I2C protocol for simple and programmability and predefined configuration
The Nuvoton NAU780X is a precision low- straightforward connection to and interoperation paths for test and development and shorten the
power 24-bit ADC, with an onboard low-noise with a wide range of possible host processors. time to market.
programmable gain amplifier (PGA), onboard Also, NAU780X reserves hardware space for the
RC or Crystal oscillator, and a precision 24-bit on-chip calibration registers and algorithm so as FEATURES:
sigma-delta analog to digital converter (ADC) to ease the software calculation burden and time.
 2.7 ~ 5.5Vdc operation, and 16-pin
(NAU7802) or 8-pin (NAU7801) SOP package
versions
 Dual differential input pair inputs and built-in
temperature measurement
2.7V~5.5V Input  Built-in reference voltage supply and internal
VBG AVDD DVDD XIN XOUT oscillator
 Less than 1uA standby current
To serial
Interface
Bandgap LDO IO Power BENEFITS:
To
Reference 1
Analog LDO Internal RC
Circuit VLDO [1:0] 0  Low external parts count for low BOM cost
Oscillator
 Available in small package, minimal impact
digital logic OSCS
to PCB size
Control Signal
 Add-On Features: Internal LDO regulator
CHS CRS[2:0] 14 SDIO
 Integrated Oscillator
VIN1P PGA[1:0] SCLK  Integrated Temperature Sensor
Digital
VIN2P DRDY
VIN1N
PGA 24- bit ADC ADC result Interface APPLICATIONS:
24
VIN2N Consumer
 Weigh scales
Temperature  Temperature measurement
Sensor
Medical
 Glucose & blood pressure meters
AVSS REFP REFN DVSS
Industrial
 Sensor measurement
Part No. Write Capability Package Option Pricing

Scan barcode for more NAU7801 I2C, 2-Wire 8-SOP, 8-DIP <US$1.25 in quantities of 1000
NAU780X information
NAU7802 I2C, 2-Wire 16-SOP, 16-DIP <US$1.50 in quantities of 1000
STM32 F-2
MI C R OC ON TR OLLER S
32-bit Flash microcontrollers, 120 MHz/150 DMIPS
with ART Accelerator™ and advanced peripherals.
The STM32F is the foundation of the STM32 family. The STM32F family of
32-bit Flash microcontrollers is based on the breakthrough ARM Cortex™-M3
core, specifically developed for embedded applications. They combine high
performance with first-class peripherals and low-power, low-voltage operation.
They offer the maximum integration at accessible prices with a simple
architecture and easy-to-use tools.
With five lines, the STM32F1xx series provides perfectly balanced products
for a wide range of applications in the industrial, medical and consumer markets.
The following five lines are pin-to-pin, peripherals and software compatible:
 Value line STM32F100xx - 24 MHz CPU with motor control and CEC functions
 Access line STM32F101xx - 36 MHz CPU, up to 1 Mbyte Flash
 USB access line STM32F102xx - 48 MHz CPU with USB FS
 Performance line STM32F103xx - 72 MHz, up to 1 Mbyte Flash with motor
control, USB and CAN
 Connectivity line STM32F105/107xx - 72 MHz CPU with Ethernet MAC, CAN and USB 2.0 OTG
The new leading-edge STM32F2xx series combines advanced 90nm process technology with the innovative adaptive real-time memory accelerator
(ART accelerator™) and the multi-layer bus matrix. This series achieves 150 Dhrystone MIPS when executing code from Flash at 120MHz with 188 µA/MHz
dynamic power consumption.
 STM32 F-2 series: 120 MHz CPU with ART accelerator, 1 Mbyte Flash, Ethernet MAC, USB 2.0 HS OTG, camera interface, encryption
APPLICATIONS:
Industrial Appliances Building and security Medical
 PLC  Motor drive  Alarm systems  High-end glucose meters
 Inverters  Application control  Access control  Power meters
 Power meters Consumer  HVAC  Battery-operated applications
 Printers, scanners  PC peripherals, gaming
 Industrial networking  Digital cameras, GPS platforms Home audio
DEVICE SUMMARY: STM32F & STM32L

STM32F-2 information
Lineage Power ® Barracuda™
P OWER MAN AG EMEN T
Power Modules; DC-DC

Converters
Lineage Power's new family of DOSA-based high
efficiency bus converters offer lower cost digital power
alternatives to semi-regulated and unregulated products
in the market today.
Lineage Power, a GE Energy Company, compliant Barracuda QBDW series features
has been providing high efficiency, reliable built-in I2C digital communications to
power to the communications industry for enable design engineers to leverage the
nearly 100 years based on our Bell Labs benefits of both digital communication
heritage. Today, we are introducing our and control. Both members of the
Lineage Power® Barracuda™ family of Barracuda family are designed to provide
digitally controlled, fully-regulated bus a 9.6-12 Vdc intermediate bus voltage
converters for DC-DC Intermediate Bus after which multiple, low voltage rails
Architectures. are generated using additional Point of
Load (POL) converters such as DLynx™.
The cost-effective, high-efficiency
This architecture is designed to power
Barracuda series delivers digital power
silicon devices such as processors and
communication and control in standards-
memory devices on circuit boards using
based eighth-brick and quarter-brick
POL converters. Barracuda converters
DOSA footprints. Power design engineers
can also be utilized for other applications
can deploy the new Barracuda modules in
requiring a fully-regulated output voltage in
existing power designs as DOSA-compliant,
distributed power architectures deployed
drop-in upgrades for unregulated and
in networking, Power over Ethernet (PoE),
semi-regulated bus converters challenged
computing and data storage devices.
by recent industry-wide intellectual
property issues. As part of the Lineage New synchronization features, active
Power Total Efficiency™ architecture, the load sharing and differential remote sense
new Barracuda modules deliver efficiency are combined with a digital PMBus interface
of 96 percent and are priced comparable that supports a wide range of commands FEATURES & BENEFITS:
to current semi-regulated bus converters to both control and monitor the Barracuda
 Delivers up to 33Vdc output current
to encourage rapid adoption in new and modules with a full range of protections
existing product designs. and warnings, digital on/off, trim, margin,  Standards-based DOSA™ footprint
power good, rise time adjustment, and
The Barracuda QBVW series is a  PMBus™ compliant digital configuration, communication
input under voltage lockout.
digitally controlled drop-in alternative & control
for unregulated and semi-regulated bus For more information, please visit
 Wide input range of 36-75Vdc
converter products. The PMBus™ Rev.1.1- www.ge.com/lineagepower.
 High efficiency of 96%
 Positive remote On/Off logic

APPLICATIONS:
 Remote sense and output voltage trim
 Intermediate Bus Architecture
 Fully regulated output voltage
 Wireless networks
 Access and optical network equipment  Output over current/voltage protection
 ATCA applications  Constant switching frequency
 Telecom networks  ISO9001 and ISO14001 certified manufacturing facilities
Scan barcode for more information

on Lineage's Barracuda Series
LTC2978 - Octal PMBus Power
Supply Monitor and Controller

with EEPROM
The LTC2978 provides numerous functions with on-the-fly
adjustments that make it an ideal device for digital power control
in a wide variety of automotive, medical and telecommunication
applications.
The LTC®2978 is an octal, PMBus power supply sequencing and precision point-of-
compliant power supply monitor, supervisor, load voltage servo to one of three programmed
sequencer and margin controller. PMBus values: margin high, margin low and nominal.
functions include warning and fault OV/UV A programmable watchdog timer monitors
threshold pairs for eight output channels and microprocessor activity for a stalled condition
one input channel. Programmable fault response and resets the micro if necessary. The 1-wire
allows the power supplies to be disabled with synchronization bus supports power supply
optional retry after a fault has been detected. sequencing across multiple LTC2978 devices.
PMBus reads allow eight output voltages and User programmable parameters can be stored
one input voltage to be monitored. In addition, in EEPROM. Voltage supervisor, voltage monitor
odd numbered channels can substitute sense and temperature faults can also be logged to
resistor voltage measurements for output voltage EEPROM.
measurements. PMBus commands support
FEATURES:
 PMBus Compliant Interface and Command Set

Octal Power Supply Controller with PMBus Interface
 Configuration EEPROM
4.5V < VIBUS < 15V VIN
 Fault Logging to Internal EEPROM
VPWR VIN_SNS VOUT
 Differential Input, 15-Bit ∆∑ ADC with Less Than TO INTERMEDIATE
BUS CONVERTER VIN_EN VDACP0 DIGITALLY
±0.25% of Total Unadjusted Error ENABLE R30 MANAGED
VSENSEP0 R20 41.2k POWER
 Monitors Eight Output Channels and One Input Voltage 7.5k
SUPPLY
SDA LTC2978* LOAD VFB
 8-Channel Sequencer R10
PMBus SCL VDACM0
20k
 Programmable Watchdog Timer INTERFACE ALERTB VSENSEM0 SGND
CONTROL0 VOUT_EN0 RUN/SS
 Eight UV/OV Voltage Supervisors GND
 Eight 10-Bit Voltage-Buffered IDACs with Soft Connect WRITE-PROTECT WP PWRGD TO µP RESETB INPUT
WDI/RESETB WATCHDOG
 Linear, Voltage Servo Adjusts Supply Voltages by TIMER INTERRUPT
TO/FROM OTHER FAULTB00 ASEL0
Ramping Voltage-Buffered IDAC Outputs Up/Down LTC2978s SHARE_CLK ASEL1
 Supports Multichannel Fault Management GND *SOME DETAILS OMITTED FOR CLARITY
2978 TA01
ONLY ONE OF EIGHT CHANNELS SHOWN
 On-Chip Digital Temperature Sensor
 Available in 64-Pin 9mm × 9mm QFN Package
APPLICATIONS:
 Computers
 Network Servers

information on LTC2978
LT3799 - Offline Isolated Flyback
LED Controller with Active PFC
The LT3799 is optimized for LED applications requiring 4W to over

100W of LED power and also compatible with standard TRIAC in-
wall dimmers.
The LT®3799 is an isolated flyback typically achieves power factors of 0.97. The
controller with power factor correction FAULT pin provides notification of open and
specifically designed for driving LEDs. The short LED conditions.
controller operates using critical conduction
The LT3799 uses a micropower
mode allowing the use of a small transformer.
hysteretic start-up to efficiently operate at
Using a novel current sensing scheme, the
offline input voltages, with a third winding
controller is able to deliver a well regulated
to provide power to the part. An internal LDO
current to the secondary side without using an
provides a well regulated supply for the part’s
opto-coupler. A strong gate driver is included
internal circuitry and gate driver.
to drive an external high voltage MOSFET.
Utilizing an onboard multiplier, the LT3799
FEATURES: APPLICATIONS:
 Isolated PFC LED Driver with Minimum Number of External Components  Offline 4W to 100W+ LED Applications
 TRIAC Dimmable  High DC VIN LED Applications
 VIN and VOUT Limited Only by External Components
 Active Power Factor Correction (Typical PFC > 0.97)
 Low Harmonic Content
 No Opto-Coupler Required
 Accurate Regulated LED Current (±5% Typical)
 Open LED and Shorted LED Protection
 Thermally Enhanced 16-lead MSOP Package
TRIAC Dimmable 20W LED Driver LED Current vs Input Voltage
1.20
1.15
90V 100k 20Ω
0.22µF
TO 150V 4:1:1 1.10
0.1µF 499k
AC 100k 4.7pF
200Ω 1.05
499k 10µF
2k
ILED (A)
1.00
VIN DCM 100k 1A
0.95
VIN_SENSE FB
0.90
6.34k LT3799 4.99k 560µF
×2 0.85
VREF 0.80
20Ω 20W 90 100 110 120 130 140 150
100k 32.4k 40.2k CTRL3 GATE LED
VIN (VAC)
POWER 3799 TA01b
CTRL2 SENSE
CTRL1 VINTVCC 0.05Ω
100k
NTC 16.2k 4.7µF
2.2nF
GND
FAULT FAULT CT COMP+ COMP– 3799 TA01a
0.1µF
0.1µF

LT3799 information
Using a Micrel Ethernet PHY and a Lattice ECP3 FPGA to
Create an Ethernet Subsystem
AP P LI C ATI ON N OTES
Many modern applications use FPGAs to implement complex system level building blocks.
These building blocks can contain processors, DSPs, bus interface and even video and audio
functions. Getting high-speed data on and off the FPGA can be accomplished by using a standard
Ethernet interface and this leverages a wide range of established protocols, software platforms and
IP. FPGA’s usually requires an Ethernet Interface IP Core inside the FPGA and some external devices,
typically an Ethernet Physical (PHY) layer device and a connector.
As a target application example we will use a video inspection system used in an assembly
line application. This type of embedded video processor needs to fit into a very small form factor and
will monitor and control inspection of product produced by an assembly. Ethernet is being used to
communicate to the controller so that commands and data received by the controller can be relayed
to the central processing location. A large number of controllers will be distributed throughout the
factory at various stages of the manufacturing process. Because of the data transmission speed
required high-speed Ethernet is needed, but backwards compatibility to standard Ethernet is an
advantage. Significant DSP functionality is desired so that video images may be processed quickly
and any product quality issues spotted quickly.
Creating an Ethernet subsystem involves a variety of design considerations. This application

note provides a step-by-step guide for a designer who needs to quickly and efficiently create an Scan barcode to access
Ethernet subsystem using a Lattice ECP3 FPGA, and a Micrel Ethernet PHY. application note
Creating a Power Subsystem for Lattice XP2 FPGAs

using Linear Technology Power Devices
FPGAs now require extensive power This combination of devices is excellent for a wide require lots of IO capability, and a large number
subsystems to provide the variety of voltages and range of applications in the consumer, industrial, of general purpose logic elements. Some DSP and
high-power required for parallel I/O banks, FPGA communications and networking industries. other simple arithmetic functions will be required
Core, and various clocking, delay and analog-like for advanced light sensing features. Power is
For this example design we will target an
functions. Precise control of voltages, even in available from a low voltage, 12V DC supply
LED display lighting application. The FPGA will
noisy environments and over wide current ranges source.
be monitoring and controlling the flow of data to
can minimize a host of potential system problems.
the LEDs used on a large display surface, similar Linear Technology has a wide range of power
Using LTC power devices- regulators and/or power
to those used as highway, sports venues or other products including discrete regulators and the
modules- is an excellent way to keep potential
high-traffic high-visibility locations. The FPGA will new μModule DC/DC regulator LTM46XX Family
power problems away from your design. This
be responsible for controlling the light output of of integrated regulators. These regulators are a
application note provides a step-by-step guide
the LEDs based on environmental conditions good choice for I/O voltage requirements, which
for a design engineer who needs to quickly and
(temperature and ambient light), the age of the typically require lower current than device core
efficiently create a Power subsystem using a LTC
LEDs, and a variety of other factors to improve voltages. High current applications can use the
power products and a Lattice XP2 FPGA. It will
image quality and to save power. The FPGA will compact, high-current μModule DC/DC regulators.
review the LTC power devices and the Lattice XP2.
Scan barcode to access

application note
Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development 25
The PN-E Series High
Performance Professional
LCD Monitors
Reliability, Versatility,
Undeniable Quality
Sharp PN-E Series LCD monitors offer full 1080p resolution from analog and
digital RGB as well as HD video. 24/7 rated and backed by a 3-year warranty.
These displays are excellent for videoconferencing, meeting rooms, digital
signage, and are available in four sizes (42”, 47”, 52”, 60”).
To learn more about these and other Sharp monitors, please visit
http://www.sharppromonitors.com/
26 1
Display Technologies available from Nu Horizons
Cable Solutions Touchscreens

Quadrangle Hantouch
Touch International
Display Enhancement Solutions
Landmark Active Enhancements:
Nu Horizons Custom Solutions ■ Hi Bright Backlights:
CCFL
Displays LED
Emerging Display Technologies (EDT)
HT Displays Passive Enhancements:
Optrex ■ Anti-Reflective Anti Glare Glass / Acrylic
OSD Displays ■ EMI/RFI Shielding
Sharp ■ IR Blocking Film
Tianma ■ Optical Bonding
United Radiant Technology Corp. (URT) ■ Privacy Filters
■ Protective Display Shields
Embedded Solutions /
Single Board Computers Total Solutions:
Aaeon ■ Display Kit Verification
Axiom Tek ■ Fully Enclosed LCD Monitors
Connect Tech ■ Fully Enclosed LCD Systems (Panel PC’s)
Digi International ■ LCD Testing and Screening
IEI Technology ■ Medical
Reach Technology ■ NEMA Rated Products
■ Open Frame Configurations
Inverters ■ Rack and Panel Mount Assemblies
Applied Concepts
T E C H N O L O G Y I N C. ERG Touch Controllers:
Microsemi ■ Serial
Zippy ■ USB
LCD Controller Solutions Touch Screen Integration:

Amulet Technologies ■ Capacitive
Digital View ■ Surface Acoustic Wave (SAW)
Digitron ■ IR - Infrared Touch
Estecom-USA ■ Projected Capacitive - Extreme-Touch
Kordis ■ Resistive - 4/5/8 Wire
Spectrah
URT Value-Add Capabilities:
■ Class 1,000 Clean Room for all LCD
LCD Monitors Enhancements
Axiom Tek ■ Display Inspection
Digitron ■ NVIS Night Vision
Estecom-USA ■ Optical Glass Bonding
IEI ■ Touch Screen Integration
Slimage
Open Frame/Panel PC Solutions

Aaeon
Axiom Tek
Digitron
Estecom-USA
IEI Technology
Nu Horizons Custom Solutions
Slimage
Spectrah
27
Semiconductor Technologies available from Nu Horizons

• Audio (DAC’s, ADC’s, Codec’s, SPDIF, Sample Rate • Programmable Clock Devices (Clock Generation,
Conv., DSP, USB) • Device Server Modules Differential Clock Distribution, Universal Fanout & Zero
• Memory (EEPROM, DAC + EEPROM) • Embedded MCU / MPU (ARM7TDMI, ARM9926EJ) Delay Buffer, Clock Synthesis, Low Jitter SERDES
• Networking (T1/E1/T3/E3 xcvr, PCM) • Networking Modules (Wired/Wireless 802.3 /
• Sensors (Hall Effect Sensor, 3d Compass) Clock)
802.11bg / 802.15.4)
• Video (NTSC/PAL Encoder/Decoder, A/V Switches, • Programmable Power Manager Devices (for
Video Gain Amp) Processors, DSPs & Board Level; Watchdog timer,
Voltage Supervision, Reset Generation, Sequencing,
Voltage Measurement, Trimming & Marginning)
• Programmable Logic (Non-Volatile Flash FPGA,
SRAM FPGA, SERDES, 8/32 Bit Soft Processor,
Ultra-Low Power CPLD, SPLD)

• Discrete (Transistors, FET arrays, Thyristors, Triacs) • Data Converters (ADC, DAC)
• Display (Vacuum – Fluorescent Display Drivers) • Interface (PLB / PCI / I2C / SPI / USB UARTs,
• LED Drivers (Constant Current Drivers) RS232/485/422 Transceivers)
• Motor Control (Brushless DC, Bi-Polar Stepper) • Power (Buck/Boost Regulator’s, Charge Pumps,
• Power (Linear Regulators, Buck/Boost/Fly back DC- LDO’s, Supervisors, PWM, Programmable Power)
DC, Charge Pumps) • Storage (Data Reduction, Data Security)
• Sensors (Hall Effect) • Telecom (T1/E1/DS1/DS3/E3 LIU’s, Carrier ETH • Power Supplies
SONET/SDH Framers, Mappers & Aggregators) - High Voltage (1 to 5 W, 10 to 200 W,
Custom)
- Low Voltage (Modular, Desktop, Wallmount,
Medical, Open-Frame, U-Frame, Enclosed,
LED Lighting, Custom)
(Fiber Optics Division)
• Analog (Data Conversion, Power Management)
• Communications (Bluetooth, LIN, CAN, POTS, • Optical Components (WDM Management, 850nm
GPS, RF, Zigbee) VCSELs & Detectors, 1310nm Lasers & Detectors,
• Memory (Flash, EEPROM, Modules) CML Transmitters,WSS)
• Microcontrollers (8051, AVR, ARM7TDMI, • Optical Transceivers (GBIC, XFP, MSA300, SFP,
ARM926EJ, Cortex M3) SFP+) • AC-DC Power Supplies (800W - 4,000W)
• Multimedia & Imaging (IR, Video) • Passive Optics (WDM networks) • DC-DC Converters
• Network Storage (Data Storage) - Industry Standard (1/16-Brick, 1/8-Brick, 1/4-
• Programmable Logic (FPGA, SPLD/CPLD) Brick, 1/2-Brick, 1x1”, 2x1”)
• Sensors (Biometrics, RF, Smart Cards) - Intermediate Bus Converters (1/8-Brick, 1/4-
Brick)
- Power Amplifiers (1/2-Brick, Full Brick)
• Power & Battery Management (Power Modules)
• Power Systems Engineering Services

• Audio (SerDes with Emebed/De-Embed)
• Fiber Optic Devices (10G FP TOSA & MM PIN • Datacom (Cable & Backplane SerDes, Redrivers,
ROSA, OTDR FP Lasers, 2.5G DWDM DML, DFB Retimers, PCIe Bridges, Crosspoint Switches, TIAs,
TOSA & APD ROSA) LAs, Transceivers)
• Optocouplers (Transistor Output, High Speed, Solid • Video (Equalizers, Cable Drivers, Reclockers, • Data Converters (Delta Sigma, SAR, Voltage DAC,
State Relays) SerDes, Video Optical Modules, TIAs, LAs, Current DAC)
• RF Modules (Zigbee)
• RF Semiconductors (RFIC Switch, GaAs FET,
Laser Drivers, Timing, Crosspoint Switches, Cable • Frequency Control (Silicon Timing)
GaAs PA, Si LD-MOSFET, CATV Hybrid, Si RFIC)
Extenders) • Interface (RS-232, 422/485, CAN PHY)
• Power Management (Switching Regulators, Linear
Regulators, DC/DC µModules, LED Drivers, Hot
Swap, PoE)
• Signal Conditioning (Amplifiers, Comparators,
Filters, Voltage References, Thermal Couple
Compensators)
• Wireless / RF (I/Q Modulators – Demodulators,
• Power and Battery Management (IGBT and Up & Down Converting Mixers, IF Amplifiers, PA, RF
MOSFET gate drivers) Log Detectors, RF Power Detector)
• Memory (QDR/DDR SRAM, Zero-Wait SRAM
• Sensor and Imaging Arrays (Hall Effect Sensors) (NBT), Sync Burst SRAM, Specialty Sync-SRAM)
• Signal Conditioning (Solid State Relays,
Optocouplers)
• Telecom (Embedded Modem, MF Trunk signaling,
DTMF)
• Data Communications (10/100/1G/10G Ethernet
Switches, 10/100/1000/10G PHYs)
• Embedded MCU / MPU (ARM V5TE, PXA
StrongARM, PPC & MIPS Systems Controller)
• Power Management (POLA)
• Memory (DDR DRAM,SDRAM, EDO & FPO DRAM, • Storage (FAS/SATA/PATA, SAS/Fiberchannel,
Storage Processors)
• Imaging Solutions (Fax Modems, Fax and MFP E2PROM, PSRAM, SRAM, DDR II Synchronous
System Solutions, Digital Photo Frames) SRAM, Asynchronous SRAM) • Video (Format Converter)
• Audio (Speakers-on-a-Chip, PC HD-Audio, PC HD- • Smart Card (Two-Wire Serial EEPROM, Secure, • Wireless / RF (802.11 Modules)
Audio Modem Combo) MCU Based, ICs)
• Video (MPEG Encoders/Codecs, Video Decoders,
Demodulators, Surveillance / Security)
• Dial-Up Access Modems (PC Dial-Up Modems,
Embedded Dial-Up Modems)
• Analog (Drivers / Voltage & uC Supervisors /
Filters / Switches / Regulators)
• Bus Device ICs (USB / PC / PCMCIA / SMBus)
• Ethernet (10/100/1000 PHYs, Controllers, Switches)
• Power (MOSFET, IGBT, Diodes, Thyristors, DC/DC, • Linear ICs (Active Filters / Comparators /
PWM Control, LED/Lamp/Display Drivers) Op Amps / References / Timers)
• RF Power (FETs, Drivers, Amplifiers, Microwave • Power Management ICs (Battery, Display, Hot-
• Wireless (Bluetooth modules, ZigBee modules, modules, RF Modules) Swap, PCI/PCIX/PCIE, High Side, LDOs, DDR)
802.11 modules) • Solar Devices (Solar Cells, Solar Bits, Solar Die, • Precision Edge ICs (Clock distribution, generation,
Solar Battery Chargers) synthesizers / Multiplexers, PLLs, buffers, CDRs)
• RF (290 – 980 ISM band / ASK/FSK / 200kbps max
data rate, RF Modules)
• System Management ICs (Fan Control / Thermal
28 Supervisor I2C)
USB 2.0 Megapixal Image Controller)
(Including SaRonix)

• DRAM (DDR3 SDRAM, DDR2 SDRAM, DDR
SDRAM, SDRAM, RLDRAM, PSRAM) • Analog Switches (3-17V SPDT-SPST-DPST-MUX, • Advanced I/O Controllers (USB-ATA, Southbridge)
• DRAM Modules (FBDIMM, RDIMM, SODIMM, Custom HDMI/DVI-PCI-USB-LAN) • Data Communications (10/100 MAC/PHY
UDIMM) • Bridges (PCI, PCIX, PCI Express – 32/64Bit – Controller, 10/100PHY, Multimedia Processors,
• Mobil DRAM (Mobil SDRAM, Mobil DDR SDRAM) 66/133MHz) ArcNET, CircNET, USB Ethernet)
• Multichip Packages (MobilDRAM & NAND Flash • Clock ICs ( VCXOs, Buffers, Drivers, Generators, • Environmental (Temperature Sensors, Fan Control)
Combinations) Skew Controllers) • USB Solutions (Card Reader, Flash Drive, Disk
• NAND Flash Memory (Managed NAND, High • Crystals & Oscillators (Quartz Crystal Resonators) Drive, Hub, PHY)
Speed NAND, Solid State Storage, Embedded USB)
• Digital Switches (2-Port, Bus, Crossbar, DDR,
Mux/DeMux, Low Voltage Translator)
• Interface (Re-Drivers, Buffers, Flip-Flops, Gates,
Latches, Registers, Transceivers, Voltage Translators)
• Logic (ALVC, FCT, LCX, LPT)
• PCI Express Solutions (Packet/Signal Switches, • Power Management (AC/DC, Battery
Bridge, PHY, Signal Conditioning, Clock-Buffers/ Management, DC/DC, LDO, MPU - Supervisor, PoE,
(Formerly C&D Technologies) Generators/Crystals)
VDC References, AC Switches)
• Translators (Voltage, I/O Signal) • Discretes (Thyristors, Diodes, FETs, Transistors)
• AC/DC Power Supplies (200 – 2000 Watts,
2.5VDC to 48 VDC Out – PCI Modules) • Signal Conditioning (Comparators, Op-Amps,
Clamp Diode Arrays, Crowbar Diodes, EMI Filtering)
• Data Acquisition (Electronic Imaging, A/D • Logic (3.3V, 5V, Translators, Gates, Switches, Port -
Converters, D/A Converters, Sample/Hold Amplifier, Expansion)
Multiplexers) • Sensors (Accelerometers, Proximity, Thermal, Touch)
• DC/DC Converters (0.25 to 340 Watts, 0.02 to 80 • Interface (Smartcard)
Amps, 1.2 to 48 VDC Out; 3 to 75 VDC In) • Frequency Control (Oscillators, Crystals, VCXO, • Wireless (Bluetooth, ZigBee, GPS, RFID)
• Digital Panel Meters (Voltmeters, Wire Meters, TCXO, OCXO, Sine Wave Oscillator) • Audio (Decoders, Power Amps, Analog CPU, Digital
Process Monitors, AC/DC Ammeters) CPU, Radio)
• Magnetics (Inductors & Transformers, Differential • Image Sensor (Camera Modules, Imaging Signal
common-mode filters, Databus Isolators) Processor, CMOS Arrays)
• Video (Demodulator, Decoders)
• Communications (CAN, LIN, ZigBee) • Motor Control (Controllers, Drivers, MCU’s)
• Discrete (Diodes, Power MOSFETS, Thyristors, • Microcontrollers (8-bit, 16-bit, ARM7TDMI,
Triacs, Transistors) ARM926E, Cortex M3)
• Embedded MCU / MPU (8/16/32 Bit MCUs)
• Logic (Standard – High/Low Voltage, Interface,
Multi-Purpose)
• Memory (Fast Flash, Low Power SRAM, EEPROM)
• AC-DC Power Supplies (125W-375W, 3.3vdo to
56vdo, 90-264vao in, 3”, 3.3” x 5” format) • Optoelectronics (LED Drivers, EL Lamp Drivers)
• DC-DC Open Frame Power Supplies (125W, • Power (Switching, Automotive, PFC, Backlight,
LDO, High Voltage Interface / Driver’s, PoE)
160W, 3.3-48vdo 3” X 5” format)
• Transducers (Ultrasound)
• Power Systems Engineering Services ®

• Frequency Control (Oscillators, Optical Timing
Clocks, Sine Wave Oscillator)
• RF Components (SAW Resonators, SAW RF & IF
Filters, RFIC Transceivers) • AC/DC Power Supplies (Industrial and Medical -
• RF Modules (ZigBee, 802.15.4, UHF Mesh, FHSS 300W - 1500W)
• Wireless/RF (2.4G / 900M / 433M Transceiver, ISM, Bluetooth, 802.11b) • DC/DC Converters
MCU based RF, Audio streaming) • Standalone RF modules (FHSS, 802.15.4, - Industry Standard (1/8-Brick, 1/4-Brick, 1/2-
802.11b, and Bluetooth) Brick, Full Brick)
- Non-Isolated Point of Load
- Intermediate Bus Converters (1/8-Brick, 1/4-
Brick, 1/2-Brick)
• Communications (Voice & Audio CODECs, Pro-X

SLICs, USB Audio Codec) • Power (High Reliability Transistors)
• Logic ICs (I/O Controllers, ISA Bridge, Power
Management, Hardware Monitors, Clock Generators, • Connectivity (FEC, Framers, Mappers, Switches,
TSI)
Power I/C, Card Reader IC’s, IEEE1394)
• Ethernet Switching (10/100/1G/10G PHYs and
• MPU (8-bit 80C51 based, 32-bit ARM7TDMI) MACs, Switches and Transceivers)
• Power (ACPI Controller, PWM, DDR Bus Term, • Transport Processing (PMDs [Laser Drivers, TIAs,
Power Switch) Post-Amplifiers], 10/100/1G/10G PHYs PHYs,
• Voice Solutions (Record & Playback ICs) Crosspoint Switches, and Signal Integrity Devices)
• Flat Panel Displays (LCD – 2” to 65”)
• Memory (Flash – NOR)
• Optoelectronics (LEDs, LED Modules, Laser Diode,
Photocoupler, IrDA, photo interrupters, Emitters/
Detectors, Sensors)
• Power (LDO / Switching Regulators, LED Drivers,
Solid State Relays)
• Memory (SDRAM / DDR1, Pseudo SRAM, Serial
(Rohm Semiconductor is the official sales channel for Oki Flash, Parallel Flash)
Semiconductor products)

• Audio (CODECs, DACs, Amplifiers )
• Display Drivers (LCD / VFD Driver / Controllers)
• Embedded MCU / MPU (4-Bit NX 63K /
ARM7TDMI / ARM946E / Biometrics)
• Memory (P2ROM, DRAM ) • Digital Video Processors
• Speech (BGM Mixer - ADPCM & ADPCM2, Voice • Storage Products (Serial ATA - Parallel ATA, • Filters
Parallel ATA Controller, RAID Storage Processors,
• Inductors
Synthesizers & Recorders, Audio Codec) • Isolators
• Telecom (ADPCM – Linear – PCMA-Law - VoIP SATA Controllers, SATA Port Multipliers)
• Transformers (Modem, Analog/Voice Switching,
Codec’s, Echo Cancellers, Transceivers) • Video Transport (HDMI, DVI and iTMDS Products - DSL, Cable Modem, RJ45, PoE)
• Video (NTSC / PAL / SECAM Encoders – Receivers, Transmitters, Switches, PHYs)
Decoders, NR-FIFO)

• Controllers (Flash Memory Card Controller, USB
Flash Controller)
• Embedded Graphics (128-bit 2D/3D mobile
• Analog Image Sensor (NTSC/PAL) graphics engine, Mobile Graphics Coprocessor)
• Digital Image Sensor (CIF, VGA, 1.3M / 2.0M / • Mobile Communication (Mobile Satellite TV Tuner
3.2M / 5.17M Pixel) IC)
• Image Processors • Multimedia SoC (MP3/WMA Digital Audio Player, 29
POWER & BATTERY MANAGEMENT SYSTEM MONITORING
Exar SMSC
Battery Management Linear Regulators & Power Management
Allegro Microsystems References Exar Linear Technology ST
Linear Technology Allegro Microsystems IXYS Micrel Vitesse
Micrel Atmel Lattice
ST Exar Linear Technology Nuvoton
Linear Technology Marvell
Discretes Marvell (modules) Micrel
Allegro Microsystems Micrel Murata Power Solutions
ST
IXYS
Murata Power Solutions
Oki / Rohm
Sharp Microelectronics TIMING
Renesas ST
Semicoa Supertex Power Modules Crystals, Oscillators, Drivers, Buffers, PLLs
Lineage Power
ST
Supertex Linear Technology Clock Distribution Clock Generation
Wurth Midcom Motor Control Marvell Exar AKM Semiconductor
Allegro Microsystems Murata Power Solutions Lattice Exar
ST SynQor Micrel Lattice
Hot Swap Pericom Linear Technology
Lattice ST Micrel
Linear Technology POE Switching Pericom / SaRonix
Micrel Linear Technology Allegro Microsystems Pletronics
Supertex ST Exar RFM
Supertex Linear Technology
Marvell
Micrel
Oki / Rohm
ST
Supertex
POWER SUPPLIES
AC-DC DC-DC CONVERTERS CENTRAL
Low Power Industrial Isolated / Industry
LHV Power Standard Bricks / A/D
Murata Power Solutions 8-Bit
Non-Isolated Point of Load AKM Semiconductor Atmel
N2Power Exar
LHV Power ISSI
Medium Power Lineage Power Linear Technology Lattice (soft processor)
LHV Power Murata Power Solutions Murata Power Solutions Nordic
Murata Power Solutions SynQor Nuvoton Nuvoton
N2Power ST Oki / Rohm
SynQor Open Frame Renesas
LHV Power D/A ST
High Power N2Power AKM Semiconductor
LHV Power Linear Technology
Lineage Power 16-Bit
Board Level Modules Murata Power Solutions
ST
Renesas
Front End Intermediate Bus Converters ST
LHV Power Lineage Power
Lineage Power Murata Power Solutions
Murata Power Solutions SynQor
Medical
LHV Power Memory & Processor Power
SynQor Murata Power Solutions SIGNAL CONDITIONING
Power Systems Engineering Services Discretes Isolation
Lineage Power ST CEL
Murata Power Solutions Clare
N2Power Drivers Pericom
Nu Horizons Value-Add Micrel Sharp Microelectronics
ST ST
Supertex
Comparators
Amplifiers Linear Technology
OPTOELECTRONICS Linear Technology Micrel
ST
Micrel
Infrared LED Arrays / Modules ST
Sharp Microelectronics Sharp Microelectronics Filters
Linear Technology
LEDs / Laser Diodes Micrel
Lasers Sharp Microelectronics ST
Finisar
Optical Systems
CEL
LED Displays Finisar
Optrex
Murata Power Solutions OptoCouplers
CEL
Sharp Microelectronics
SENSORS AND IMAGING ARRAYS
Allegro Microsystems Omnivision
AKM Semiconductor Sharp Microelectronics
Atmel SMSC
Clare ST
Nuvoton
30 Oki / Rohm
MEMORY TELECOM WIRELESS
Non-Volatile Volatile Modem Central Office ISM Bluetooth
Conexant (CODECs, SLICs, Atmel ConnectBlue
EPROM DRAM ST Lattice RFM
Atmel
DAA, xDSL) Micrel
ISSI Atmel ZigBee
Oki / Rohm Micron Nordic
VoIP Clare RFM Atmel
ST Oki / Rohm Conexant
Marvell ST CEL
Winbond Exar ConnectBlue
E2PROM Nuvoton
Oki / Rohm Nuvoton RFID Oki / Rohm
AKM Semiconductor Oki / Rohm Renesas
Atmel SRAM Renesas Atmel
Renesas Lattice RFM
ISSI Atmel ST
GSI Technology ST ST
Renesas Vitesse
ST ISSI Transceivers Discretes (RF)
Renesas Clare 802.11 a/b/g/n
ConnectBlue AKM Semiconductor
Sharp Microeletronics Exar Atmel
Flash ST Finisar Digi
Atmel Switching Marvell CEL
Winbond Gennum Exar IXYS
ISSI Marvell RFM
Micron Vitesse Sharp LTC
ST Micrel
Renesas FIFO Vitesse ST
Sharp Microelectronics RFM
Oki / Rohm ST
Winbond Microwave
CEL GPS
Storage Controllers IXYS Atmel
Silicon Motion Lattice ST
SMSC
WiMax
Sharp Microelectronics
PROCESSOR DATACOM PHYSICAL LAYER

32-Bit Ethernet MAC Ethernet Switching Ethernet
Atmel Marvell Marvell Lattice
Digi Micrel Vitesse Marvell
Lattice (soft processor) SMSC Micrel
Marvell ST USB SMSC
Nuvoton Renesas ST
Oki / Rohm Silicon Motion Vitesse
Renesas WAN / Transport SMSC
ST Exar
Gennum Optical Transformers / Isolators
Marvell Conexant Wurth Midcom
Vitesse Finisar
Gennum
BUS INTERFACE
Parallel High Speed Serial
LOGIC Lattice
Nuvoton
(above 1 MB/sec)
Gennum
Pericom Lattice
ASIC SPLD Marvell
Atmel Atmel Micrel
Lattice Pericom
CPLD Low Speed Serial
Atmel Renesas
(under 1 MB/sec) SMSC
Lattice Standard Exar
Murata Power Solutions ST
Lattice
FPGA Pericom Linear Technology
Atmel Renesas Micrel Level Translators
Lattice ST Oki / Rohm Atmel
Renesas Lattice
DISK / INTERFACE SMSC
ST
Linear Technology
Micrel
Pericom
SAS/SCSI FibreChannel ST
Marvell Lattice
Vitesse Marvell
Vitesse
SATA/ATA
AUDIO / VIDEO Atmel Solid State
Exar Micron
AKM Semiconductor Oki Marvell Silicon Motion
Conexant Omnivision Silicon Image SMSC
Gennum Silicon Image SMSC
Lattice Silicon Motion Vitesse
Marvell ST
Nuvoton
31
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April 2011

Phase Change Memory

RealSSD™ C400 Solid State

Serial NOR Flash for Embedded

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SRAM with Error Correction

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IS64WV25616EDBLL (A1) IS64WV25616EDBLL (A3) Comments

Standby Current 9mA 20mA Typical value 2mA

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The innovative family of Dual Interface EEPROM provides new features

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Markets– NAU7801 / NAU7802

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DEVICE SUMMARY: STM32F & STM32L

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Power Modules; DC-DC

 Positive remote On/Off logic

 ATCA applications  Constant switching frequency

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P OWER MAN AG EMEN T

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The LT3799 is optimized for LED applications requiring 4W to over

TRIAC Dimmable 20W LED Driver LED Current vs Input Voltage

FAULT FAULT CT COMP+ COMP– 3799 TA01a