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Huawei HLR9820 V900R006 Product Description

Huawei HLR9820 V900R006 Product Description

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Published by Peyman Allahverdian

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Published by: Peyman Allahverdian on May 08, 2011
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HLR9820 Home Location RegisterProduct Description
Issue
2.0
Date
2010-02-08
HUAWEI TECHNOLOGIES CO., LTD.
 
 
Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service.Please feel free to contact our local office or company headquarters.
Huawei Technologies Co., Ltd.
Address: Administration Building, Huawei Technologies Co., Ltd.,Bantian, Longgang District, Shenzhen, 518129, People
s Republic of ChinaWebsite:http://www.huawei.com Email:support@huawei.com 
Copyright
 © 
Huawei Technologies Co., Ltd. 2009. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without priorwritten consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respectiveholders.
Notice
The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute the warranty of any kind, express or implied.
 
 HLR9820 V900R006 Product Description2.0 (2010-07-26) Huawei Proprietary and ConfidentialCopyright
©
Huawei Technologies Co., Ltd.
 
Page 3 of 41
Contents
1 Product Orientation.................................................................................................................5
 
1.1 Huawei SingleSDB Solution.......................................................................................................................5
 
1.2 Product Positioning....................................................................................................................................7
 
1.3 Key Benefits..............................................................................................................................................8
 
2 Main Features...........................................................................................................................9
 
2.1 Distributed Structure...................................................................................................................................9
 
2.2 Separate Data Processing and Service Processing......................................................................................10
 
2.3 Large Capacity and High Integrity............................................................................................................10
 
2.4 ATCA-Compatible Hardware Platform......................................................................................................10
 
2.5 Seamless Geographic Redundancy Solution..............................................................................................11
 
2.6 Multi-Level Data Backup Mechanism.......................................................................................................12
 
2.7 Virtual HLR Function...............................................................................................................................13
 
2.8 Standard and Open Data Access Interface.................................................................................................14
 
2.9 Comprehensive Data Statistics and Analysis.............................................................................................14
 
3 Architecture............................................................................................................................16
 
3.1 Physical Structure.....................................................................................................................................16
 
3.1.1 Product Appearance.........................................................................................................................16
 
3.1.2 Cabinet Configuration......................................................................................................................18
 
3.2 Logical Structure......................................................................................................................................21
 
3.2.1 Signaling Processing Subsystem......................................................................................................22
 
3.2.2 Subscriber Data Management Subsystem.........................................................................................23
 
3.2.3 Data Service Subsystem...................................................................................................................23
 
3.2.4 Data Storage Subsystem...................................................................................................................23
 
3.2.5 O&M Subsystem.............................................................................................................................23
 
3.3 Typical Configuration...............................................................................................................................24
 
4 Technical Specifications.......................................................................................................25
 
4.1 Performance Specifications.......................................................................................................................25
 
4.2 Reliability Specifications..........................................................................................................................26
 
4.3 Cabinet Specifications..............................................................................................................................26
 
4.4 Power Consumption.................................................................................................................................27
 
4.5 Clock Specifications.................................................................................................................................28
 
4.6 EMC Specifications..................................................................................................................................29
 

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