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LINEAR INTEGRATED CIRUITS - 2 Marks Question Bank - IV Sem ECE

LINEAR INTEGRATED CIRUITS - 2 Marks Question Bank - IV Sem ECE

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Published by JOHN PETER
Linear Integrated Circuits

LINEAR INTEGRATED CIRCUITS

VVCET – Dept. of ECE

Linear Integrated Circuits

080290022 - LINEAR INTEGRATED CIRCUITS AIM: To teach the basic concepts in the design of electronic circuits using linear integrated circuits and their applications in the processing of analog signals. OBJECTIVES • To introduce the basic building blocks of linear integrated circuits. • To teach the linear and non-linear applications of operational amplifiers. • To introduce the theory and a
Linear Integrated Circuits

LINEAR INTEGRATED CIRCUITS

VVCET – Dept. of ECE

Linear Integrated Circuits

080290022 - LINEAR INTEGRATED CIRCUITS AIM: To teach the basic concepts in the design of electronic circuits using linear integrated circuits and their applications in the processing of analog signals. OBJECTIVES • To introduce the basic building blocks of linear integrated circuits. • To teach the linear and non-linear applications of operational amplifiers. • To introduce the theory and a

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Published by: JOHN PETER on May 15, 2011
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 Linear Integrated CircuitsVVCET – Dept. of ECE
LINEAR INTEGRATEDCIRCUITS
 
 Linear Integrated CircuitsVVCET – Dept. of ECE
080290022 - LINEAR INTEGRATED CIRCUITSAIM:
To teach the basic concepts in the design of electronic circuits using linear integrated circuitsand their applications in the processing of analog signals.
OBJECTIVES
 
To introduce the basic building blocks of linear integrated circuits.
 
To teach the linear and non-linear applications of operational amplifiers.
 
To introduce the theory and applications of analog multipliers and PLL.
 
To teach the theory of ADC and DAC
 
To introduce the concepts of waveform generation and introduce some special function ICs.
UNIT - I IC FABRICATION AND CIRCUIT CONFIGURATION FOR LINEAR ICS
Advantages of Ics over discrete components – Manufacturing process of monolithic Ics –Construction of monolithic bipolar transistor – Monolithic diodes – Integrated Resistors –Monolithic Capacitors – Inductors. Current mirror and current sources, Current sources as activeloads, Voltage sources, Voltage References, BJT Differential amplifier with active loads, Generaloperational amplifier stages -and internal circuit diagrams of IC 741, DC and AC performancecharacteristics, slew rate, Open and closed loop configurations.
UNIT - II APPLICATIONS OF OPERATIONAL AMPLIFIERS
Sign Changer, Scale Changer, Phase Shift Circuits, Voltage Follower, V-to-I and I-to-Vconverters, adder, subtractor, Instrumentation amplifier, Integrator, Differentiator, Logarithmicamplifier, Antilogarithmic amplifier, Comparators, Schmitt trigger, Precision rectifier, peakdetector, clipper and clamper, Low-pass, high-pass and band-pass Butterworth filters.
UNIT - III ANALOG MULTIPLIER AND PLL
Analog Multiplier using Emitter Coupled Transistor Pair - Gilbert Multiplier cell – Variabletransconductance technique, analog multiplier ICs and their applications, Operation of the basicPLL, Closed loop analysis, Voltage controlled oscillator, Monolithic PLL IC 565, application of PLLfor AM detection, FM detection, FSK modulation and demodulation and Frequency synthesizing.
UNIT - IV ANALOG TO DIGITAL AND DIGITAL TO ANALOG CONVERTERS
Analog and Digital Data Conversions, D/A converter – specifications - weighted resistor type, R-2R Ladder type, Voltage Mode and Current-Mode
R-2R
Ladder types - switches for D/Aconverters, high speed sample-and-hold circuits, A/D Converters – specifications - Flash type -Successive Approximation type - Single Slope type – Dual Slope type - A/D Converter usingVoltage-to-Time Conversion - Over-sampling A/D Converters.
UNIT - V WAVEFORM GENERATORS AND SPECIAL FUNCTION ICs
Sine-wave generators, Multivibrators and Triangular wave generator, Saw-tooth wavegenerator, ICL8038 function generator, Timer IC 555, IC Voltage regulators – Three terminalfixed and adjustable voltage regulators - IC 723 general purpose regulator – Monolithicswitching regulator, Switched capacitor filter IC MF10, Frequency to Voltage and Voltage toFrequency converters, Audio Power amplifier, Video Amplifier, Isolation Amplifier, Opto-couplersand fibre optic IC.
TEXT BOOKS:
1. Sergio Franco, Design with operational amplifiers and analog integrated circuits, 3rd Edition,Tata McGraw-Hill, 2007.2. D.Roy Choudhry, Shail Jain, Linear Integrated Circuits, New Age International Pvt. Ltd.,2000.
REFERENCES:
1. B.S.Sonde, System design using Integrated Circuits , New Age Pub, 2
nd
Edition, 20012. Gray and Meyer, Analysis and Design of Analog Integrated Circuits, Wiley International,2005.3. Ramakant A.Gayakwad, OP-AMP and Linear ICs, Prentice Hall / Pearson Education, 4thEdition, 2001.4. J.Michael Jacob, Applications and Design with Analog Integrated Circuits, Prentice Hall of India, 1996.5. William D.Stanley, Operational Amplifiers with Linear Integrated Circuits, Pearson Education,2004.6. K Lal Kishore, Operational Amplifier and Linear Integrated Circuits, Pearson Education, 2006.7. S.Salivahanan & V.S. Kanchana Bhaskaran, Linear Integrated Circuits, TMH, 2008.
 
 Linear Integrated CircuitsVVCET – Dept. of ECE
UNIT-I CIRCUIT CONFIGURATION FOR LINEAR ICs1.
 
Define an Integrated circuit.
An integrated circuit(IC) is a miniature, low cost electronic circuit consisting of active andpassive components fabricated together on a single crystal of silicon. The active componentsare transistors and diodes and passive components are resistors and capacitors.
2.
 
Mention the advantages of integrated circuits.
 
 
Miniaturisation and hence increased equipment density.
 
Cost reduction due to batch processing.
 
Increased system reliability due to the elimination of soldered joints.
 
Improved functional performance doe to Matched devices.
 
Increased operating speeds.
 
Reduction in power consumption.
3.
 
Write down the various processes used to fabricate IC’s using silicon planartechnology.
 
Silicon wafer preparation.
 
Epitaxial growth
 
Oxidation.
 
Photolithography.
 
Diffusion.
 
Ion implantation.
 
Isolation.
 
Metallisation.
 
Assembly processing and packaging.
4.
 
List out the steps used in the preparation of Si – wafers.
 
Crystal growth &doping
 
Ingot trimming & grinding
 
Ingot slicing
 
Wafer policing & etching
 
Wafer cleaning
5.
 
What is the purpose of oxidation?
 
SiO2 is an extremely hard protective coating and is unaffected by almost all reagents.
 
By selective etching of SiO2, diffusion of impurities through carefully defined windowscan be accomplished to fabricate various components.
6.
 
What are the two important properties of SiO2?
 
SiO2 is an extremely hard protective coatng & is unaffected by almost all reagentsexcept by hydrochloric acid. Thus it stands against any contamination.
 
By selective etching of SiO2 , diffusion of impurities through carefully defined windows inthe SiO2 can be accomplished to fabricate various components.
7.
 
Why aluminium is preferred for metallization?
 
It is a good conductor.
 
it is easy to deposit aluminium films using vacuum deposition.
 
It makes good mechanical bonds with silicon.
 
It forms a low resistance contact.
8.
 
What are the popular IC packages available?
 
Metal can package.
 
Dual-in-line package.
 
Ceramic flat package.
9.
 
Write the basic chemical reaction in the epitaxial growth process of pure silicon.
The basic chemical reaction in the epitaxial growth process of pure silicon is the hydrogenreduction of silicon tetrachloride.1200
o
CSiCl
4
+ 2H
2
< ------------ > Si + 4 HCl

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