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Indeed, from 2010 and toward the next decade, the time has come that high-end and low-end markets start converging: digital cameras are on the way to get real Hd video camcorder features. Meanwhile, camera cell-phones with auto-focus capability are on the way to get real digital still camera features along with basic video recording functionality.
CMOs sensor technology will continue to expand and finally take the advantage in the remaining CCd application space as soon as 300mm infrastructure will build-up in asia and BsI CMOs technology will be made available. In the high-end camera phone market segment, disruptive new camera module concepts including Auto-focus, Zoom and Image stabilization features will be developed and introduced to the market. In the ultra-competitive low-end market, the race toward Wafer Level Cameras and digital autofocus features such as edof (extended depth of focus) will enable the few remaining image sensor players to preserve their margins in this aggressive and cost driven market. future CIs markets such as medical and automotive sensor applications will re-use extensively all these newly developed concepts (BsI, WLCamera, digital zoom) plus will need new features to be developed such as High dynamic Range and nIR capability.
s these markets will progressively converge, key enabling technologies will be developed and are paving the way to the future growth of digital imaging industry:
To provide key technical insight about future technology trends & challenges:
- from BsI (Backside illuminated sensor) and other front-end technologies evolution (Pixel isolation, color filters, micro-lenses) to WLC (Wafer Level Cameras) realization with wafer level optics, Packaging / assembly & Test (Wafer Level Packaging and 3d TsV interconnects), WdR (Wide dynamic Range) sensor technologies, Image stabilization & auto-focus technologies (edof, Piezo, other mechanical af, MeMs based, WL auto-focus or liquid lenses)
- Who are the CMOs image sensor players (IdMs, foundries, design houses) and how are they related? - What are the key suppliers and emerging infrastructure for BsI, Wafer Level Cameras, and future optical camera module technologies?
TaBLe Of COnTenTs
Objectives & Scope of the report Executive Summary 1) Introduction & Background
CCd versus CMOs sensors
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2007-2015 CMOs image sensor forecasts o shipments forecasts (in Munits) o Revenues forecasts (in $M) o Wafer production forecasts (in wafer size eq.) Global CMOs image sensor manufacturing infrastructure & supply value chain 2009 market shares (both in unit shipments, wafer production and revenues)
3) Application Focus
automotive sensors o applications, specifications, markets & supply chain security & surveillance sensors o applications, specifications, markets & supply chain Medical sensors o applications, specifications, markets & supply chain Industrial & Machine vision sensors o applications, specifications, markets & supply chain
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Motivations & applications for BsI sensors Technologies for BsI manufacturing o Initial substrate techno (sOI or Bulk silicon)? and manufacturing infrastructure (200mm or 300mm?) o Pixel isolation technologies, Thickness of final active silicon o Type of bonding technology between wafer carrier and the active silicon? o Grinding technologies (CMP, mechanical plus dry etching) and etch stop layer choice for backside exposure (oxide, implant gradient) o Qe specifications targets. specific backside passivation in order to decrease the dark current? anti reflective coating technologies Players & status of commercialization future approach: 3d integrated image sensors
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BIOs
Laurent Robin is in charge of the MeMs & sensors market research at yole developpement. He previously worked at image sensor company e2v Technologies (Grenoble, france) and at eM Microelectronics (switzerland). He holds a Physics engineering degree from the national Institute of applied sciences in Toulouse. He was also granted a Master degree in Technology & Innovation Management from eM Lyon Business school, france. Jerome Baron is leading the MeMs & advanced Packaging market research at yole developpement. He has been involved in the analysis of the CMOs image sensor industry at the sensor, packaging, assembly & test levels. He is also involved in the research linked to new equipment & materials for image sensor manufacturing. He was granted a Master of science degree in nanotechnologies from the national Institute of applied sciences in Lyon, france.
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