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Table Of Contents

Single-Crystal Ingot to Wafer
Oxidation Converts Si to SiO
Donor Atoms Provide Electrons
Acceptor Atoms Remove Electrons
from Nearby Atoms
Deposition and Ion Implantation
Common Dopant Mask Materials
Selective Diffusion Process
Positive Resist Example
Technique 1
Technique 2
Lithography Pattern Transmission
Lithographic Printing
Contact and Proximity Printing
Projection Printing
Refraction Projection Printing
Reflection and Catadioptric
Minimum Channel Length
and Gate Insulator Thickness
Improve Performance
Silicon Gate Process, Steps 1 & 2
Silicon Gate Process, Step 3
Silicon Gate Process, Steps 4 & 5
Silicon Gate Process, Final Steps
Parasitic MOS transistors
Four Main CMOS Processes
n-well Process, n-Well Mask A
n-well Process, Field Oxide Step D
n-well Process, Birdµs Beak
n-well Process, Planarity
n-well Process, Poly Mask E
n-well Process, n+ Mask F
n-well Process, LDD Step G
n-well Process, p+ Mask H
n-well Process, Contact Mask I
n-well Process, Metal Mask J
p-Well Process
Twin-Tub Process
Silicon-on-Insulator Process
SOI Process Advantages
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Cmpe222 03process Ppt

Cmpe222 03process Ppt

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Published by: ashok_larkha4334 on Jun 19, 2011
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