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Table Of Contents

Thermal Impact on Interconnect Design
3.1 Introduction
3.2 Thermal Effect on Interconnect Metrics
3.2.1 RC delay
3.2.2 Dynamic power consumption
3.3 Scaling Trend of Joule Heating
3.4 Temperature Effect on Cu/low-k Interconnects
3.4.1 Definition of worst case condition
3.4.1 Thermal impact on Cu/low-k Interconnects
3.5 Delay and Reliability Optimization
3.6 Impact of Joule Heating on Scaling Trend
4.2 SPICE-Based Thermal Modeling
4.3.1 Impact of Via Separation on Effective kILD
4.3.2 Thermal Coupling Effects
4.4. Transient Stress Analysis
4.4.2. Al vs. Cu Interconnects
4.4.3 Impact of Via Separation and Low-k Dielectrics
4.4.5. Impact of Interconnect Aspect Ratio
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Electrothermal Analysis Of

Electrothermal Analysis Of

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Published by Dhruva Bedre

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Published by: Dhruva Bedre on Sep 02, 2011
Copyright:Attribution Non-commercial

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