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Table Of Contents

1.0 ACKNOWLEDGEMENT
2.0 INTRODUCTION TO ON SEMICONDUCTOR
2.1 HISTORY OF MOTOROLA SPS
2.2 HISTORY OF ON SEMICONDUCTOR MALAYSIA
2.3 CHRONOLOGY OF ON SEMICONDUCTOR SEREMBAN
2.4 VISION & MISSION
3.0 OVERVIEW OF ON SEMICONDUCTOR SEREMBAN
3.2 COMPANY ORGANIZATION CHART
3.3 ORGANIZATION CHART FOR POWER IC DEPARTMENT
4.0 PROCESS FLOW IN POWER IC
4.1.1 Wafer Mount
4.1.2 Wafer Saw and Wash
4.1.3 Die Bond
4.1.4 Wire Bond / Clip Bond
4.2.1 Mold
4.2.2 Plating
4.3.1 Trim / Form (singulation)
4.3.2 Electrical Test
4.3.3 Marking
4.3.4 Packing
4.4 Product of Power IC (PPD-IC)
5.0 Training Activities
5.1 Front End
5.2.1 DELAM (SAT Analysis)
5.2.2 Wire Sweep Analysis (X-RAY)
5.2.3 Cross-Sectioning
5.3.1 LOW POWER MICROSCOPE
5.3.2 HIGH POWER MICROSCOPE
6.0 PROJECT IN ON SEMICONDUCTOR
7.0 PROBLEM
8.0 REFERENCES
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Published by Samuel Chai

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Published by: Samuel Chai on Sep 11, 2011
Copyright:Attribution Non-commercial

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05/25/2012

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