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Table Of Contents

Introduction
1.1Simple Illustration of Constrained Deformation
1.2 Applications
1.2.1 Deformation in Micromachined Structures
1.2.2 Microelectronic Devices and Packages
1.2.3 Materials with Internal Structure
1.3 Outline and Scope
2.1 Stress and Strain
Mechanics Preliminaries
2.2 Elastic Deformation
2.3 Plastic Deformation
2.3.1 Uniaxial Response
2.3.2 Multiaxial Response
2.4 Time-Dependent Deformation
2.4.1 Viscoplastic Response
2.4.2 Viscoelastic Response
2.5 Thermal Expansion and Thermal Mismatch
2.6 The Numerical Modeling Approach
2.6.1 Example: Sanity Test
2.6.2 Example: Proper Interpretation and Use of the Output
2.7 Choosing the Appropriate Constitutive Model
References
Thin Continuous Films
3.1 Basic Elastic-Plastic Response
3.1.1 Mechanical Loading
3.1.2 Equi-biaxial Stress State and Thermal Loading
3.2 Yielding and Strain Hardening Characteristics
3.3 Film on a Compliant Substrate
3.4 Mechanical Deflection of Microbeams
3.5 Thermal Deflection of Microbeams
3.5.1 Bi-layer Beam
3.5.2 Tri-layer Beam
3.6 Rate-Dependent Behavior
3.6.2 Stress Evolution During Temperature Cycles
3.7 Indentation Loading
3.7.1 Indentation-Derived Elastic Modulus and Hardness
3.8 Projects
Patterned Films in Micro-devices
4.1 Basic Consideration
4.1.1 Elastic Lines on a Thick Substrate
4.1.2 Elastic-Plastic Lines on a Thick Substrate
4.2 Passivated Single-Level Lines
4.2.1 Aluminum Interconnects
4.2.2 Copper Interconnects
4.3 Complex In-plane Geometries
4.4.2 Copper Lines and Via
4.4.3 Stresses in Barrier Layers and Dielectrics
4.5 Lines with Pre-existing Flaws
4.5.1 Effect of Local Debond
4.5.2 Deformation Induced Void Opening
4.6 Voiding Damage and Stress Relaxation
4.6.1 Voiding Induced Stress Relaxation
4.6.2 Time-Dependent Deformation and Void Growth
4.7 Projects
Electronic Packaging Structures
5.1 Quantification of Solder Deformation
5.1.1 Lap-Shear Model and Stress Evolution
5.1.2 Strain Quantification
5.1.3 Substrate Geometry and Rigidity
5.2 Plastic Flow Inside a Solder Joint
5.2.1 Elastic-Plastic Analysis
5.2.2 Rate-Dependent Model
5.3 Side Constraint: Effect of Underfill
5.3.1 Shear Loading
5.3.2 Effect of Superimposed Tension
5.4 Stress Field Around the Solder Joint
5.5.1 Elastic Analysis
5.5.2 Nonlinear Viscoelastic Analysis
5.6 Projects
6.1.1 Multilayered Structures
6.1.2 Long Fiber Composites
6.1.3 A Matrix Containing Discrete Particles
6.2 Effective Plastic Response
6.2.1 Effect of Reinforcement Shape
6.2.2 Effect of Reinforcement Distribution
6.2.3 Effect of Thermal Residual Stresses
6.2.4 Cyclic Response
6.2.5 Explicit Versus Homogenized Two-Phase Structures
6.3 Effective Thermal Expansion Response
6.3.1 Basic Consideration
6.3.2 Effect of Phase Contiguity
6.3.3 Composites with Imperfect Metal Filling
6.3.4 Viscoelastic Matrix Composites
6.4 Internal Deformation Pattern and Damage Implication
6.4.2 Particle Dispersion and Ductility Enhancement
6.5 Indentation Response
6.5.1 Metallic Multilayers: Yield Properties
6.5.2 Metal-Ceramic Multilayers
6.5.3 Particle-Matrix Systems
6.6 Projects
7.1 Material Parameters and Constitutive Models
Challenges and Outlook
7.2 Technological Relevance
7.3 Learning from Nature
7.4 Beyond Deformation
7.4.1 Case Study: Ductile Failure in Solder Joint
Index
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Constrained Deformation of Materials Devices Heterogeneous Structures and Thermo Mechanical Modeling

Constrained Deformation of Materials Devices Heterogeneous Structures and Thermo Mechanical Modeling

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Published by: oceanico123 on Oct 06, 2011
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05/19/2013

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