Welcome to Scribd, the world's digital library. Read, publish, and share books and documents. See more
Download
Standard view
Full view
of .
Look up keyword
Like this
3Activity
0 of .
Results for:
No results containing your search query
P. 1
EPD_Syllabus

EPD_Syllabus

Ratings: (0)|Views: 79|Likes:
Published by api-3728874

More info:

Published by: api-3728874 on Oct 16, 2008
Copyright:Attribution Non-commercial

Availability:

Read on Scribd mobile: iPhone, iPad and Android.
download as DOC, PDF, TXT or read online from Scribd
See more
See less

05/09/2014

pdf

text

original

B. E. (E & TC) (200 3 Co ur se )
ELECTR ONIC PRODUCT DESIGN
TEACHERS MANUAL AND GUIDELINES FOR TEACHING
NOTES:
(X)- means .pdf of original is on CD.
(N)- means Notes are on CD.
Italicized matter indicates instructions to teachers.
UNIT I: Product Design and Development
1.An overview of Product development stages- See CD (N). Scope and approach is limited
to what is mentioned in the note.
2.Assessment of Reliability \u2013See CD (N). Scope and approach is limited to what is
mentioned in the note. R4 \u2013 Chapter 1- Sections 1.2, 1.3, 1.4, 1.5 (X).
3.Ergonomic and Aesthetic Design Considerations- CEDT Notes (X). Condense the notes to
1 lecture only.
4.Quality Assurance- R1- Section 11.6.13- (X).
5.Packaging and Storage- See CD-http://w ww.fieldlabeling.co m/pages/ip.h t m - Ingress
protection Standards. R3- Extracts from Chapter 5. Condense to 1 lecture only.
6.Estimating Power Supply Requirements- See CD- Fairchild Semiconductors
http://www.fairchildsemi.com Application Note AN-303 HC-MOS Power Dissipation. Texas
Instruments- http://application-notes.globalspec.com/ Document No. SCAA 035, June 1997.
Cover considerations in theory class and assignment in Prcaticals.
7.Power supply protection devices- See CD- Vishay -http:/ /w ww.visha y.co mApplication
Note Hardening Power Supplies To Line Voltage Transients. R3- Extracts from Chapter 6.
T1- Extracts from Chapter 68- Sections 68.1, 68.2, 68.3, 68.4 (X). Condense to 2 Lectures.
8.Noise reduction, Grounding, Shielding and Guarding techniques- See CD-Analog

Devices-http://www.analog.com Application Note AN-208 Mixed Signal Circuit Techniques- Pages 24-69 to 24-84. T1- Extracts from Chapter 142 (X). R3- Extracts from Chapter 6. T1- Chapter 74 Sections 74.1, 74.2, 74.3. (X). Condense to 2 lectures.

9. Thermal Management- Philips Semiconductors-
http://www.semiconductors.philips.com/acrobat_download/applicationnotes/APPCHP7.
pdfPages 567 to 573, T3- Extracts from Chapter 10. T1- Chapter 75 Sections 75.1,
75.3, 75.4 (X). Condense to 1 lecture.
UNIT II: PCB Designing
1.General Considerations- See CD- Lattice Semiconductor Corporation-
http://www.latticesemi.comExtracts from Application Note 6012 (Sept 1999)- Analog
Layout and Grounding Techniques, Lattice Semiconductor Corporation-
http://www.latticesemi.comTechnical Note TN 1068 (May 2004)- Power Decoupling and

Bypass Filtering for Programmable Devices. Maxim-http://www.maxim-ic.com/an637
Application Note 637 Getting the Most from Your Sensor & Conditioning Electronics.
Analog Devices-http://www.analog.com Application Note AN-208 Mixed Signal Circuit
Techniques- Pages 24-69 to 24-84. Cover material in UNIT II- 1 and 2 in 3 lectures.

Coverage to include- Gneral component placement guidelines ,Analog and digital signal
grounding, grounding practices, ground planes, thermal and heat flow considerations.
2.Layout considerations- R3- Sections 8.3, 8.4, 8.5. R2- Sections 4.1, 4.2, 4.3, 4.4, 4.8 (X)
3.Study Of Packages for Discrete Devices and ICs- T1- Chapter 55 (X), R1- Section 2.9 (X).
Cover in 1 lecture.
4.Calculation of Parasitic Elements in PCB- See CD-Analog Devices- Application Note AN-
208 Mixed Signal Circuit Techniques- Pages 24-54, 24-55, 24-58 to 24-68. T1- Section 71.4
(X). R2- Section 3.4 (X). Cover numerical based on formulae given in Analog devices
application note.
5.High Speed and EMI/EMC Considerations in PCB Designs- See CD- Altera Corporation-
Application Note AN 75- High Speed Board Designs.
http://www.icd .co m.au/artic les/ e mc.ht ml - EMC Design for High Speed PCBs. R3- Chapter
7- Section 7.5

6.Mounting in presence of vibrations- R3- Section 5.5. Self study.
7.SMD assemblies - T1- Chapter 73 (X). R2- Sections 13.9.2 (X). Self study
8.Testing of Assembled PCBs- R2- Chapter 14- Section 14.4.3 (X). Self study

UNIT III: Hardware Design and Testing Methods
1.Use of Logic Analyzer- See CD- Extracts from- Tektronix Application Note- XYZs of Logic
Analyzer. T1- Chapter 133 (X). R4- Chapter 3. Sections 3.3, 3.3.2, 3.3.3, 3.4 (X).
2.Use of DSO, MSO and DPO- See CD- Extracts from- Tektronix Application Note- XYZs of
Oscilloscopes

Draw extracts form application notes where teaching material cover basic understanding of new generation oscilloscopes. The focus should be on understanding limitations of each type of oscilloscopes and improvements done in next type. Teach how to USE these oscilloscopes and not theory behind them.

3. Signal Integrity issues-
4.DC or Operating Point Analysis, AC Analysis, Transient analysis, Monte Carlo Analysis-
See CD (N).
UNIT IV: Software Design and Testing Methods
1.Software design- (X). See Xerox supplied.
2.Use of Simulators, Emulator, Assemblers, Cross-compilers- R8- Extracts from Chapter 8
and 10. R9- Chapter 4, Section 4.2 (page 98) and Section 4.5. Approach is to make students

aware of different types of Assemblers, Compilers and Cross-compiler, simulators and In- circuit emulators; with focus on How to use them for software development. Aspects like- When to use Assembly language and when to use High level language should be covered. Development of system software is NOT implied. Development of product software is implied.

3.ASM/ FSM Design- Draw extracts fromR7- Approach should be- How method is used for

digital designs and VLSI designs.
Scope of software design and testing is limited to product related software development. To
this extent, programming PLDs should also be covered. System software development is not
implied.

UNIT V: Product Testing
1.Environmental Testing- See CD (N). Limit scope to what is indicated in notes.
2.UL/CE Marking- See CD.
3.EMI/EMC Compliance testing- See CD. Limit scope to creating awareness about- What is
conducted EMI, Radiated EMI. Why EMI/EMC tests are important. What are different tests
carried out on products and what is the typical test set up.
UNIT VI: Documentation

1.PCB Documents- R2- Chapter 3, Section 3.12 (X)
2.Bare Board Testing- See CD. R2- Chapter 14- Section 14.4.2 (X)
3.Product Test Specifications- See CD (N).
4.Interconnection Diagrams- See CD (N). Give an assignment in the class to prepare

interconnection diagram for Mini-project done.
5.Software documentation practices- Scope should be limited to standard practices of
documenting assembly and C language programmes for product development. Standard C
temlpatae is to be used for illustration.
List Of Text Books, Handbooks and Reference books-

T1-J. C. Whitaker, The Electronics Handbook, CRC Press, IEEE Press
R1- Handbook Of Electronic Package Design- Michael Pecht, Mercel Dekker Inc., ISBN 0-8247-7921-5
R2- Printed Circuit Boards Design, Fabrication, Assembly and Testing- R. S. Khandpur, Tata McGraw

Hill
R3- Electronic Instrument Design, Architecture for life cycle, Kim R. Fowler, Oxford University Press
Inc.

R4- Handbook Of Analytical Instruments- R. S. Khandpur, Tata McGraw Hill
R5- Software Engineering- Pressman, Prentice Hall India
R6- Design with Microcontroller- J. B. Peatman
R7- Art Of Digital Design- Winkel, Prossor
R8- Programming and Customizing the 8051 Microcontroller- Myke Predko, Tata McGraw-Hill

Publication
R9- The 8051 Microcontroller- Kenneth J. Ayala, Second Edition, Tata McGraw-Hill Publication

You're Reading a Free Preview

Download
scribd
/*********** DO NOT ALTER ANYTHING BELOW THIS LINE ! ************/ var s_code=s.t();if(s_code)document.write(s_code)//-->