Generic Repair Manual

Generic Repair Manual
- electrical -
1220-1336 Rev 1 Sony Ericsson Mobile Communications AB Company Internal
Generic Repair Manual (elect)
This Generic Repair Manual electrical consists of generic information and is as such a complementary document to the following product specific repair documents: Tests & Calibration - electrical Troubleshooting Guide - electrical Component Replacement - electrical Since the content of this Generic Repair Manual is valid for all phone models to be launched within a foreseeable future, the information to be found in this manual will not be copied to the documents listed above. If you for some reason will find a discrepancy between this manual and any product specific document, the information found in the product specific document should be regarded as the valid source of information.
1220-1336 Rev 1
Sony Ericsson Mobile Communications AB Company Internal
2(37)
CONTENTS
1 2 Process Flow Chart ........................................................................ 4 Setup Go/NoGo Test ...................................................................... 5
2.1 2.2 2.3 2.4 Stand-Alone vs. SERP ........................................................................... 5 Antenna Coupler vs. Direct Line .......................................................... 5 Antenna Coupler Testing ...................................................................... 6 Direct Line Testing................................................................................. 7
2.4.1 Direct Line ....................................................................................................... 7 2.4.2 Direct Line with RF Fixture ............................................................................ 7
2.5 Connections ........................................................................................... 8

2.5.1 Stand-Alone .................................................................................................... 8 2.5.2 SERP................................................................................................................ 8
3 4 5 6 7
Troubleshooting Directions .......................................................... 9 Moisture & Baking ........................................................................ 11 PBA Component Finder ............................................................... 12 Soldering ....................................................................................... 13
6.1 Lead-Free Soldering ............................................................................ 13 6.2 Temperature Issues ............................................................................. 15
Go/NoGo Testing .......................................................................... 16

7.1 7.2 7.3 7.4 7.5 7.6 Overview ............................................................................................... 16 Channel Allocation Table .................................................................... 17 Power Level Allocation Table ............................................................. 17 Test Limits ............................................................................................ 18 Attenuation Factors ............................................................................. 18 Test Sequence Antenna Coupler..................................................... 19
7.6.1 7.6.2 7.6.3 7.6.4 7.6.5 7.6.6 7.6.7 7.6.8 7.7.1 7.7.2 7.7.3 7.7.4 7.7.5 7.7.6 7.7.7 7.7.8 GSM 850 - Measurements & Test Limits..................................................... 20 GSM 1900 - Measurements & Test Limits................................................... 21 GSM 1800 - Measurements & Test Limits................................................... 22 GSM 900 - Measurements & Test Limits..................................................... 23 UMTS 850 - Measurements & Test Limits................................................... 24 UMTS 1700 - Measurements & Test Limits................................................. 25 UMTS 1900 - Measurements & Test Limits................................................. 26 UMTS 2100 - Measurements & Test Limits................................................. 27 GSM 850 - Measurements & Test Limits..................................................... 29 GSM 1900 - Measurements & Test Limits................................................... 30 GSM 1800 - Measurements & Test Limits................................................... 31 GSM 900 - Measurements & Test Limits..................................................... 32 UMTS 850 - Measurements & Test Limits................................................... 33 UMTS 1700 - Measurements & Test Limits................................................. 34 UMTS 1900 - Measurements & Test Limits................................................. 35 UMTS 2100 - Measurements & Test Limits................................................. 36
7.7 Test Sequence Direct Line ............................................................... 28
Revision History ........................................................................... 37
1220-1336 Rev 1
3(37)
Process Flow Chart

1. Unit in
1. Unpack and handle the unit according to local instructions. 2. Use the Test Instructions - mechanical to confirm that the phone is faulty and try to verify customers complaint. Perform those tests needed for confirmation of the failure. If a software fault or no fault is found, upgrade the software. If a hardware fault is found, start troubleshooting. 3. If liquid intrusion or other kind of abuse can be established, the unit must be rejected according to your local instructions.
Fault not repairable at this service level! Cause of failure not found!
Software fault found! No fault found!
2. Determine fault
Liquid intrusion check!
3. Customer abuse! Reject!
Hardware fault found!
4. Troubleshoot
4. Use the Troubleshooting Guides - mechanical & electrical, to determine the cause of failure.
5. Repair
Fault not repairable at this service level!
5. Use the Working Instructions - mechanical & Component Replacement - electrical, to repair the unit. Parts that can be replaced are found in the Part List mechanical and Component Replacement - electrical. 6. Look for software information in the document Customization. Upgrade to the latest software revision, if needed, and report as SW Upgrade. If no fault has been found, alternatively perform a Software Update Content Refresh. 7. If a repair that requires calibration has been done, then calibrate the unit using SERP as described in Tests & Calibration electrical. TO BE DONE BY AUTHORIZED SERVICE CENTERS ONLY!
6. Upgrade software to latest revision (if needed)
7. Calibration (if needed)
8. Update with LabelMake (if needed)
8. If required, print out and attach a new label as described in the Working Instructions - mechanical.
Fail!
9. Test
9. Perform all tests described in the Test Instructions mechanical and Tests & Calibration - electrical.
Pass! 10.. Unit out
10. Handle and package the unit according to local instructions. If no fault has been found, report as NTF. 11. If a failure cannot be found or be repaired at this service level, choose one of the following alternatives: - Swap the unit according to the Swap Instructions and local instructions - Return the unit to the customer on request - Send the unit to next level of repair according to local instructions
11. Repair cannot be carried out
1220-1336 Rev 1
4(37)
Setup Go/NoGo Test
All Go/NoGo tests are based on SEMC approved test instruments to be installed with: a SEMC Go/NoGo test script to be downloaded from vendor site a locally written Go/NoGo test script and the test result has to be verified against the Go/NoGo Testing. Non-SEMC test scripts need to be approved by SEMC!
2.1
Stand-Alone vs. SERP
The handling and control of the test instrument can be done in two ways, Stand-Alone or SERP.
STAND-ALONE
The test instrument controls the entire testing, and: - a relatively inexpensive test instrument can be used - is suitable for service centers not being authorized to perform calibrations
SERP
The test instrument executes the testing but is controlled by the SERP application of a computer, and: - a rather expensive test instrument must be used - is suitable for service centers being authorized to carry out calibrations (no need for a separate Stand-Alone test instrument)
2.2
Antenna Coupler vs. Direct Line
The input readings to the test instruments can be setup in two different ways: - Antenna Coupler (a radiated test inside a shield box) - Direct Line (a conductive test from the phones external antenna connector, with or without an RF Fixture, depending on the phone model to be tested).
ANTENNA COUPLER
Testing with an Antenna Coupler is considered to be the best alternative: - testing can be done on all phones - the shield box isolates the phone and makes it non-susceptible to exterior interference - the entire phone is tested Testing can be done with a fully charged battery or a dummy battery with external power supply (if the shield box is prepared for this). However, testing with a fully charged battery is the preferred method, since the presence of a standard battery may affect the readings in a more accurate way.
DIRECT LINE
Testing with Direct Line implies certain limitations: - testing can only be done on phones with an external antenna connector - the phone may be susceptible to exterior interference - the function of the phones internal antenna is not tested If a Direct Line test says Go, the phone ought to be tested with an Antenna Coupler and if this test says NoGo, there is probably an antenna related problem with the phone.
1220-1336 Rev 1
5(37)
Setup Go/NoGo Test
2.3
Antenna Coupler Testing
The grid positioning plate of the shield box, containing the antenna coupler, includes a number of holes arranged in a grid, X-axis = A to R and Y-axis = 1 to 25, where the grid positioning holder will be placed.
Place the grid positioning holder with its reference point (see arrow) in the matrix position stated in the product specific document Tests & Calibration for the phone. Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument, attach a fully charged battery and the battery cover. Place the phone in the antenna coupler as shown in Tests & Calibration and Rohde & Schwarz grind plat for SERP and close the lid of the shield box. Start the test instrument, run the proper test script and follow the instructions on the test instrument.
The product specific documents Tests & Calibration will include a picture similar to the adjacent one that clearly specifies how to position the grid positioning holder and the phone.
1220-1336 Rev 1
6(37)
Setup Go/NoGo Test
2.4
Direct Line Testing
2.4.1 Direct Line

Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument and connect a fully charged standard battery and battery cover or a dummy battery with external power supply. Remove the phones external antenna cap and connect the RF Antenna Adaptor to the antenna connector on the phone. Connect the other end of the cable to the test instrument. Start the instrument, run the proper direct line script and follow the instructions on the test instrument.
2.4.2 Direct Line with RF Fixture

Insert a test USIM (a standard test SIM can be used for GSM phones only) that is compatible with the instrument and connect a fully charged standard battery and battery cover or a dummy battery with external power supply and, if necessary, the battery cover. Remove the phones external antenna cap and mount the RF Antenna Adaptor on the RF Fixture and attach the RF cable. Secure the phone to the fixture and connect the opposite end of the RF cable to the test instrument.
Start the instrument, run the proper test script and follow the instructions on the test instrument.
1220-1336 Rev 1
7(37)
Setup Go/NoGo Test
2.5
Connections
Optional Printer cable
2.5.1 Stand-Alone
Connect the RF cable to the test device (antenna coupler or direct line) and the RF-port of the test instrument. The optional printer is connected to the test instrument and is recommended for printouts of the test results.
RF cable
Printer cable Optional
2.5.2
SERP
GPIB cable
Connect the RF cable to the test device (antenna coupler or direct line) and the RF-port of the test instrument. The computer includes a GPIB card that connects to the test instrument via the GPIB cable. The optional printer is connected to the computer and is recommended for printouts of the test results.
RF cable
1220-1336 Rev 1
8(37)
Troubleshooting Directions
GENERAL
The product specific document Troubleshooting Guide - electrical should be used only after the actions from the Troubleshooting Guide - mechanical repair have been exhausted for the specific symptom. The purpose of the Troubleshooting Guide - electrical is to indicate the electrical level repair actions associated with the different failure symptoms. For symptoms that have multiple repair actions, the repair actions are listed in order of their probability of creating a successful repair.
EXAMPLE
Power On/Off
Symptom: Current draw when powered off V0302 N5700 N7520 Replace: The first action has the highest probability, and subsequent actions have lower probabilities, e.g. V0302 N5700 N7520. The intention is for the repair technician to implement the first repair action and then retest the phone. If the phone continues to fail the same test, then the technician should continue to the second repair action. If the phone continues to fail the same test after all of the repair actions are exhausted, then the phone will be considered not repairable at this level.
EQUIPMENT & MEASUREMENTS

Voltage, current, and resistance information is provided for some symptoms to enable faster repairs. A power supply with digital current display and a DMM (Digital MultiMeter) are required for these purposes as shown in the pictures below. Purchase of such equipment and performing these measurements are optional but recommended.
Perform current measurements using a dummy battery and power supply with digital current display. The phone should be fully assembled (battery cover not required).
1220-1336 Rev 1
9(37)
Troubleshooting Directions
Use the DMM to carry out voltage measurements on diodes.
Use the DMM to carry out resistance measurements.
ADDITIONAL TROUBLESHOOTING INFORMATION

Certain steps in the troubleshooting flow may require additional visual information. To jump to that information, click on the Go To icon To revert to the previous position in the troubleshooting flow, click on the Return icon For service centers using hard-copies the additional information is found at the end of the Troubleshooting Guide electrical under section Additional Info (if applicable).
1220-1336 Rev 1
10(37)
Moisture & Baking
Some components in the products are moisture sensitive and must be baked prior to use, if they have been exposed to air. These components and their moisture sensitivity levels are specified in the product specific document Component Replacement, section Component Placing. Below is a brief description of moisture sensitivity levels, but repair centers should visit the JEDEC website for more details before reworking moisture sensitive components. Search for the most recent version of the IPC/JEDEC J-STD-033A standard online at http://www.jedec.org
LEVEL 1
- unlimited floor life, does not require dry pack or re-baking
LEVEL 2
- 1 year floor life
LEVEL 2A
- 4 weeks floor life
LEVEL 3
- 168 hours floor life
LEVEL 4
LEVEL 5
LEVEL 5A
LEVEL 6
COMMON TO LEVEL 2, 2A ,3 ,4 ,5 ,5A, 6

- 30oC at 60% relative humidity - shipped in dry pack - must be re-baked after being opened If floor life is exceeded Parts shipped from a Sony Ericsson parts warehouse are most likely not shipped in dry packs. This means that the time elapsed between placing the order and receiving the parts must be considered as time exposed to the environment. Different moisture sensitivity levels and exposure times create the need for different baking temperatures and times. For more information regarding baking, refer to: SEMC PBA Repair Requirement Specification Repair Centers, 1/1056-LXE110 0378.
1220-1336 Rev 1
11(37)
PBA Component Finder
Use Adobe Reader 8 (or later) to open the PDF-document containing the component placing and then locate the Find box.
Type the position number of the component to be found and press Enter.
The position number of the component is shown with shaded text. If necessary, use the Zoom function (blue ellipse above) to find the shaded text.
1220-1336 Rev 1
12(37)
6
6.1
Soldering
Lead-Free Soldering
All recent Sony Ericsson mobile phones are manufactured with lead-free solder and lead-free components! During electrical repair, it is critical to make sure that no lead is introduced. This symbol indicates that the product is lead- free.
All lead-free PBAs will be marked with this symbol.
A lead-free work area must be set up completely separated from work areas that are used to make lead repairs. The lead-free work area must also be clearly labeled with the lead free symbol as shown in the adjacent picture. The items on this desk must remain lead-free. They must be adequately labeled to make their lead-free status clearly and easily recognized.
LFS (lead-free solder paste) characteristics: - high melting point (typically 220C) - low wetability - high surface tension - difficult to spread - recommended tip temperature = 360C When servicing PBAs that have been manufactured with LFS (lead-free solder paste), LFS must be used. If not, there is a high risk for unreliable soldering joints. Lead-free solder joints are more difficult to inspect as they do not have shiny surfaces like leaded solder joints and lead-free solder does not flow as well as leaded solder, so some of the solder pad areas may remain exposed.
1220-1336 Rev 1
13(37)
Soldering: Lead-Free Soldering
Solder joints with lead: Shiny surface!
Lead-free solder joints: Matt surface!
1220-1336 Rev 1
14(37)
Soldering
6.2
Temperature Issues
HOT AIR GUN TEMPERATURE REQUIREMENTS

The air temperature must not exceed 360oC. This temperature should be measured 5 mm from the nozzle outlet. If it is not possible to remove and/or solder with 360oC, another repair process (e.g. BGA rework, soldering iron, bottom heater) must be considered to ensure a high process control. A temperature being too high can cause damage and cracks due to the thermal stress on sensitive components, e.g. ceramic components like capacitors.
SOLDERING TIP TEMPERATURE REQUIREMENTS

The soldering tip temperature must be minimum 310oC and maximum 360oC. A temperature being too high can cause damage and cracks due to the thermal stress on sensitive components, e.g. ceramic components like capacitors.
BOTTOM HEAT REQUIREMENTS

In certain cases some components may require a bottom heater during repair in order to pre-heat the board and to level out the T on the PBA. This will also minimize the thermal stress. The temperature on the PBA surface must not exceed 150oC to minimize inter-metallic growth and thermal stress on the PWB.
BGA REWORK SPECIFICATIONS

For all components that require the use of a BGA Rework Station, follow the: Technical Requirement, Generic document; Space ID: 1207-2949 and Heat treatment document, product specific (available only when there is support for BGA profiles on CSPN) For more information regarding generic repair methods, refer to: SEMC PBA Repair Requirement Specification Repair Centers, 1/1056-LXE110 0378
1220-1336 Rev 1
15(37)
7
7.1
Go/NoGo Testing
Overview
This section provides information for centers who want to write their own test scripts as opposed to using SEMC scripts. Non-SEMC test scripts need to be approved by SEMC! The test requirements for UMTS and/or GSM phones using an antenna coupler or direct line connection are included in this section. These test sequences should be used as an arrival and verification test of the radio functionality. Tests are done in signaling mode, i.e. a call has been established to the test instrument. The test instrument controls the transceiver unit. RF performance is measured with an antenna coupler or the direct line connection, whichever method is selected. This document includes all available bands! Most phone models do not include all these bands! The test should be designed so those users with little or no system expertise can perform accurate testing. The measurements should run automatically, though a certain amount of manual work is included (and mandatory), such as phone call setup (i.e. dialing a number). It is recommended to have the measurements results stored or printed out. It should be possible to change the channels used in testing due to possible local radio interference. The ranges for these settings are specified under the Channel Allocation Table. All functions and settings should be protected in such a manner that the end-user cannot directly change them. (For example, a password or encrypted settings file.) The test instrument must be capable of using different attenuation factors for RX and TX and it must also be possible to use various attenuation factors for different channels in each band. The attenuation factors that should be used are found in the product specific document Tests & Calibration!
1220-1336 Rev 1
16(37)
Go/NoGo Testing
7.2
Channel Allocation Table

Band GSM850 GSM850 GSM850 GSM900 GSM900 GSM900 GSM 1800 GSM 1800 GSM 1800 GSM1900 GSM1900 GSM1900 WCDMA 850 WCDMA 850 WCDMA 850 WCDMA 1700 WCDMA 1700 WCDMA 1700 WCDMA 1900 WCDMA 1900 WCDMA 1900 WCDMA 2100 WCDMA 2100 WCDMA 2100 Ch definition Low Mid High Low Mid High Low Mid High Low Mid High Low Mid High Low Mid High Low Mid High Low Mid High Any ARFCN of: 128-132 187-191 247-251 975-979 36-40 120-124 512-516 697-701 881-885 512-516 658-662 806-810 4132 4175 4233 1312 1410 1513 9262 9400 9538 9612 9750 9888
7.3
Power Level Allocation Table

Band GSM850 GSM850 GSM850 GSM900 GSM900 GSM900 GSM1800/1900 GSM1800/1900 GSM1800/1900 PL definition Lowest Mid Highest Lowest Mid Highest Lowest Mid Highest Power level (PL) 19 12 7 19 12 5 15 8 0
1220-1336 Rev 1
17(37)
Go/NoGo Testing
7.4
Test Limits
The test limits for each measurement are specified in the sequence tables. Since the coupler introduces higher measurement inaccuracy, some measurements may have wider limits than stated in the GSM and 3GPP specifications. The conducted limits conform to the phase 2 GSM and 3GPP specification.
7.5
Attenuation Factors
The different scripts must be configured with the correct attenuation factors and named after the product that they are designed to test. The attenuation factors to be used are stated in the product specific document Tests & Calibration.
1220-1336 Rev 1
18(37)
Go/NoGo Testing
7.6
Test Sequence Antenna Coupler

Value Mid Mid High -40 GSM 850 Unit Ch Ch PL dBm
INITIALIZING AND CALL SETUP

Parameter BCCH TCH Tx power level RF output power System
SEQUENCE
If a standard battery is used for this test, It is most important that this is a fully charged battery, otherwise there is a high risk for incorrect test results! 1. Initialize the instrument 2. Insert a test USIM (a standard test SIM may be used for GSM testing only) and attach a fully charged standard battery to the phone 3. Position the phone in the shield box as described in the product specific document Tests & Calibration 4. Turn on the phone and wait for registration 5. Set up a call to the instrument or let the instrument call the phone 6. Close the lid on the shield box 7. Audio loopback - set power level to high - activate audio loopback in the instrument - operator must acknowledge passed or failed before the test is continued 8. On-going test - refer to the measurement and test limits on the following pages and the product specific document Tests & Calibration 9. Test end - disconnect the call and end the test
1220-1336 Rev 1
19(37)
Go/NoGo Testing: Test Sequence Antenna Coupler

7.6.1 GSM 850 - Measurements & Test Limits
7.6.1.1 Low TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Rx Level Rx Quality Value Low High -68 GSM 850 Test Limits 29 4 0 5 34-50 0-3 Unit Ch PL dBm Unit dB deg dB units
7.6.1.2
Mid TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Peak Phase error Freq error Rx Level Rx Quality Value Mid Mid -102 GSM 850 Test Limits 19 5 0 5 0 20 0.1 ppm 2-14 0-3 Unit Ch PL dBm Unit dB deg deg Hz dB units
7.6.1.3
High TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Value High Low -68 GSM 850 Test Limits 5 7 0 5 Unit Ch PL dBm Unit dB deg
1220-1336 Rev 1
20(37)

7.6.2.1 Low TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Rx Level Rx Quality Value Low Low -68 GSM 1900 Test Limits 0 7 0 -5 34-50 0-3 Unit Ch PL dBm Unit dB deg dB units
7.6.2.2
Mid TCH
7.6.2.3
High TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Value High High -68 GSM 1900 Test Limits 30 4 0 5 Unit Ch PL dBm Unit dB deg
1220-1336 Rev 1
21(37)

7.6.3.1 Low TCH
7.6.3.2
Mid TCH
7.6.3.3
High TCH
1220-1336 Rev 1
22(37)

7.6.4.1 Low TCH
7.6.4.2
Mid TCH
7.6.4.3
High TCH
1220-1336 Rev 1
23(37)

7.6.5 UMTS 850 - Measurements & Test Limits
7.6.5.1 Low TCH
Parameter TCH Power level RF out Measurement Tx max output power EVM Frequency error Tx adjacent channel level ratio +/- 5MHz Tx adjacent channel level ratio +/- 10MHz Value Low Max -93 Test Limits 19 to 27 17.5 max -0.1 to 0.1 -36 -46 Unit Channel dBm dBm Unit dB % deg dBc dBC
7.6.5.2
Mid TCH
Parameter TCH Power level RF out Measurement Tx max output power EVM Frequency error Tx adjacent channel level ratio +/- 5MHz Tx adjacent channel level ratio +/- 10MHz Rx reference sensitivity level* (RF out: -104) Value Mid Max -93 (* -104) Test Limits 19 to 27 17.5 max -0.1 to 0.1 -36 -46 -0.1 to 0.1 Unit Channel dBm dBm Unit dB % deg dBc dBC %
7.6.5.3
High TCH
Parameter TCH Power level RF out Measurement Tx max output power EVM Frequency error Tx adjacent channel level ratio +/- 5MHz Tx adjacent channel level ratio +/- 10MHz Value High Max -93 Test Limits 19 to 27 17.5 max -0.1 to 0.1 -36 -46 Unit Channel dBm dBm Unit dB % deg dBc dBC
1220-1336 Rev 1
24(37)

7.6.6.1 Low TCH
7.6.6.2
Mid TCH
7.6.6.3
High TCH
1220-1336 Rev 1
25(37)

7.6.7.1 Low TCH
7.6.7.2
Mid TCH
7.6.7.3
High TCH
1220-1336 Rev 1
26(37)

7.6.8.1 Low TCH
7.6.8.2
Mid TCH
7.6.8.3
High TCH
1220-1336 Rev 1
27(37)
Go/NoGo Testing
7.7
Test Sequence Direct Line

Value Mid Mid High -40 GSM 850 Unit Ch Ch PL dBm
INITIALIZING AND CALL SETUP

Parameter BCCH TCH Tx power level RF output power System
SEQUENCE
It is most important that a fully charged battery is used, otherwise there is a high risk for incorrect test results! 1. Initialize the instrument 2. Insert a test USIM (a standard test SIM may be used for GSM testing only) and attach a fully charged standard battery or a dummy battery with external power to the phone 3. Attach the RF Fixture 4. Connect the RF cable to the phone and the test instrument 5. Turn on the phone and wait for registration 6. Set up a call to the instrument or let the instrument call the phone 7. Audio loopback - set power level to high - activate audio loopback in the instrument - operator must acknowledge passed or failed before the test is continued 8. On-going test - refer to the measurement and test limits on the following pages and the product specific document Tests & Calibration 9. Test end - disconnect the call and end the test
1220-1336 Rev 1
28(37)
Go/NoGo Testing: Test Sequence Direct Line

7.7.1.1 Low TCH
7.7.1.2
Mid TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Peak Phase error Freq error Rx Level Rx Quality Value Mid Mid -102 GSM 850 Test Limits 19 3 0 5 0 20 .1 ppm 4-12 0-3 Unit Ch PL dBm Unit dB deg deg Hz dB units
7.7.1.3
High TCH
1220-1336 Rev 1
29(37)

7.7.2.1 Low TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Rx Level Rx Quality Value Low Low -68 GSM 1900 Test Limits 0 5 0 5 36-48 0-3 Unit Ch PL dBm Unit dB deg dB units
7.7.2.2
Mid TCH
7.7.2.3
High TCH
Parameter TCH Tx power level RF output power System Measurement Tx power RMS Phase error Value High High -68 GSM 1900 Test Limits 30 2 0 5 Unit Ch PL dBm Unit dB deg
1220-1336 Rev 1
30(37)

7.7.3.1 Low TCH
7.7.3.2
Mid TCH
7.7.3.3
High TCH
1220-1336 Rev 1
31(37)

7.7.4.1 Low TCH
7.7.4.2
Mid TCH
7.7.4.3
High TCH
Parameter TCH TxX power level RF output power System Measurement Tx power RMS Phase error Value High Low -68 GSM 900 Test Limits 5 5 0 5 Unit Ch PL dBm Unit dB deg
1220-1336 Rev 1
32(37)

7.7.5.1 Low TCH
7.7.5.2
Mid TCH
7.7.5.3
High TCH
1220-1336 Rev 1
33(37)

7.7.6.1 Low TCH
7.7.6.2
Mid TCH
7.7.6.3
High TCH
1220-1336 Rev 1
34(37)

7.7.7.1 Low TCH
7.7.7.2
Mid TCH
7.7.7.3
High TCH
1220-1336 Rev 1
35(37)

7.7.8.1 Low TCH
7.7.8.2
Mid TCH
7.7.8.3
High TCH
1220-1336 Rev 1
36(37)
8
Rev. 1
Revision History
Date 2008-Oct-02 Changes / Comments First release
1220-1336 Rev 1
37(37)

Generic Repair Manual

Uploaded by

Document Information

Original Description:

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Generic Repair Manual

Uploaded by

Copyright:

Available Formats

Generic Repair Manual

1220-1336 Rev 1 Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

2.5 Connections ........................................................................................... 8

Go/NoGo Testing .......................................................................... 16

7.7 Test Sequence Direct Line ............................................................... 28

Revision History ........................................................................... 37

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Process Flow Chart

Software fault found! No fault found!

Liquid intrusion check!

3. Customer abuse! Reject!

Hardware fault found!

Fault not repairable at this service level!

6. Upgrade software to latest revision (if needed)

7. Calibration (if needed)

8. Update with LabelMake (if needed)

Pass! 10.. Unit out

11. Repair cannot be carried out

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Setup Go/NoGo Test

Stand-Alone vs. SERP

Antenna Coupler vs. Direct Line

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Setup Go/NoGo Test

Antenna Coupler Testing

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Setup Go/NoGo Test

Direct Line Testing

2.4.1 Direct Line

2.4.2 Direct Line with RF Fixture

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Setup Go/NoGo Test

Optional Printer cable

Printer cable Optional

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

EQUIPMENT & MEASUREMENTS

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Use the DMM to carry out voltage measurements on diodes.

Use the DMM to carry out resistance measurements.

ADDITIONAL TROUBLESHOOTING INFORMATION

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Moisture & Baking

COMMON TO LEVEL 2, 2A ,3 ,4 ,5 ,5A, 6

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

PBA Component Finder

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

All lead-free PBAs will be marked with this symbol.

Sony Ericsson Mobile Communications AB Company Internal

Generic Repair Manual (elect)

Soldering: Lead-Free Soldering