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Sil Pad Selection Guide

Sil Pad Selection Guide

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Published by TheBergquistCompany
This document includes information for thermal interface materials.
This document includes information for thermal interface materials.

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Categories:Types, Brochures
Published by: TheBergquistCompany on Nov 23, 2011
Copyright:Attribution Non-commercial

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11/23/2011

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Thermally Conductive Interface Materials for Cooling Electronic Assemblies
Sil-Pad
®
SELECTION GUIDE
 
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and THEFOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THEIMPLIED WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers' and manufacturers' onlyobligation shall be to replace such quantity of the product proved to be defective. Before using, user shall determine thesuitability of the product for its intended use, and the user assumes all risks and liability whatsoever in connection there-with. NEITHER SELLER NOR MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FORANY LOSS OR DAMAGE, DIRECT, INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS ORREVENUE ARISING OUT OF THE USE OR THE INABILITY TO USE A PRODUCT. No statement,purchase order or recommendations by seller or purchaser not contained herein shall have any force or effect unless in anagreement signed by the officers of the seller and manufacturer.© Copyright 2011, The Bergquist Company. All rights reserved.
 June 2011
 
Table of Contents
1
Introduction
2Thermal Properties and Testing4Interface Material Selection Guide5
Gap Pad
 ® 
Thermally Conductive Materials
6Gap Pad Comparison Data7Frequently Asked Questions8Gap Pad VO9Gap Pad VO Soft10Gap Pad VO Ultra Soft11Gap Pad VO Ultimate12Gap Pad 1000SF13Gap Pad HC100014Gap Pad 150015Gap Pad 1500R16Gap Pad 1500S3017Gap Pad A200018Gap Pad 2000S4019Gap Pad 2200SF20Gap Pad 2500S2021Gap Pad 250022Gap Pad A300023Gap Pad 3000S3024Gap Pad 5000S3525Gap Filler Comparison Data26Frequently Asked Questions27Gap Filler 1000(Two-Part)28Gap Filler 1100SF(Two-Part)29Gap Filler 1500(Two-Part)30Gap Filler 2000(Two-Part)31Gap Filler3500S35(Two-Part)32
TIC
Thermal Interface Compound
33Comparison Data and Frequently Asked Questions33TIC 1000A34TIC 400035
Hi-Flow
 ® 
Phase Change Interface Materials
36Hi-Flow Comparison Data37Frequently Asked Questions38Hi-Flow 10539Hi-Flow 225F-AC40Hi-Flow 225UT41Hi-Flow 225U42Hi-Flow 62543Hi-Flow 300P44Hi-Flow 300G45Hi-Flow 565U46Hi-Flow 565UT47Hi-Flow 650P48
Sil-Pad
 ® 
Thermally Conductive Insulators
49Frequently Asked Questions50Choosing Sil-Pad Thermally Conductive Insulators51Mechanical,Electrical and Thermal Properties52Sil-Pad Applications54Sil-Pad Selection Table54Sil-Pad Comparison Data56Sil-Pad 40057Sil-Pad 80058Sil-Pad 900S59Sil-Pad 98060Sil-Pad 1100ST61Sil-Pad 120062Sil-Pad A150063Sil-Pad 1500ST64Sil-Pad 200065Sil-Pad A200066Sil-Pad K-467Sil-Pad K-668Sil-Pad K-1069Q-Pad
 ® 
II70Q-Pad 371Poly-Pad
 ® 
40072Poly-Pad100073Poly-Pad K-474Poly-Pad K-1075Sil-Pad Tubes76Sil-Pad Shield77
Bond-Ply
 ® 
and Liqui-Bond
 ® 
Adhesives
78Bond-Ply and Liqui-Bond Comparison Data79Frequently Asked Questions79Bond-Ply 10080Bond-Ply 40081Bond-Ply 660P82Liqui-Bond SA 1000 (One-Part)83Liqui-Bond SA1800 (One-Part)84Liqui-Bond SA 2000(One-Part)85
Solutions for Surface Mount Applications
86
Ordering Information
88Sil-Pad Configurations - Imperial90Hi-Flow Configurations - Imperial93Sil-Pad Configurations - Metric94Hi-Flow Configurations - Metric97Sil-Pad Shield Configurations - Imperial98Notes99

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