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Recent progress in high resolution lithography Daniel Bratton, Da Yang, Junyan Dai and Christopher K. Ober* Materials Science and Engineering, Cornell University, Ithaca, NY 14853, USA
Outline
Photo-Lithography Immersion Lithography
EUV Lithography
Two-Photon 3D Lithography
NANO-imprint Lithography
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Photolithography
Abbe (critical) illumination: ---intensity in each location on reticle is determined by corresponding location in light source Khler illumination ---intensity in each location on reticle is integral local source intensities BCAM
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Improvements in resolution
The resolution enhancement from immersion lithography is therefore about 3040% (depending on materials used), or about one technology node. The depth of focus, is also 40-70% better (proportional to the refractive index of the imaging medium considered) than a corresponding "dry" tool at the same resolution
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Immersion lithography: $30M!! Fluid: 193nm water 157nm polyfluoropolyether high index fluids desired.
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Contribution of Defects
Images of Defects
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A laser is directed at a jet of xenon gas. When the laser hits the xenon gas, it heats the gas up and creates a plasma. Once the plasma is created, electrons begin to come off of it and it radiates light at 13 nanometers, which is too short for the human eye to see. The light travels into a condenser, which gathers in the light so that it is directed onto the mask. A representation of one level of a computer chip is patterned onto a mirror by applying an absorber to some parts of the mirror but not to others. This creates the mask. The pattern on the mask is reflected onto a series of four to six curved mirrors, reducing the size of the image and focusing the image onto the silicon wafer. Each mirror bends the light slightly to form the image that will be transferred onto the wafer.
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(EUV) Lithography
This entire process has to take place in a vacuum because these wavelengths of light are so short that even air would absorb them. Additionally, EUVL uses concave and convex mirrors coated with multiple layers of molybdenum and silicon -- this coating can reflect nearly 70 percent of EUV light at a wavelength of 13.4 nanometers. The other 30 percent is absorbed by the mirror. Without the coating, the light would be almost totally absorbed before reaching the wafer. The mirror surfaces have to be nearly perfect; even small defects in coatings can destroy the shape of the optics and distort the printed circuit pattern, causing problems in chip function.
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Lower forces: 100 kPa No heating, no cooling Longer lifetime, faster imprint Sub 5-nm demonstrated Issues Production of templates Defect control Small throughput Materials BCAM
Two-Photon 3D Lithography
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Conclusion
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