The term of this patent is extended or adjusted under 35 U.S.c. 154(b) by 50 days. A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface. An integrated circuit die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a refiow temperature.
The term of this patent is extended or adjusted under 35 U.S.c. 154(b) by 50 days. A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface. An integrated circuit die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a refiow temperature.
The term of this patent is extended or adjusted under 35 U.S.c. 154(b) by 50 days. A microelectronic assembly includes a substrate having a plurality of bond pads disposed on a substantially planar die attach surface. An integrated circuit die is provided with a polymeric bead about the outer edges of the die. Die face bond pads are aligned with corresponding substrate bond pads and electrically interconnected by heating to a refiow temperature.