En U250-Ku250 SVC Eng 0627 1.0

Service Manual
Service Manual U250/KU250
Model : U250/KU250
Date: June, 2007 / Issue 1.0
Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 4.16 Receiver Path ....................................107 4.17 Headset path......................................109 4.18 Speaker phone path...........................111 4.19 Main microphone ...............................113 4.20 Headset microphone..........................115 4.21 Vibrator ..............................................117
2. PERFORMANCE...............................7
2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................8 2.4 Current Consumption.............................14 2.5 RSSI BAR ..............................................14 2.6 Battery BAR ...........................................15 2.7 Sound Pressure Level............................16 2.8 Charging ................................................16
5. DOWNLOAD..................................119
5.1 U250/KU250 DOWNLOAD ..................119 5.1.1 Introduction ...................................119 5.1.2 Downloading Procedure ...............119 5.1.3 Troubleshooting Download Errors 129 5.1.4 Caution .........................................133
3. TECHNICAL BRIEF ........................17

3.1 General Description ...............................17 3.2 GSM Mode.............................................19 3.3 UMTS Mode...........................................23 3.4 LO generation and distribution circuits...25 3.5 Off-chip RF Components .......................25 3.6 Digital Baseband(DBB/MSM6245).........34 3.7 Block Diagram(MSM6245).....................36 3.8 Subsystem(MSM6245) ..........................37 3.9 Power Block ...........................................45 3.10 External memory interface ...................50 3.11 H/W Sub System..................................52 3.12 Main Features ......................................68
6. BLOCK DIAGRAM ........................134

6.1 GSM & UMTS RF Block.......................134 6.2 Interface Diagram ................................136
7. Circuit Diagram ............................143 8. pcb layout .....................................147 9. Calibration & RF Auto Test Program (Hot Kimchi)..................149
9.1 Configuration of HOT KIMCHI .............149 9.2 How to use HOT KIMCHI.....................152
10. Factory Test Mode .....................154 4. TROUBLE SHOOTING ...................73

4.1 RF Component.......................................73 4.2 SIGNAL PATH_UMTS RF .....................75 4.3 SIGNAL PATH_GSM RF .......................76 4.4 Checking VC-TCXO Block .....................77 4.5 Checking Front-End Module Block ........79 4.6 Checking UMTS Block ...........................81 4.7 Checking GSM Block .............................86 4.8 Checking Bluetooth Block ......................92 4.9 Power ON Troubleshooting....................94 4.10 Charger Troubleshooting .....................96 4.11 USB Troubleshooting...........................99 4.12 SIM Detect Troubleshooting ..............100 4.13 Camera Troubleshooting ...................102 4.14 Keypad Backlight Troubleshooting ....105 4.15 Main LCD Troubleshooting ................106 10.1. Test Program Setting ........................154 10.2. WCDMA Test Mode ..........................155 10.3. GSM Test Mode................................156
11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 157

11.1 EXPLODED VIEW ............................ 157 11.2 Replacement Parts <Mechanic component>.................... 159 <Main component> ........................... 161 11.3 Accessory ......................................... 174
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1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.
1.2 Regulatory Information

A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that resultfrom such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.
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1. INTRODUCTION
E. Notice of Radiated Emissions

This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.
G. Interference and Attenuation

A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices ATTENTION

Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.
Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.
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2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time (with 950mAh) Standby Time (with 950mAh) Antenna LCD LCD Backlight Camera Vibrator LED Indicator MIC Receiver Earphone Jack Connectivity External Memory I/O Connect Specification GSM900/1800/1900 and WCDMA2100 - Bar type Handset 110.9 X 46.7 X 15.6 mm Under 83 g (with 950mAh Battery) 3.7 V normal, 950 mAh Li-Ion Over 200 min (WCDMA, Tx=12 dBm, Voice) Over 180 min (GSM, Max Tx Power, Voice) Over 350 Hrs (WCDMA, DRX=1.28) Over 450 Hrs (GSM, Paging period=9) Internal type Main 1.76 TFT, QCIF, 262K White LED Back Light 1.3 Mega pixel + VGA Video Call Camera Yes ( Cylinder Type) No Yes Yes Yes (18 pin) Bluetooth, USB Yes(Micro SD) 18 Pin
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2. PERFORMANCE
2.2 Usable environment

1) Environment
Item Voltage Operation Temp Storage Temp Humidity Specification 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] -20 ~ +60C -20 ~ +70C 85 % (Max)
2) Environment (Accessory)
Reference TA Power * CLA : 12 ~ 24 V(DC) Spec. Available power Min 100 Typ. 220 Max 240 Unit Vac
2.3 Radio Performance

1) Transmitter - GSM Mode
No Item 100k~1GHz MS allocated Channel 1G~12.75GHz Conducted 1 Spurious Emission Idle Mode 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz
* In case of DCS : [A] -> 1710, [B] -> 1785
GSM -39dBm
DCS & PCS 9k ~ 1GHz 1G~[A]MHz [A]M~[B]MHz -33dBm [B]M~12.75GHz -33dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm 100k~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz -39dBm -33dBm -39dBm
100k~880MHz 880M~915MHz 915M~1GHz
* In case of PCS : [A] -> 1850, [B] -> 1910
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2. PERFORMANCE
No
Item 30M ~ 1GHz MS allocated Channel 1G ~ 4GHz Radiated
GSM -36dBm
DCS & PCS 30M~1GHz 1G~[A]MHz [A]M~[B]MHz -30dBm [B]M~4GHz -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm 30M~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz 0.1ppm 5(RMS) 20(PEAK) -36dBm -30dBm -36dBm
Spurious Emission Idle Mode
30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz
3 4
Frequency Error Phase Error
0.1ppm 5(RMS) 20(PEAK)
3dB below reference sensitivity 3dB below reference sensitivity Frequency Error 5 Under Multipath and Interference Condition RA250 : 200Hz HT100 : 100Hz TU50 : 100Hz TU3 : 150Hz 0 ~ 100kHz 200kHz 250kHz Due to modulation Output RF 6 Spectrum 3000 ~ 6000kHz 6000kHz 400kHz Due to 600kHz Switching 1200kHz transient 1800kHz
* In case of DCS : [A] -> 1710, [B] -> 1785
RA250: 250Hz HT100: 250Hz TU50: 150Hz TU1.5: 200Hz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB 400kHz 600kHz 1200kHz 1800kHz -22dB -24dB -24dB -27dB 0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz 6000kHz +0.5dB -30dB -33dB -60dB -60dB -65dB -73dB
400kHz 600 ~ 1800kHz 1800 ~ 3000kHz
* In case of PCS : [A] -> 1850, [B] -> 1910
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2. PERFORMANCE
No
Item
GSM
DCS & PCS Frequency offset 800kHz
Intermodulation product should 7 Intermodulation attenuation be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level 5 6 7 8 9 10 8 Transmitter Output Power 11 12 13 14 15 16 17 18 19 (dBm) 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 (dB) 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 9 Burst timing Mask IN (dBm) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Mask IN (dB) 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5
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2. PERFORMANCE
2) Transmitter - WCDMA Mode
No 1 2 3
Item Maximum Output Power Frequency Error Open Loop Power control in uplink
Specification Class 3 : +24dBm(+1/-3dB) 0.1ppm 9dB@normal, 12dB@extreme Adjust output(TPC command) cmd +1 1dB +0.5/1.5 2dB +1/3 3dB +1.5/4.5
Inner Loop Power control in uplink
0 -1
-0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5
Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24
-50dBm(3.84MHz) Qin/Qout : PCCH quality levels
Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB
7 8
Transmit OFF Power Transmit ON/OFF Time Mask
-56dBm(3.84MHz) 25us PRACH,CPCH,uplinlk compressed mode 25us Power varies according to the data rate
Change of TFC DTX : DPCH off (minimize interference between UE)
10 11
Power setting in uplink compressed Occupied Bandwidth(OBW)
3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M
12
Spectrum emission Mask -39-10*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M
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2. PERFORMANCE
No 13
Item Adjacent Channel Leakage Ratio(ACLR)
Specification 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW
Spurious Emissions 14 (*: additional requirement)
-30dBm@f=1~12.5GHz, 1M BW (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc
15
Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm)
16
Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code
17
Transmit OFF Power transmission
3)Receiver - GSM Mode

No 1 2 (TCH/FS Class II, RBER, TU high/FH) 3 Adjacent Channel Rejection 200kHz 400kHz C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-98dBm 1st 4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-45dBm Blocking Response 5 (TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency Wanted Signal :-101dBm C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-44dBm Wanted Signal :-101dBm Item Sensitivity (TCH/FS Class II) Co-Channel Rejection C/Ic=7dB Storage -30 ~ +85 GSM -105dBm DCS & PCS -105dBm
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2. PERFORMANCE
4) Receiver - WCDMA Mode

No 1 Item Reference Sensitivity Level Specification -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and 5 Out-band Blocking 2230~2255MHz UE@+20dBm output power(Class3) -15dBm/3.84MHz@f=1~2025 and 2255~12500MHz UE@+20dBm output power(Class3) -44dBm CW 6 Spurious Response UE@+20dBm output power(Class3) -46dBm CW@10MHz 7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz UE@+20dBm output power(Class3) -57dBm@f=9KHz~1GHz, 100K BW 8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW -60dBm@f=1920MHz~1980MHz, 3.84M BW -60dBm@f=2110MHz~2170MHz, 3.84M BW
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2. PERFORMANCE
2.4 Current Consumption

1) U250/KU250 Current Consumption
Stand by Under 2.80 mA WCDMA (DRX=1.28) Under 2.12 mA GSM Paging=9 period Voice Call Under 290 mA (Tx=12dBm) Under 320 mA (Max Tx Power) VT Under 410mA (Tx=12dBm)
(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On)
2.5 RSSI BAR

Level Change BAR 4 3 BAR 3 2 BAR 2 1 BAR 1 0 WCDMA -85 2 dBm -95 2 dBm -106 2 dBm -111 2 dBm GSM -90 2 dBm -95 2 dBm -100 2 dBm -106 2 dBm
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2. PERFORMANCE
2.6 Battery BAR

Indication Bar 4 Bar 4 3 Bar 3 2 Bar 2 1 Bar 1 Empty Low Voltage, Warning message+ Blinking Power Off Standby Over 3.83 0.05V 3.82 0.05V 3.73 0.05V 3.68 0.05V 3.58 0.05V 3.58 0.05V (Stand-by) / 3.58 0.05V (Talk) [Interval : 3min(Stand-by) / 1min(Talk)] 3.20 0.05V
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2. PERFORMANCE
2.7 Sound Pressure Level

No 1 2 3 4 5 6 7 8 9 10 11 12 Test Item Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) TDMA Noise -. GSM : Power Level : 5 DCS/PCS : Power Level : 0 (Cell Power : -90 ~ -105 dBm) 13 -. Acoustic (Max Vol.) MS/Headset SLR : 8 3dB MS/Headset RLR : -15 3dB/-12 (SLR/RLR : Mid-value setting) MS and Headset Max Under -62 dBm Headset Nor Max Min Min Max Nor Max MS Nor Max Min Min Max Nor Max Specification 8 3 dB -4 3 dB -15 3 dB 17 dB 40 dB -64 dBm0p Under -47 dBPA Under -36 dBPA 83dB -1 3 dB -12 3 dB 25 dB 40 dB -55 dBm0p Under -45 dBPA Under -40 dBPA
2.8 Charging
Charging Method : CC & CV (Constant Current and Constant Voltage) Maximum Charging Voltage : 4.2 V Maximum Charging Current : 700 mA Normal Battery Capacity : 950 mAh Charging Time : Max 3 hours (except for trickle charging time) Full charging indication current (charging icon stop current) : 80 mA Cut-off voltage : 3.20 V
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 General Description
The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.
UMTS (2100) GSM (900, 1800, 1900) Bluetooth 1. RTR6275 for GSM Tx and WCDMA Tx 2. RTR6275 for GSM Rx and WCDMA Rx 3. Bluetooth RF module 4. PM6650 for power management
[Fig 1.1] Block diagram of RF part
QUALCOMMs branded chipset that implements a Zero-IF radio architecture.
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3. TECHNICAL BRIEF
A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC. For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver. In the GSM receive paths, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency. 1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope phase signal at RF; 2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier from a DAC within the MSM U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.
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3. TECHNICAL BRIEF
3.2 GSM Mode

3.2.1 GSM Receiver
The Dual-mode U250/KU250s receiver functions are split among the three RFICs as follows: GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters. RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS1900 Tx(High Band Txs share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.
GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX
[Table 1.1] Antenna Switch Module Control logic
The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details.
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3. TECHNICAL BRIEF
The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module. The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50- sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range. The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs).
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3. TECHNICAL BRIEF
[Fig 1.2] RTR6275 RX feature
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3. TECHNICAL BRIEF
3.2.2 GSM Transmitter

The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.
6pF
51
91 12pF 39
91
100
100
[Fig 1.3] GSM Transmitter matching
The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band
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3. TECHNICAL BRIEF
3.3 UMTS Mode

3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.
3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50- interface. The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.
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3. TECHNICAL BRIEF
WCDMA_2100_TX
WCDMA_2100_RX
[Figure 1.4] RTR6275 IC functional block diagram
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3. TECHNICAL BRIEF
3.4 LO generation and distribution circuits

The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF. Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS 2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS 2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error
3.5 Off-chip RF Components

3.5.1 WCDMA PAM (U103: WS2512-TR1G)
The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) . This detector voltage can be used for transmitter calibration and monitor to meet RF system
WCDMA
Rev.D C154 1.5p Rev_1.0
+VPWR
L404 1.8nH C155 4.7u C158 15p WS2512_TR1G 10 VCC2 FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p C165 1p 7 GND3 6 GND2 11 BGND VCONT VREF 4 5 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 1 2 3 C159 15p
+VPWR
4
FL102 5 EFCH1950TDF1
IN
L122 NA
C157 10nH
O1 G3 G2 G1
ACMD-7602 0.5p L125
PA_R0
OUT
IN
50OHM
COUP
20dB
TR100 KRX102U
5
U102
2
51R119
CP0402A1950DNTR
4 3
PA_ON
Rev.B
VREG_TCXO_2.85V
C170 0.1u
PWR_DET R120 R121 47 130 7dB R122 130 C192 100p
[Figure 1.5] WCDMA PAM, Duplexer, Coupler
- 25 -
3. TECHNICAL BRIEF
3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)

The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line. The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 F low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.
3.5.3 Front-End Module (U500 : D5011)

This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]). Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.
[Table 1.2] Front End Module control logic
- 26 -
3. TECHNICAL BRIEF
3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)

Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltage, and pulsed charging of the main battery - Supports coin cell backup battery (including charging) - Battery voltage detectors with programmable thresholds - VDD collapse protection - Charger current regulation and real-time monitoring for over-current protection - Charger transistor protection by power limit control - Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is optional - Voltage, current, and power control loops - Automated recovery from sudden momentary power loss Output voltage regulation - One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG - Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA (or second MSMC) supply voltages - Supports dynamic voltage scaling (DVS) for MSMC and PA - Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits. - All regulators can be individually enabled/disabled for power savings - Low power mode available on MSMA and MSMP regulators - All regulated outputs are derived from a common bandgap reference-close tracking Integrated handset-level housekeeping functions reduces external parts count, size, cost - Analog multiplexer selects from 8 internal and up to 18 external inputs - Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution - Adjusted multiplexer output is buffered and routed to an MSM device ADC - Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock - Crystal oscillator detector and automated switch-over upon lost oscillation - Real time clock for tracking time and generating associated alarms - On-chip adjustments minimize crystal oscillator frequency errors - Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal - TCXO buffer control for optimal QPH/catnap timing - Three-stage over-temperature protection (smart thermal control)
- 27 -
3. TECHNICAL BRIEF
Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 speakers with volume controlled 500 mW) IC-level interfaces - MSM device-compatible 3-line SBI for efficient initialization, status, and control - Supports the MSM devices interrupt processing with an internal interrupt manager - Many functions monitored and reported through real-time and interrupt status signals - Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal - Several events continuously monitored for triggering power-on/power-off sequences - Supports and orchestrates soft resets - USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals RUIM level translators enable MSM device interfacing with external modules Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer. Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief
[Figure 1.6] MSM6245 Interface
- 28 -
3. TECHNICAL BRIEF
[Figure1.7] PM6650 Block Diagram
- 29 -
3. TECHNICAL BRIEF
3.5.5 GSM PAM (U101 : SKY77318)

The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50 and output, no external matching or bias components are required. The module incorporates two highly-integrated GaAs power amplifier die with a BiCMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the GPRS operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a lowprofile overmolded land-grid array on laminate.
GSM_PA_RA
Rev.D C124 100p L115 18nH L403 1.5nH
+VPWR
C123 0.01u C121 33u
EGSM
NA
L111 5.6nH
L406
2.7nH
L116 10nH 100ohm
R107
C441 5.6p C137 NA
C438 100p C138 NA C139 68p 20 17
C134 0.01u C136 0.01u 91 R110
8.86dB Rev.1.0 R108 DCS_PCS_TX 51 91 R111 7.5dB

4 5 1
O1 G3 IN G2 G1
6 VCC1B
VBATT
VCC1A
VAPC
FL101
3 4 18 1 R113 100ohm
15 11 19 21
DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND
DCS_PCS_IN EGSM_IN ENABLE
R112 GSM_TX 100ohm 100ohm 39 R115 R114 MODE GSM DCS/PCS
U101
SKY77318
GSM_PA_EN
BS
C149 15p
EFCH897MTDB1
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1
R117 100ohm
16 14 13 12 10 9 8 7 5
GSM_PA_BAND
C153 15p
GSM_PA_BAND LOW HIGH
[Figure 1. 8] GSM PAM Schematic
- 30 -
3. TECHNICAL BRIEF
3.5.6 UMTS Duplexer(FL104:ACMD-7602)

A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB. Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 58dB. Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled. Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.
- 31 -
3. TECHNICAL BRIEF
3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)

Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: Out-of-band rejection or attenuation levels, usually specified to meet these conditions: - FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. - Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. - Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.
Table 1.3 WCDMA Rx SAW Filter Specification
- 32 -
3. TECHNICAL BRIEF
3.5.8 Bluetooth (M100 : LBRQ-2B43A)

The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250.
MSM6245
Bluetooth baseband
[Figure1.9] Bluetooth system architecture
- 33 -
3. TECHNICAL BRIEF
3. BB Technical Description
3.6 Digital Baseband(DBB/MSM6245)
3.6.1 General Description
A. Features(MSM6245)
Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE Support for WCDMA (UMTS) uplink data rate up to 384 kbps High-performance ARM926EJ-S running at up to 225 MHz ARM Jazelle Java hardware acceleration for faster Java-based games and other applets QDSP4000 high-performance DSP cores Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals Qcamera with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors Direct interface to digital camera module with video front end (VFE) image processing True 3D graphics for advanced wireless gaming SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Q-fuse. Only trusted boot is supported Audio that is on par with portable music players Vocoder support (AMR, FR, EFR, HR) Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology SD/SDIO hardware support
- 34 -
3. TECHNICAL BRIEF
USB
Bluetooth RF Module VCTCXO
PM6650 -2M
SPK/RCV
GSM Block
MIC GSM PAM
GSM TX SAW
GSM900 Tx
GSM1800/1900 Tx GSM900 Rx GSM1800 Rx GSM1900 Rx
GSM VCO
MAIN LCD
MSM6245
Front End Module
1.3M CAM
WCDMA Block RTR6275

COUPLER
VGA CAM
WCDMA PAM
WCDMA TX SAW U-SIM
HDET WCDMA2100 Tx Duplexer WCDMA2100 Rx WCDMA VCO

NAND, SDRAM FLASH
WCDMA RX SAW
KEYPAD
AntSW Logic
Figure 1.10 Simplified Block Diagram
- 35 -
3. TECHNICAL BRIEF
3.7 Block Diagram(MSM6245)
SDRAM 512Mbit
NAND Flash 512Mbit
LCD (1.76inch)
Camera 1.3M
CAMERA PROCESSING (Default 8bit Interface) GRAPHICS
EBI 1
EBI 2
DUAL MEMORY BUS
GSM/GPRS/EDGE processor
MSM6245
Modem QDSP 4000 PLL ARM 926ejs With Jazelle
UMTS, WCDMA
VGA camera
Open GL ES 3D, 2D VIDEO MPEG-4 H.263, H.264 QDSP 4000
BT 1.2 processor
UART2 / RUIM1
UART3 / PMIC SBI
CONNECTIVITY Keypad I/F AUDIO MP3, AAC, EVRC, QCELP AMR, CMX, MIDI
GPIO RF SBI Rx ADC Tx DAC
I/O Conn
UART1
JTAG
USB
PM6650
USIM
US B
Figure 1.11 Simplified Block Diagram of MSM6245
- 36 -
3. TECHNICAL BRIEF
3.8 Subsystem(MSM6245)
3.8.1. ARM Microprocessor Subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.
3.8.2. WCDMA R99 features

The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features: All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions: The downlink supports the following specifications: - Up to four physical channels, including the broadcast channel (BCH), if present - Up to three dedicated physical channels (DPCHs) - Spreading factor (SF) range support from 4 to 256 - The following transmit diversity modes are supported: Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD) The uplink supports the following specifications: The uplink provides the following UE support: - One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary - A maximum data rate of 384 kbps Full SF range support from 4 to 256 SMS (CS and PS) PS data rate - 384 kbps DL / 384 kbps UL CS data rate - 64 kbps DL / 64 kbps UL AMR (all rates)
- 37 -
3. TECHNICAL BRIEF
3.8.3. GSM features

The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. Voice features FR EFR AMR HR A5/1, A5/2, and A5/3 ciphering Circuit-switched data features 9.6k 14.4k Fax Transparent and non-transparent modes for CS data and fax No sub-rates are supported.
3.8.4. GPRS features

Packet switched data (GPRS) DTM (Simple Class A) operation Multi-slot class 12 data services CS schemes: CS1, CS2, CS3, and CS4 GEA1, GEA2, and GEA3 ciphering Maximum of four Rx timeslots per frame
3.8.5. EDGE features

EDGE E2 power class for 8 PSK DTM (simple Class A), multi-slot class 12 Downlink coding schemes - CS 1-4, MCS 1-9 Uplink coding schemes - CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF.
- 38 -
3. TECHNICAL BRIEF
3.8.6. MSM6245 device audio processing features

Integrated wideband stereo CODEC 16-bit DAC with typical 88 dB dynamic range Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path VR- Voice mail + voice memo Acoustic echo cancellation Audio AGC Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) Internal vocoder supporting AMR, FR, EFR, and HR
3.8.7. MSM6245 microprocessor subsystem

Industry standard ARM926EJ-S embedded microprocessor subsystem 16 kB instruction and 16 kB data cache Instruction set compatible with ARM7TDMI ARM version 5TEJ instructions Higher performance 5 stage pipeline, Harvard cached architecture Higher internal CPU clock rate with on-chip cache Java hardware acceleration Enhanced memory support 75 MHz and 90 MHz bus clock for SDRAM 32-bit SDRAM Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2 NAND FLASH memory interface - 8/16-bit data I/O width NAND flash support - 1- or 4-bit ECC - 512-byte/2KB page-size support - 2 chip selects supported for NAND Flash Boot from NAND Low-power SDRAM (LP-SDRAM) interface Internal watchdog and sleep timers
3.8.8. Supported interface features

USB On-the-Go core supports both slave and host functionality Three universal asynchronous receiver transmitter (UART) serial ports USIM controller (via UART) Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards Parallel LCD interface General-purpose I/O pins External keypad interface
- 39 -
3. TECHNICAL BRIEF
3.8.9. Supported multimedia features

Provide additional general purpose MIPS by using: Two QDSP4000s Dedicated hardware accelerators and compression engines Improve Java, BREW, and game performance Integrated Java and 2D/3D graphics accelerator with Sprite engine Enable various accessories via USB host connectivity. Integrated USB host controller functionality Enable compelling visual and audio applications. QcameraTM High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP 30 fps QCIF viewfinder QtvTM Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus, Windows Media Audio v9, RealAudio v8 Integrated stereo wideband codec for music/digital clips CMX Video codecs supported: MPEG-4, H.263, H.264, Windows Media v9 and RealNetworks v10 Video telephony services: QvideophoneTM A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps Video codecs supported: MPEG-4 and H.263 Audio codecs supported: AMR-NB. QcamcorderTM Real time mobile video encoder Video codecs supported: MPEG-4, H.263.H.264 Audio codecs supported: AMR-NB Recording performance: 15 fps @ QCIF, 192 kbps CMXTM (MIDI and still image, animation, text, LED/vibrate support) 72 simultaneous polyphonic tones 44 kHz sampling rate 512 kB wave table Support of universal file formats Standard MIDI Format (SMF) SP-MIDI SMAF Audio playback (MA-2, MA-3, MA-5) XMF/OLS MFi (requires Docomo license)
- 40 -
3. TECHNICAL BRIEF
PNG decoder Pitch bend range support LED/vibrate support Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) MLZ decoder Integrated PNG/SAF A.T.
Table 1-1 Summary of MSM6245 device features Note: 1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony concurrently with any other memory configuration. 16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated accrdingly in the next revision.
- 41 -
3. TECHNICAL BRIEF
Table 1-2 Description of RF configurations
- 42 -
3. TECHNICAL BRIEF
3.8.10. Stereo Wideband CODEC

The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.
3.8.11. Vocoder Subsystem

The MSM6245 devices QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6245 devices integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.
3.8.12. ARM Microprocessor subsystem

The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.
3.8.13. Mode Select and JTAG Interfaces

The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.
- 43 -
3. TECHNICAL BRIEF
3.8.14. General-Purpose Input/Output Interface

The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.
3.8.15. UART
The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.
3.8.16. USB
The MSM6245 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. MSM6245 supports the 3-wire functionality.
- 44 -
3. TECHNICAL BRIEF
3.9 Power Block

3.9.1. General
MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :
3.9.2. PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.
- 45 -
3. TECHNICAL BRIEF
Figure 1.12 PM6650 Functional Block Diagram
- 46 -
3. TECHNICAL BRIEF
3.9.3. Charging control

A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.
4.2V~3.82V 100~70 (%)
3.81V~3.74V 69~45 (%)
3.73V~3.69V 44~20 (%)
3.68V~3.59V 19~3 (%)
3.58V~3.20V 2~0 (%)
Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)
- 47 -
3. TECHNICAL BRIEF
Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.
Parameter Trickle Current
Min 60
Typ 80
Max 100
Unit mA
- 48 -
3. TECHNICAL BRIEF
Constant Current Charging

The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.
Constant Voltage Charging

Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current. Charging Method : CC & CV (Constant Current & Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 600mA Nominal Battery Capacity : 950mAh Charger Voltage : 5.1V Charging time : Max 3h (Except time trickle charging) Full charge indication current (icon stop current) : 100mA Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V Low battery alarm interval : Idle - 3 min, Dedicated - 1min Cut-off voltage : 3.20V
- 49 -
3. TECHNICAL BRIEF
3.10 External memory interface

The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc. EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices (UB_N & LB_N signals). - Support for 8 bit/16bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit). 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit) Interface Spec Device FLASH SDRAM Part Name HYC0UEH0MF3P HYC0UEH0MF3P Maker hynix hynix Read Access Time 60 ns 7 ns Write Access Time 60 ns 7 ns
Table#1. External memory interface
- 50 -
3. TECHNICAL BRIEF
EBI1
ADDRESS[14:0] DATA[31:0]
EBI2
NAND_CS* NAND_RE*
WE*
NAND_WE* NAND_CLE
NAND 512Mb (64MB)
SDRAM 512Mb
CS* CAS* RAS* CLK_EN CLK DQM[3:0]
MSM6245
NAND_WP* NAND_ALE NAND_READY DATA[7:0]
Figure 1.14 Simplified Block Diagram of Memory Interface
- 51 -
3. TECHNICAL BRIEF
3.11 H/W Sub System

3.11.1. RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals. SBST : SSBI I/F signals for control Sub-chipset PA_ON1 : Power AMP on RF part RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier DAC_REF : Reference input to the MSM Tx data DACs
XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93
L25 H6 F18 H18 H13
RCV_EN_N Close to MSM LCD_IF_MODE_1 2K TCXO_EN PA_ON TX_QM TX_QP TX_IM TX_IP DAC_REF R213 C246 TX_AGC_ADJ TRK_LO_ADJ
TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0
B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25
RF
RX_QM RX_QP RX_IM RX_IP
GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20
H15 D16 F15 D15 A17 H16 K19 N21 G4 J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19
D17
PA_R0
SPK_AMP_EN
TX_ON
ANT_SEL1 ANT_SEL0
GSM_PA_BAND GSM_PA_EN
BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA
Figure 1.15 Schematic of RF Interface of MSM6245
- 52 -
33nF
A12
3. TECHNICAL BRIEF
B. the others
TRK_LO_ADJ : TCXO(19.2M) Control PA_ON : WCDMA(2100) TX Power Amp Enable ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp GSM_PA_RAMP : Power Amp Gain Control of APC_IC GSM_PA_EN : Power Amp Gain Control Enable of APC_IC
- 53 -
3. TECHNICAL BRIEF
3.11.2. MSM Sub System

3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed USIM_CLK : USIM Clock USIM_Reset : USIM Reset USIM_Data : USIM Data T/Rx
VREG_UIM 2.85V USIM CLK USIM Reset USIM CLK
MSM6245
PM6650
USIM Reset USIM Data
USIM
USIM Data
Figure 1.16 SIM Interface 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. GPIO_Map GPIO_96 GPIO_95 Name UART_RXD UART_TXD Note Data_Rx Data_Tx Table. UART Interface
- 54 -
3. TECHNICAL BRIEF
3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6245.
Name USB_DAT USB_SE0 USB_OE_N USB_VBUS USB_D+ USB_DNote Data to/from MSM Data to/from MSM Out-Put Enable of Transceiver USB_Power From Host(PC) USB Data+ to Host USB Data- to Host
Table. USB Signal Interface
UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42
MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31
UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88
12
USB_OE_N USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_DR309 2.2K
13 14 15 16 17 18 19 20 21
VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N( LCD DRV N 22
M21
M19
USB_DAT_VP USB_SE0_VM USB_OE_TP_N
H14
M16
N26
N23
N25
L23
L14
G6
E4
F4
USIM_CLK USIM_RST_N USIM_DATA
USB_DAT USB_SE0 USB_OE_N
PM_INT_N PS_HOLD
Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)
MMC_CMD MMC_DATA MMC_CLK
C336 4.7u 1608
- 55 -
3. TECHNICAL BRIEF
3.11.3 HKADC(House Keeping ADC)

The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC.
Figure 1.18 MSM6245 HKADC Block diagram
Channel HKADC0 HKADC1 HKADC2 HKADC3 HKADC4 HKADC5
Signal AMUX_OUT VBATT_SENSE NC NC PCB_Rev_ADC Battery_THERM
Note RF PAM Temperature Check Battery voltage level NC NC PCB Version Check Battery Temperature Check
Table. HKADC channel table
- 56 -
3. TECHNICAL BRIEF
3.11.4. Key Pad

There are 23 main key buttons in Figure. Shows the Keypad circuit. END Key is connected to PMIC(PM6650). COL0 ROW(0) ROW(1) ROW(2) ROW(3) ROW(4) 1 4 7 * 2 5 8 0 COL1 COL2 3 6 9 # COL3 CLR LEFT OK SEND DOWN COL4 MENU UP RIGHT SEARCH BACK
Table. Key Matrix Mapping Table
VREG_MSMP_2.7V
KEY MAP
100K
R423
100K
RA400 1 3 5 7
2 4 6 8
CLR
MENU
KEY_ROW(0)
400
1 KEY_ROW(1)
401
2
402
3
LEFT
UP
403
4 KEY_ROW(2)
404
5
405
6
OK
RIGHT
406
7 KEY_ROW(3)
407
8
408
9
SND
SEARCH
HOT400
HOT4 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)
409
0
HOT401
HOT3
DN
BACK
Figure 1.19 Main Keypad Circuit
END
PM_ON_SW_N END
Figure 1.20 END Keypad Circuit
- 57 -
3. TECHNICAL BRIEF
3.11.5 Camera Interface

U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal.
CAMERA MEGA CAMERA CONNECTOR

PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 32 31 30 29 28 27 26 25 REV_1.0 20 19 18 12 11 10 9 7 R436 0 CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK R437 20
CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7)
22 23 24 1 2 3 4 5
D0 D1 D2 D3 D4 D5 D6 D7
CN403
PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK
8 15 21 6 17 13 14 16
DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD
C411 C412
VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C448 C414 C415 C413 10p C449 NA
0.1uF 1u
0.1u
10p
NA
REV_1.0 COMMON_CAM_MCLK
ICVE21184E150R500FR CAM_DATA(0) CAM_DATA(1) CAM_DATA(2)

1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6
ICVE21184E150R500FR CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5)

CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5)
10
FL406 ICVE21184E150R500FR CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC

FL407
CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT
FL408
VT_CAMERA_CONNECTOR
C424 VREG_CAM_AVDD_2.8V VGA_CAM_RESET_N I2C_SCL I2C_SDA 20 19 18 17 16 NA
GND8
GND7
P20 P19 P18 P17 P16
10
VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 CAM_PCLK CAM_DATA_OUT(0)
GND1 GND3
6 7 8 9 10
GND4
P6 P7 P8 P9 P10
GND2
CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4)
VA430
EVL14K02200
1 2 3 4 5
GND6 GND5
P1 P2 P3 P4 P5
CN404
P15 P14 P13 P12 P11
15 14 13 12 11
10
CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6)
CAM_DATA_OUT(5)
Figure 1.21 Camera Socket Type Connector
- 58 -
3. TECHNICAL BRIEF
The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.
No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Name CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7) GND MCLK GND MEGA_CAM_RESET_N I2C_SDA I2C_SCL MEGA_CAM_PWR_DN VREG_CAM_DVDD_1.8V VREG_CAM_AVDD_2.8V GND VREG_CAM_AVDD_2.8V GND CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_PCLK GND CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2)
Port O O O O O GND I GND I O O I I I GND I GND O O O GND O O O
Note Data Data Data Data Data GND Master Clock(24.576M) GND Camera reset signal I2C Data I2C Clock Camera power down DVDD VDDIO GND AVDD GND Horizontal Sync Vertical Sync Pixel Clock (49.152M) GND Data Data Data
Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)
- 59 -
3. TECHNICAL BRIEF
The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.
No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Name
VREG_CAM_DVDD_1.8V
Port I I GND O O O O O O O O O O O GN D I I I I I
Note DVDD Master Clock(24.576M) GND Clock for Camera Data Out(12.288M) Data Data Data Data Data Data Data Data Vertical Sync Horizontal Sync GND I2C Data I2C Clock Camera reset signal Camera I/O Power Camera I/O Power
CAM_MCLK GND CAM_PCLK CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5) CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC GND I2C_SDA I2C_SCL VGA_CAM_RESET_N VREG_AVDD_2.8V VREG_AVDD_2.8V
Table. Interface between VGA Camera Module and MAIN PCB (in camera module)
- 60 -
3. TECHNICAL BRIEF
3.11.6 Keypad Light

There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650.
KEY_BACK_LIGHT LED(8EA)
+VPWR
LD400 LD403 LD406
LEBB-S14H LEBB-S14H LEBB-S14H
R411 100ohm R414 100ohm R417 100ohm LD404 LD407 LEBB-S14H R415
LD402 LD405 LD408
LEBB-S14H LEBB-S14H LEBB-S14H R413 100ohm R416 100ohm R419 100ohm
LEBB-S14H 100ohm R418 100ohm
REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT
Figure 1.22 Schematic of KEY back light circuit (KEY side)
- 61 -
3. TECHNICAL BRIEF
3.11.7. LCD Module (NM176CN1 : Tovis)

- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors. - LCD Driver IC: NT3916 (NOVATEK). - 16 bit CPU interface Parallel
3.11.8. Display & LCD FPC Interface

LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD module is controlled by 16-bit EBI2 in MSM6245.
LCD CONNECTOR
CN400 ICVE21184E150R500FR 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VA410 EVL14K02200 LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR EVL14K02200
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6 1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6
ICVE21184E150R500FR
9
G2
3 4
10
INOUT_A4 INOUT_B4 G1 G2
G1
LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC
INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4
1 2 3 4
1 2
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3
9 8
LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N
7 6
EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3)
FL400
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 1 2 3 4
FL401
ICVE21184E150R500FR
9 8 7 6 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2
10
10
G1
FL402
ICVE21184E150R500FR
FL403
ICVE21184E150R500FR EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15)
10
10
FL405
VA409
PLW0501H-LF D402
0.1u
Figure 1.23 Interface between LCD Module and MAIN PCB.
- 62 -
INSTPAR
C409
3. TECHNICAL BRIEF
3.11.8.1. Audio Signal Processing & Interface

Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.
(+16.5dB)
Figure 1.24 Audio Interface Detailed Diagram(MSM6245)
- 63 -
3. TECHNICAL BRIEF
MSM6245 CODEC pins

RCVRCV+ 36
R202
AUDIO
HPH_R HPH_L 220n C200 C201 47p 47p
Near to MSM
MIC2N MIC2P MIC1N MIC1P 22n 22n C204 10p
C202
220n
C203
LINE_N LINE_P
MICBIAS
Place near C212 0.1u 10% MSM pin W18 (CODEC VSS)
C210
AC18 AC17 AA19 AC22 AC21 AC19 AC20 AA17 AE18 AA18 AE19
C211
AE20 AA20 AF22 AF20
AF18
AF19
LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP
AF21
W17
T15
SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100

M26
F25
Figure 1.25 Audio part schematics
VREG_MSMP_2.7V
2.2K MICBIAS R400 R401 5.1K
I/O CONNECTOR
C400 0.1u
R402
R403 VREG_MSMP_2.7V 51K CN401 HSEJ-18S04-25R
1M
5 HOOK_KEY 1
OUT VCC GND
10K R404 21 19 1 2 3 4 5 6 7 8 9
4 3
VIN-
100K
VIN+
U400 NCS2200SQ2T2G
MIC2N MIC2P
C401 33u R406 100ohm
R405
HPH_L HPH_R
USB_D+ USB_D-
C402
33u
R407 100ohm
EAR_SENSE_N VBATT
- 64 -
3. TECHNICAL BRIEF
AUDIO SELECT_SPK&RCV
U401 NLAS5223BMNR2G +VPWR C410 0.01u SPKSPK_RCV1 VCC 2 NO1 3 COM1 4 IN1 NC2 6 NC1 GND IN2 7 COM2 8 NO2 9 10
SPK+ SPK_RCV+ RCV_EN_N 10 R421 VA412 RCV+
VA414
RCV-
R422
10
EVL14K02200
EVL14K02200
REV_B
MIC
MICBIAS REV_B : SUMY0010301 --> SUMY0003802 R424 2.2K MIC400 OB4-15L42-C33L 1 2 INSTPAR INSTPAR C418 C419 2.2K 39p 39p 0.1u 0.1u MIC1P MIC1N C416 10u C417 47p
C420
C421
D403 PSD05-LF
PSD05-LF
REV_B : EDTY0008606 --> EDTY0008601
- 65 -
D404
R425
3. TECHNICAL BRIEF
Audio AMP
NCP2890DMR2
SPK_AMP_EN REV_C : 20K --> 3K LINE_N LINE_P R427 R429 1K 1K C4265600p C422 C423 C4275600p 0.1u 0.1u R428 5.6K R430 5.6K R431 20K C431 NA C425 10u R426 20K 1 2 _SD OUTB 8 SPK-
BYPASSU402
3 INP 4 INM
7 VM 6 VP 5 C428 1u
+VPWR SPK+ C429 C430 1000p 1000p RCVN RCVP
OUTA
L401 SPK_RCVL402 SPK_RCV+
100nH 100nH
REV_E : For Antenna Radiation
Audio part schematics
- 66 -
3. TECHNICAL BRIEF
3.11.8.2. Audio Mode

There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE Device Receiver Mode Voice Call Loud Mode Headset Speaker phone Loud Mode Loud Mode MIDI Headset Loud Mode MP3 Headset Headset MP3 Headset MIDI Bell Speaker MP3 Description Receiver Voice Call Speaker Phone Headset Voice Call Speaker Phone Speaker MIDI Bell
Table. Audio Mode
Audio & Sound Main Component There are 6 main components in U250/KU250.
Component 1 2 3 4 5 6 MSM6245 Audio amp Analog Switch Speaker/Receiver MIC Ear jack MIC400 Design No. U201 U402 U401 Maker Part No. MSM6245 NCP2890DMR2 NLAS5223BMNR2G EMS1810TP OB4-15L42-C33L RMBLGG080STSB Note Base-Band Modem 1W Audio Amp Dual Analog Switch Speaker/Receiver -42 dB microphone Ear jack
Table. Audio main component list
- 67 -
3. TECHNICAL BRIEF
3.12 Main Features

1. LG-U250/KU250 Main features
- Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76) - Dual Camera (1.3Mega + VGA(0.3M)) - 1810 speaker/receiver - Stereo Headset - Speaker phone (in GSM and WCDMA) - MP3/AAC decoder and play - MPEG4 encoder/decoder and play/save - JPEG en/decoder - Supports Bluetooth, USB - 950 mAh (Li-Ion)
- 68 -
3. TECHNICAL BRIEF
2. U250/KU250 Main Component

Logic /Audio
RF
Bluetoot h
Logic
Main board (Top)
Main board (Bottom)
- 69 -
3. TECHNICAL BRIEF
RF
SW100
U101 U500 FL101
U100 FL104
U103 X100
Reference SW100 U500 U101 FL101 U100
Description Ant. Switch module Front End module GSM PAM GSM SAW RTR6275
Reference FL104 U103 X100
Description W2100 Duplex WCDMA PAM VCTCXO BT module
- 70 -
3. TECHNICAL BRIEF
Logic / Audio
BAT300
U303 CN403
CN401
U402
Reference BAT300 U303 U402
Description Backup Battery 1.3M Cam. LDO Audio AMP
Reference CN401 CN403
Description MMI connector (18pin) 1.3M Cam. Connector
- 71 -
3. TECHNICAL BRIEF
Logic
CN400
U300
U201
U301
J300
S300
Reference U201 U301 CN400
Description MSM6245_A Memory MCP Main To LCD Connector
Reference U300 J300 S300
Description PMIC U-SIM socket T-FLASH socket
- 72 -
4. TROUBLE SHOOTING
4. TROUBLE SHOOTING
4.1 RF Component
LGMC
- 73 -
4. TROUBLE SHOOTING
Block Diagram Block
Ref. Name
Part Name
Function
Comment
UMTS
- 74 -
4. TROUBLE SHOOTING
4.2 SIGNAL PATH_UMTS RF
Common Tx/Rx UMTX 2100 Tx/Rx UMTX 2100 Tx UMTX 2100 Rx Tx I/Q LO RX I/Q
- 75 -
4. TROUBLE SHOOTING
4.3 SIGNAL PATH_GSM RF
Common Tx/Rx GSM900 Tx DCS/PCS Tx EGSM900 RX PCS Rx DCS RX Tx I/Q LO RX I/Q
- 76 -
4. TROUBLE SHOOTING
4.4 Checking VC-TCXO Block

The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part.
TCXO X100
DSA321SCE-19.2M
NC3 7 NC4 8 VREG_TCXO_2.85V 3 OUTPUT VCC GND 2 100ohm 4 C182 1000p 1 19.2MHz C181 0.1u C183 VCONT R124 TRK_LO_ADJ VREG_BT_2.85V NC2 NC1 6 5
TP1
TP4
R128 C185 TCXO_PM
VCC
100K C186 1000p 4

3
GND
100p
0.01u
TP2
C187 RTR6275_TCXO
1000p
C188
0.01u
TCXO_BT
U104
TC7SH04FU
TP3
Schematic of the VC-TCXO Block
TP3
TP2
TP4
TP1
Test Point of the VC-TCXO Block
- 77 -
4. TROUBLE SHOOTING
Check C312 of PMIC (U300)
Check R213 of MSM (U201)
- 78 -
4. TROUBLE SHOOTING
4.5 Checking Front-End Module Block

TP1
11 Rev.D L108 19 15nH C117 10p U500 ANT Rev.C
VREG_RF_SMPS
Rev.B
VDD
7 8 10 12 13 15 17 20 21 23
GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10
GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100
5 6 1 2 3 4 9 1K 1K R100 R101
D5011
18 CTRL1 22 CTRL2
ANT_SEL0 ANT_SEL1
16 GSM900_TX 14 GSM18001900_TX
C110 33p
C109 33p
Schematic of the Front-End Module Block
TP1
ANT_SEL0 ANT_SEL1
Test Point of the Front-End Module Block
- 79 -
4. TROUBLE SHOOTING
Logic Table of the FEM
TP1 VREG RF SMPS
- 80 -
4. TROUBLE SHOOTING
4.6 Checking UMTS Block

4.6.1 Checking Tx level
TP1
TP2
TP3
TP4
ANT101 ANT102
TP1
C450 22p
ANT
SW100
G2 G1 RF
C101 56p
1p C437
L101 NA
C102 NA
KMS-507 L102 100nH
TP2
11 Rev.D U500
WCDMA
Rev.D C154 1.5p
Rev_1.0
+VPWR
L404 1.8nH
+VPWR
C155 4.7u C158 15p WS2512_TR1G 10 VCC2 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 VCONT VREF 1 2 3 4 5 TR100 KRX102U
5
TP3
FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p ACMD-7602
C159 15p
IN
L122 NA
C157 10nH
O1 G3 G2 G1
0.5p L125
50OHM
OUT
C165 1p
7 GND3 6 GND2 11 BGND
PA_R0
TP4
PA_ON
Rev.B
COUP
20dB
IN
U102 CP0402A1950DNTR
4 3 2
51R119
VREG_TCXO_2.85V
C170 0.1u
PWR_DET R121 130 R120 47 7dB R122 130 C192 100p
For testing, Max power of UMT 2100 is needed.
- 81 -
4. TROUBLE SHOOTING
- 82 -
4. TROUBLE SHOOTING
4.6.2 Checking UMTS PAM Control Block PAM control signal

1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. PA_R0 : Control signals that step the active PA mode and bias
VREG_TCXO_2.85
+VPWR
PWR_DET
- 83 -
4. TROUBLE SHOOTING
4.6.3 Checking RF Rx Level
TP1
TP2 TP4
Vbias
TP3
ANT101 ANT102
TP1
C450 22p
ANT
SW100
G2 G1 RF
C101 56p
1p C437
L101 NA
C102 NA
KMS-507 L102 100nH
U500
TP2 TP4
WCDMA
Rev.D C154 1.5p Rev_1.0 VDD_RX C156 100p
Vbias
+VPWR
+VPWR
4
IN
L121 1nH
L122 NA
C157 10nH
O1 G3 G2 G1
Rev.D L409 4.7nH
Rev.D C444 2.2p
C161 2.2p
ACMD-7602 0.5p L125
PA_R0
OUT
IN
50OHM
COUP
20dB
TR100 KRX102U
5 1
TP3
2
5 1
IN
G2 O2 FL103 G1 O1 EFCH2140TDE1
L411 4.7nH C445 2.2p
U102 CP0402A1950DNTR
4 3
PA_ON
Rev.B
L408 10nH
L410 4.7nH
51R119
VREG_TCXO_2.85V
C170 0.1u
PWR_DET R121 130 R120 47 7dB R122 130 C192 100p
L128 1.8nH
C174 10p Rev.D L407 2.7nH
- 84 -
4. TROUBLE SHOOTING
- 85 -
4. TROUBLE SHOOTING
4.7 Checking GSM Block
1 2 3
- 86 -
4. TROUBLE SHOOTING
4.7.1 Checking RF Tx level
TP1
TP3 TP2
4.7.2 Schematic of RF Tx level

SW100
ANT G2 G1 RF
C101 56p
TP1
C102 NA
KMS-507 L102 100nH
ANT
L108 19 15nH C117 10p VDD
11
Rev.D
U500
Rev.C
7 8 10 12 13 15 17 20 21 23
5 6 1 2 3 4 9 1K 1K R100 R101
D5011
18 CTRL1 22 CTRL2
ANT_SEL0 ANT_SEL1
16 GSM900_TX 14 GSM18001900_TX
C110 33p
C109 33p
Rev.D C124 100p L115 18nH L403 1.5nH
GSM_PA_RAMP
C123 0.01u
C121 33u
L116 10nH 100ohm
R107
C441 5.6p C137 NA
C438 100p C138 NA C139 68p 20 17
C134 0.01u
6 VCC1B
VBATT
TP2 TP3
15 11 19 21
VCC1A
VAPC
3 4 18 1
U101
SKY77318
BS
- 87 -
16 14 13 12 10 9 8 7 5
4. TROUBLE SHOOTING
4.7.3 Checking RF Tx level
- 88 -
4. TROUBLE SHOOTING
4.7.4 Checking PAM Block

TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V) TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V
TP1 TP4
TP2
TP3
TP4
GSM_PA_RAMP
Rev.D 4 p L403 1.5nH
+VPWR
C123 0.01u C121 33u
EGSM
L116 10nH 100ohm
R107
TP1
C134 0.01u C136 0.01u
C438 100p C138 NA C139 68p 20 17
TP3
6 VCC1B
VCC1A
VBATT
VAPC
FL1
3 4 18 1 R113 100ohm
15 11 19 21
U101
SKY77318
GSM_PA_EN EFC
BS
C149 15p
R117 100ohm
16 14 13 12 10 9 8 7 5
GSM_PA_BAND
C153 15p
TP2
Schematic of GSM PAM Block
- 89 -
4. TROUBLE SHOOTING
4.7.5 Checking RF Rx Block
TP1. DCS RX INPUT

TP1 TP3
TP2. PCS RX INPUT TP3. GSM RX INPUT
TP2
L102 100nH Rev.C U500 ANT 11 Rev.C C439 5p
19
VDD
7 8 10 12 13 15 17 20 21 23
5 6 1 2 3 4 9 1K 1K R100 R101
TP1
DCS
C105 NA C440 5p
0.5p C190
C442 5.6p D5011 18 CTRL1 22 CTRL2
ANT_SEL0 ANT_SEL1
16 GSM900_TX 14 GSM18001900_TX
TP2
C110 33p C109 33p
PCS
C116 NA C443 5.6p
NA C191
L405
2.7nH L111 5.6nH
GSM_PA_RAMP
TP3
+VPWR
C123 0.01u C121 33u
EGSM
C120 NA
Rev.D C124 100p L115 18nH L403 1.5nH
L406
2.7nH
L116 10nH
Schematic of GSM900/DCS/PCS Rx Block
- 90 -
4. TROUBLE SHOOTING
- 91 -
4. TROUBLE SHOOTING
4.8 Checking Bluetooth Block

Test Point of the Bluetooth Block
TP2
TP1. VREG_BT_2.85V
TP1
TP2. VREG_MSMP_2.7V
TP3
TP3. TCXO_BT TP4. BT ANT Output

TP4
Test Point of the Bluetooth Block
TP4
BLUETOOTH
ACS2450HBAXX
R118
FEED NC1 NC2
TP2
M100
16
LBRQ-2B43A
C171 BT_CLK C172 C173 R123 VREG_MSMP_2.7V 0 0.1uF 2.2u 100p 100p VREG_BT_2.85V 1u 2.2u 1000p 9 3 2 10 14 CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT PGND4 20 PGND3 19 PGND2 18 PGND1 17
ANT
4 SBST 11 SBCK 12 SBDT 5 13 7 1000p C176
C169
NA
L126 NA
ANT103
BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA TCXO_BT
SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN GND4 15 GND3 8 GND2 6 GND1 1
C179
C177
C180
C178
TP1
TP3
Schematic of the Bluetooth Block
- 92 -
4. TROUBLE SHOOTING
Start
TP1,TP2 Signals exits? YES TP3 Is clock ok? 19.2M
NO Change the Main board
NO Change the X100
YES NO TP4 Signals exits? YES Change the Main board Change the M100
- 93 -
4. TROUBLE SHOOTING
4.9 Power ON Troubleshooting

Power On sequence of U250/KU250 is : PWR key press PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) PM6650 Power Up VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 Phone booting and PS_HOLD assert to PMIC
Start
NO
Battery voltage. higher than 3.20V?
Change or charging the Battery
YES NO Key press? Check the Key Dome
YES NO
VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.8V, VREG_TCXO_2.85V, VREG_MSMA_2.6V power up?
Change the Main board
YES
Is clock ok? R306 : 19.2M X300 : 32.768Khz
NO Check the TXCO
YES Change the Main board
- 94 -
4. TROUBLE SHOOTING
VREG_MSMC
VREG_MSME
VREG_MSMP
X300 : 32.768Khz
VREG_MSMA
R306 : 19.2Mhz
[U250/KU250 Main PCB BOTTOM]
- 95 -
4. TROUBLE SHOOTING
4.10 Charger Troubleshooting
CHARGER
ICHARGEOUT +VPWR SI3493DV-E3 Q301 R313 USB_VBUS 0.1 6 5 4
Q300
QST4
VBATT
D3 D4
C1 1 2
C2
3 B
D1 D2
USB_CTL_N
G
+5V_PWR BATT_FET_N 6 5 4
Q302
QST4
C1 1 2
C2
3 B
CHG_CTL_N ICHARGE
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT
Charging Procedure - Connect TA or USB Cable - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point - Connection of TA or USB Cable - Charging current path - Battery Troubleshooting Procedure - Check the charger (TA or USB Cable) connector - Check the charging current Path - Check the battery
- 96 -
4. TROUBLE SHOOTING
Start
Check the pin and battery Connect terminals of I/O connector
NO
Connection OK?
Change I/O connector
Yes NO
Is the TA (or USB Cable) voltage 5.1V (or 5.0V)?
Change TA (or USB Cable)
Yes
Is it charging properly After turning on Q301(or Q302) , Q302?
Yes
END
NO
Change the board
[ Charger Troubleshooting Flow ]
- 97 -
4. TROUBLE SHOOTING
Q302
Q300 R313
Q301
[ Charging part ( Main PCB Front ) ]
- 98 -
4. TROUBLE SHOOTING
4. BB Trouble Shooting
4.11 USB Troubleshooting

USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on USB_VBUS(Q300) go to 5V USB_D+ go to 3.3V USB_DAT is triggered USB work.
Start
Power is on? YES Cable is inserted? YES Q400 pin 4 is 5V? YES USB_D+ is 3.3V? YES Change the Main board
NO
Go to power on trouble shooting
NO
Insert cable
NO
Check Q300 (pin 4)
NO Check VA401
- 99 -
4. TROUBLE SHOOTING
4.12 SIM Detect Troubleshooting

USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered VREG_UIM_2.85V go to 2.8V USIM IF work
Start
Re-insert the SIM card
Work well? No
VREG_UIM_2.85V is 2.85V? USIM_P_CLK is run?
Yes
End
NO
Check J300
YES Change SIM card
Yes Work well? No Change the Main board
End
- 100 -
4. TROUBLE SHOOTING
5 1 2 3 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK USIM_P_DATA
USIM
USIM_P_DATA
R317
15K
EVLC18S02003 VA300
5 6 7 8 9 10
J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12
GND3 GND4
smd_1005h_5_r smd_1005h_5_r
VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK
L302 56nH
Figure. USIM part schematics
- 101 -
EVL14K02200 VA301
EVLC18S02003 VA302
C352
33p
0.1u
C353
4. TROUBLE SHOOTING
4.13 Camera Troubleshooting

Camera control signals are generated by MSM6245.
4.13.1 MEGA CAMERA
Start
Check the camera connector and reconnect the camera
Yes Camera is OK? NO END
NO
Yes NO Check the CAM_MCLK Yes Change the camera Yes Camera is OK NO
Change the Main board Change the Main board
END
- 102 -
4. TROUBLE SHOOTING
4.13.2 VGA CAMERA
Start
Check the camera connector and reconnect the camera
Yes Camera is OK? NO END
NO
Yes NO
Check the CAM_MCLK
Yes Change the camera Yes Camera is OK NO

END
- 103 -
4. TROUBLE SHOOTING
C350
C447
C347
U501
U303
C348
C349
CAMERA LDO
+VPWR CAM_LDO_EN C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND PGND 9 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u
+VPWR CAM_LDO_EN C447 1u
VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D
VREG_CAM_DVDD_1.5V
C350 1u
- 104 -
4. TROUBLE SHOOTING
4.14 Keypad Backlight Troubleshooting

Key Pad Back Light is on as below : Key pressing KYBD_BACKLIGHT go to 0V MAIN Key Backlight LED On
Start
Key press
NO
+VPWR is above 3.2V?
Check battery Yes NO Change the Main board
Yes
KYBD_BACKLIGHT is 0V ?
Yes YES
Backlight LED ON?
END
No
+VPWR
+VPWR
LD400 LD403 LD406
LD402 LD405 LD408
REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT
Figure.Keypad backlight LED part
- 105 -
4. TROUBLE SHOOTING
4.15 Main LCD Troubleshooting

Main LCD control signals are generated by MSM6245. The signal path is : MSM6245 CN400 LCD Module
Start
Press END key
Key LED is on? Yes
NO GO to power on trouble shooting
Disconnect and reconnect The LCD connector
LCD display OK?
Yes
END
No Change the LCD module
LCD display OK? No
Yes END
- 106 -
4. TROUBLE SHOOTING
4.16 Receiver Path

MSM6245 EAR1ON/EAR1OP R421,R422 Analog Switch(U401) Receiver
Start
Connect the phone to network Equipment and setup call Setup 1KHz tone out
YES
Can you hear the tone?
END
NO
The sine wave appears at L401, L402?
YES Change receiver
NO
The sine wave appears at R421, R422?
YES Check the analog switch
- 107 -
4. TROUBLE SHOOTING
R421
R422
U401
- 108 -
4. TROUBLE SHOOTING
4.17 Headset path

MSM6245 HPH_R, HPH_L C402/C401 R407/R406 CN401 (MMI Connector)
Start
Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset.
YES Can you hear the tone? END
NO YES
Sine wave appears at R407/R406?
Change the Headset
- 109 -
4. TROUBLE SHOOTING
CN401
R406
C401 C402
C407
- 110 -
4. TROUBLE SHOOTING
4.18 Speaker phone path

MSM6245 LINE_P,LINE_N R429/R427, C423/C422, R431/R426 Audio AMP(U402) Analog Switch(U401) Speaker
Start
Connect the phone to network equipment and setup call Setup 1KHz tone out
YES Can you hear the tone? END
NO
Sine wave appears at R429/R427 and C423/C422 And R431/R426 ?
YES SPK_AMP_EN is2.6V? NO Change the Main board
YES NO
The sine wave appears at SPK+, SPK- ?
Change the Audio Amp
YES
The sine wave appears at SPK_RCV-,SPK_RCV+?
YES Change speaker
- 111 -
4. TROUBLE SHOOTING
Analog Switch
SPK+ Audio Amp
- 112 -
4. TROUBLE SHOOTING
4.19 Main microphone

MIC400 MIC1P, MIC1N (MSM6245)
Start
Make a call
MIC_BIAS(C416) is 1.8V
NO
Change main board
YES Make sound to MIC
Sine wave appears at C418/C419?
NO
Change the MIC
YES Change the Main board NO Work well?
YES END
- 113 -
4. TROUBLE SHOOTING
R424
C417
MIC400
- 114 -
4. TROUBLE SHOOTING
4.20 Headset microphone

Headset C210/C211 MIC2P, MIC2N (MSM6245)
Start
Make a call
OK Change the headset and retry NO NO

HOOK_KEY is detected?
END YES Change the MAIN board
Yes NO
MICBIAS is biased by 1.8V?
Change the MAIN board
Yes NO
Sine wave appears at C210/C211 ?
Change the headset or Main board and retry.
Yes Change the Main board
- 115 -
4. TROUBLE SHOOTING
Ear_Sense_N
MIC Input
- 116 -
4. TROUBLE SHOOTING
4.21 Vibrator
The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.
Start
Operate the Vibrator
Work well?
NO Change vibrator or PM6650
Yes
End
TP400 TP401 L400 56nH D400 RB521S-30
+VPWR
MOTOR_PWR-
- 117 -
4. TROUBLE SHOOTING
MOTOR_PWR-
+VPWR
- 118 -
5. DOWNLOAD
5. DOWNLOAD
5.1 U250/KU250 DOWNLOAD
5.1.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.
5.1.2 Downloading Procedure

Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences.
Play a success sound It will be played a .wav file when the download has been completed. To enable this simply check the box. Always on Top Check if LGMDP always appears at the top of the window so that user can monitor it all the time. Automatically run Select Port When LGMDP starts When LGMDP starts, it will automatically select Select Port button to download new image file.
- 119 -
5. DOWNLOAD
5.1.2.1 Connecting to PC
Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.)
The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.
U250/KU250
- 120 -
5. DOWNLOAD
1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically.
U250/KU250
1) 2)
U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250
3) 5)
4)
6)
7)
4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option. Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out. Keep All Contents Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected. 5) Additional Options: Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose. 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image.
- 121 -
5. DOWNLOAD
5.1.2.2 Choosing image files

Select the image folder, where all the image files are located, by clicking on the Browse. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)
U250/KU250
- 122 -
5. DOWNLOAD
Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.)
U250/KU250
U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250
- 123 -
5. DOWNLOAD
If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse button.
U250/KU250
Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.
Yes
No
- 124 -
5. DOWNLOAD
5.1.2.3 Downloading
This message box informs that a new file for
NV_U250/KU250
NV backup will be created in the displayed file name in the LGMDP installation directory.
Backing up NV data and backed up NV data

U250/KU250
will be stored in the LGMDP installation directory.
Erasing the existing directories and files

U250/KU250
before the Module image is downloaded.
Downloading the AMSS modem image

U250/KU250
- 125 -
5. DOWNLOAD
Rebooting the handset and re-establishing the connection
Restoring NV data which backed up in the

U250/KU250
Backing up process. User can also restore NV data using NV Default image selection.
Rebooting the handset and re-establishing the connection
Erasing the existing directories and files

U250/KU250
before downloading the selected Media image
- 126 -
5. DOWNLOAD
Downloading Media image in progress

U250/KU250
Downloading Module image in progress

U250/KU250
Downloading process has completed

U250/KU250
successfully
- 127 -
5. DOWNLOAD
5.1.2.4 Tools
Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.
- 128 -
5. DOWNLOAD
5.1.3 Troubleshooting Download Errors

1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error
5.1.3.1 When the phone does not work

Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image. The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.)
- 129 -
5. DOWNLOAD
The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue.
U250/KU250
Choose Image file after clicking on the Browse button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.
U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250
- 130 -
5. DOWNLOAD
5.1.3.2 NV Restore Error

Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.
U250/KU250
Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)
U250/KU250
U250/KU250
- 131 -
5. DOWNLOAD
Click on Browse . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.
U250/KU250
- 132 -
5. DOWNLOAD
5.1.4 Caution
1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message cal mode after completing download, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format.
D:\LGMDP\004400-01-429926\_COM14_
LGMDP folder name IMEI number
Port number
4) Recommended that the Module and Media Image have to be downloaded at the same time. 5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.
- 133 -
6. BLOCK DIAGRAM
6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block
[Fig 2.1] U250/KU250 RF Functional Block Diagram
- 134 -
6. BLOCK DIAGRAM
[Table 2.1] RF Block Component
- 135 -
6. BLOCK DIAGRAM
6.2 Interface Diagram

6.2.1 RTR6275 & MSM6245 Interface Diagram
[Fig 2.2] RTR6275 & MSM6245 Interface Diagram
- 136 -
6. BLOCK DIAGRAM
6.2.2 Memory Interface
ADDRESS[14:0]
[Fig 2.3] Memory Interface Diagram
- 137 -
6. BLOCK DIAGRAM
6.2.3 USB,UART,SIM,JTAG Interface
[Fig 2.4] USB, UART, SIM, JTAG Interface
- 138 -
6. BLOCK DIAGRAM
Main RF signal
Control signal
Control signal UMTS PA_CTL signal PA_R0 GSM PA_CTL signal GSM_PA_BAND GSM_PA_EN GSM_PA_RAMP DCS or PCS /GSM Mode Selection Power Amp Gain Control Enable Power Amp Gain Control UMTS, ANT_SEL 0,1 Ant Switch Module Mode Selection GSM900Tx/Rx, DCS Tx/Rx, PCS Tx/Rx UMTS Tx High/Low Power Control Description Comment
- 139 -
6. BLOCK DIAGRAM
6.2.4 Placement *Top Side
LGMC
- 140 -
6. BLOCK DIAGRAM
*Bottom Side
LGMC
- 141 -
- 142 -
7. CIRCUIT DIAGRAM
14
15
16
ANT101 ANT102 GSM 1800/GSM 1900 RX GSM 850/ GSM 900 RX C450 22p
ANT
ANT_SEL0 LOW HIGH LOW HIGH
ANT_SEL1 LOW LOW HIGH HIGH
SW100
G2 G1 RF
C101 56p
GSM 850/GSM 900 TX/ WCDMA GSM 1800/GSM 1900 TX
1p C437
L101 NA
C102 NA
KMS-507 L102 100nH
TX_IP Rev.C U500 11 ANT Rev.C C439 5p C103 180p C104 180p TX_IM GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 5 6 1 2 3 4 9 1K 1K R100 R101 Rev.C 55 2 ENV_LNP 1 ENV_LNN 51 TX_IP 50 TX_IN 53 TX_QP 52 TX_QN TCXO 7 C114 1000p 3300p
Rev.D L108 19 15nH C117 10p
VREG_RF_SMPS
Rev.B
VDD
DCS
C105 NA C440 5p
ENV_OUT
TX_QP C108 180p
0.5p C190 DCS_PCS_TX GSM_TX C442 5.6p
C106 C107 C112
8.2p 6p 12p
7 8 10 12 13 15 17 20 21 23
46 HB_RF_OUT1 44 HB_RF_OUT2 43 LB_RF_OUT1 42 LB_RF_OUT2 24 56 54 RF_ON VCONTROL DAC_REF SBDT
B
C113 180p TX_QM RTR6275_TCXO C115
D5011
18 CTRL1 22 CTRL2
ANT_SEL0 ANT_SEL1
TX_ON
16 GSM900_TX 14 GSM18001900_TX
PCS
C110 33p C109 33p
C116 NA C443 5.6p
TX_AGC_ADJ NA C191 DAC_REF C118 12p R103 12K (1%)
5 VTUNE1 18 VTUNE2
VTUNE-Connected directly to GND
14
U100
12 RX_IP 13 RX_IN 10 RX_QP 11 RX_QN
RX_IP RX_IM RX_QP RX_QM PWR_DET R105 5.1 R433 R434 R106 L114 C126 C128 C129 C130 C127 C131 C132 C189 22p 2.7 2.7 5.1 47nH C122 22u Rev.D VREG_RF_SMPS Rev.B
L405
2.7nH L111 5.6nH
3 R_BIAS1 27 R_BIAS2 31 GCELL_INP 30 GCELL_INN 32 EGSM_INP 33 EGSM_INN 38 DCS_INP 39 DCS_INN 36 GPCS_INP 37 GPCS_INN
RTR6275
GSM_PA_RAMP
SSBDT_RTR
R104 680 (1%) C119 22p 40 PWD_DET_IN 21 TEST VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 4 6 8 9 15 16 19 20 28 41 45 47 48 49 C140
C
Rev.D C124 100p L115 18nH L403 1.5nH
+VPWR
C123 0.01u C121 33u
EGSM
C120 NA
L406
2.7nH
L116 10nH 100ohm
R107
0.1u
22p
22p
0.1u
WLNA_OUT
25 GND 57 PGND
VDDM
C141
91 R110
91 R111
C142
C137 NA
C138 NA
C139 68p 20 17
C136 0.01u
34 WMIX_INP 35 WMIX_INN
C441 5.6p
C438 100p
C134 0.01u
8.86dB Rev.1.0 R108 DCS_PCS_TX 51
22 CAL_INP 23 CAL_INN 26 WLNA_IN
0.1u
22p
22p
Rev.C
L119 47nH VDD_RX C135 0.1u VREG_SYNTH_2.6V
17
29
22p
VAPC
VBATT
VCC1B
VCC1A
FL101
3
4 5
100p
22p
R109 10 L120 VREG_RF_SMPS
15 11 19 21
C147
7.5dB 47nH C143 0.1u

O1 G3 1 IN G2 G1
C144 22u
100ohm
R114
GSM_PA_EN
SKY77318
BS
C149 15p
R115
18
100ohm
EFCH897MTDB1
Rev.D R116 VREG_MSMP_2.7V
22p
U101
4 R113 100ohm
R112 GSM_TX 39
R117 100ohm
100ohm
16 14 13 12 10 9 8 7 5
GSM_PA_BAND
C153 15p
GSM_PA_BAND LOW HIGH
MODE GSM DCS/PCS
C150 1000p
C151 22p
C152 0.01u
Rev.D
GSM/EDGE WCDMA
Rev.D
Rev_1.0 C154 1.5p VDD_RX C156 100p L121 1nH
+VPWR
F
+VPWR
4
IN
L122 NA
C157 10nH
O1 G3 G2 G1
Rev.D L409 4.7nH
Rev.D C444 2.2p
C161 2.2p
ACMD-7602 0.5p L125
PA_R0
5 1
IN
OUT
IN
50OHM
COUP
20dB
TR100 KRX102U
5 1
G2 O2 FL103 G1 O1 EFCH2140TDE1
L411 4.7nH C445 2.2p
BLUETOOTH
ACS2450HBAXX
C
R118
FEED NC1 NC2
U102
2
51R119
CP0402A1950DNTR
4 3
PA_ON
Rev.B
L408 10nH
L410 4.7nH
VREG_TCXO_2.85V
C170 0.1u C171 BT_CLK C172 C173 L128 1.8nH C174 10p VREG_MSMP_2.7V Rev.D VREG_BT_2.85V L407 2.7nH 0 0.1uF 100p 2.2u 100p 1u 2.2u 1000p 9 3 2 10 14
M100
16
PWR_DET R121 130 R120 47 7dB R122 130 C192 100p
LBRQ-2B43A
CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT PGND4 20 PGND3 19 PGND2 18 PGND1 17
ANT
4 SBST 11 SBCK 12 SBDT 5 13 7 1000p C176
C169
NA
L126 NA
ANT103
BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N
SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN GND4 15 GND3 8 GND2 6 GND1 1
R123
D
BT_DATA TCXO_BT
C179
C177
X100 DSA321SCE-19.2M
NC3 7 NC4 8 VREG_TCXO_2.85V 3 OUTPUT VCC GND 2 100ohm R124 TRK_LO_ADJ 1 C183 NC2 NC1 6 5
E
C182 1000p C181
VCONT
C180
C178
TCXO
19.2MHz 0.1u
E
VREG_BT_2.85V
0.01u
Section
Date
Sign & Name MODEL
Sheet/
Designer
C186
MAR. 07. 2007
KANG. H. S
KU250 U250/KU250 RF
Sheets
R128 C185 TCXO_PM 100p
100K 1000p 4
3
GND
1/4
DRAWING
VCC
C187 RTR6275_TCXO
1000p
C188
0.01u
Checked
TCXO_BT
U104
F
TC7SH04FU
Approved
LG Electronics Inc.
1 2 4 5 6 7 8 9
DRAWING NO.
REV_1.2
LG Electronics Inc.
LGMC
LG(42)-A-5505-10:01
- 143 -
7. CIRCUIT DIAGRAM
10
11
12
13
14
15
16
MODE
VREG_MSMP_2.7V
ADC
MODE2 MODE1 0 0 MODE0 0 ( Default Pull-Down) Native, ARM JTAG HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - HDET1 HKADC[3] - TTY_ADC_DET HKADC[4] - PCB_Rev_ADC HKADC[5] - VBATT_TEMP PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM
HKADC(4):PCB_Rev_ADC 150K : 10K : 0.016V 150K : 47K : 0.62V 150K : 68K : 0.81V 150K : 100K : 1.04V 150K : 150K : 1.30V 150K : 300K : 1.73V 150K : 470K : 1.97V 150K : 680K : 2.13V 150K : 750K : 2.17V
VREG_MSMP_2.7V
VREG_MSMP_2.7V
HKADC
R201 R202 150K 1% 36
RCVRCV+
BOOT_MODE3 BOOT_MODE2 BOOT_MODE1 0 0 1 0 1 0 1 1 1 1 1 8-bit, NAND, Normal 16-bit, NAND, Normal 8-bit, NAND, Trusted 16-bit, NAND, Trusted
RESET SDRAM
REV_B SDRAM_CLK SDRAM_CS_N(0) SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N SDRAM_WE_N SDRAM_DQM(3) SDRAM_DQM(2) SDRAM_DQM(1) SDRAM_DQM(0)
AUDIO
HPH_R HPH_L 220n C200 C201 47p 47p
220n
CLOCK
R204 51K
VREG_MSME_1.8V
R435 1% 300K
Near to MSM
1005 0.1uF 16V +80/-20% MIC2N MIC2P MIC1N MIC1P 2012 10uF 6.3V +80/-20% Ceramic
C202
AMUX_OUT VBAT_SENSE
SLEEP_CLK
TCXO_MSM
RESIN_N RESOUT_N
VBAT_TEMP
C203
MICBIAS
VREG_MSMC_1.25V
VREG_MSME_1.8V
VREG_MSMP_2.7V
VREG_MSMA_2.6V
SDRAM_ADDR(0:14)
(CAD : 10uF=>Input MSMA_2.6V)

C204 10p C205 4.7u Place near C212 0.1u 10% MSM pin W18 (CODEC VSS) C206 10u C209 0.1uF
SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) SDRAM_ADDR(13) SDRAM_ADDR(14)
LINE_N LINE_P
R205
R208 R209
22n C210
R207
R206
NA
51K
51
51K 51K
C211
22n
AC18
AC17
AA19 AC22
AC21
AC19
AC20
AE17
AE21
AE22
AA23
AB23
AA17
AE18
AA18
AE19
AE20 AA20
AF18
AF19
AF21
AF22
AF20
W21
W17
AD1
AB1
AA2
AA4
N11
D18
U23
P8 P11
A10
B10
A16 B16
Y23
V21
V19
F13
F11
T21
Y21
TCXO USB_XTAL48_IN USB_XTAL48_OUT SLEEP_XTAL_IN SLEEP_XTAL_OUT
A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14
BOOT_MODE BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5
ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0
SDRAM_DATA(0:31)
C
REV_B Change 32 bit SDRAM_DATA(31) SDRAM_DATA(30) SDRAM_DATA(29) SDRAM_DATA(28) SDRAM_DATA(27) SDRAM_DATA(26) SDRAM_DATA(25) SDRAM_DATA(24) SDRAM_DATA(23) SDRAM_DATA(22) SDRAM_DATA(21) SDRAM_DATA(20) SDRAM_DATA(19) SDRAM_DATA(18) SDRAM_DATA(17) SDRAM_DATA(16) SDRAM_DATA(15) SDRAM_DATA(14) SDRAM_DATA(13) SDRAM_DATA(12) SDRAM_DATA(11) SDRAM_DATA(10) SDRAM_DATA(9) SDRAM_DATA(8) SDRAM_DATA(7) SDRAM_DATA(6) SDRAM_DATA(5) SDRAM_DATA(4) SDRAM_DATA(3) SDRAM_DATA(2) SDRAM_DATA(1) SDRAM_DATA(0)
T8 T6 T4 R8 T2 T1 R6 R4 W4 V6 Y2 Y1 E1 R11 V4 U6 L6 L8 K4 J1 K6 J2 J4 P4 H4 G2 J6 AB4 D1 AB2 D2 E2
RESIN_N RESOUT_N RESOUT_N_EBI1 WDOG_EN
LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP
MODE2 MODE1 MODE0
T15
W6
M8 M4
M6
G1
N8
N6
N2
N1
N4
U8
V8 U4
V1
P1
P2
P6
Y4
K8
V2
L1
L4
L2
C213 0.01u
C214 0.01u
C215 0.01u
C216 0.1uF
C217 0.01u
C218 0.01u
C219 0.1uF
C220 0.1uF
C221 0.1uF
SDRAM
(VDD_DAC_REF)
A1_22 A1_21 A1_20 A1_19 A1_18 A1_17 A1_16 A1_15 GPIO_74 GPIO_73 GPIO_72 GPIO_71 GPIO_70 GPIO_69 GPIO_68 GPIO_67 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0
SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105
F25 M25 M26 AE3 AD2 H25 F26 H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 H13
LCD_MAKER_ID LCD_VSYNC
TP200 WDOG monitoring
C222 1000p
C223 1000p
C225 0.01u
C226 0.01u
C227 0.01u
C228 0.01u
C229 0.1uF
C230 0.1uF
2200p cap => place between D12(VDDA1) and F12(DAC_REF)
AE16
AE11
AE15
AA26
AE23
AE24
AA16
AC2
AE8
G25 D25
AE6
R25
D12
U25
U26 Y26
B24
B14
B11
K25
B15
B18
B21
P23
T25
W2
M2
C2
H2
R2 U2
B5
K2
B9
VDD_PAD1_0 VDD_PAD1_1 VDD_PAD1_2 VDD_PAD1_3 VDD_PAD1_4
VDD_PAD3_0 VDD_PAD3_1 VDD_PAD3_2 VDD_PAD3_3
VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12
VDD_PAD2_0 VDD_PAD2_1 VDD_PAD2_2
2K TCXO_EN PA_ON TX_QM TX_QP TX_IM TX_IP DAC_REF
R213 C246
VDD_PAD4_0
VDD_PLL VDD_MDDI
TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF
VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10
TX_AGC_ADJ TRK_LO_ADJ
A3
F2
LCD_IF_MODE_1
AF17
WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93
CAM_MCLK LCD_IF_MODE_0 VGA_CAM_RESET_N LCD_LDO_EN LCD_RESET_N HOOK_KEY C232 1000p C233 1000p C234 1000p C235 1000p C236 0.01u C237 1000p C238 1000p C239 1000p C240 0.1uF C242 0.1uF
C231 2200p
DAC_REF
GPIOs
Near to B18 (VDD_PLL) VREG_MSMA_2.6V
R211 0 RCV_EN_N Close to MSM C243 0.1u 10% C244 0.01u
33nF
A12 B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25
M1 R1
AC15
LCD_CS_N NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) EBI2_DATA(7) EBI2_DATA(6) EBI2_DATA(5) EBI2_DATA(4) EBI2_DATA(3) EBI2_DATA(2) EBI2_DATA(1) EBI2_DATA(0)
XMEM2_CS_N1 AF14 LCD_CS_N_GPIO38

AF10
VSS_PAD1_0 VSS_PAD1_1 VSS_PAD1_2 VSS_PAD1_3 U1 VSS_PAD1_4

K1
F1
RESERVED
(PLLOUT_TEST)
C26
E
VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 VSS_DIG
C1 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 A11 A5 AC23
EBI2_DATA(0:15)
OE2_N WE2_N AE10 LB2_N_A2_0 T14 NAND2_FLASH_READY_GPIO33

AF4 AA10 AC9 W10 AA9 AE7 AC8 W9 AA8 AC7 AF5 AA7 AE5 AC6 AE4 AF3 AC5
W14 XMEM2_CS_N0 AF7
UB2_N
U201-1 MSM6245_A
Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0
AF6
RF
RX_QM RX_QP RX_IM RX_IP
AF11 AF15 R26
VSS_PAD2_0 VSS_PAD2_1 VSS_PAD2_2
VSS_PAD3_0 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3

B17 A18
U201-2 MSM6245_B
NAND & LCD
C
(ADS signal for LCD) LCD_ADS
AF13 AA14 T13 AC14 AE14 W13 AC13 AA13 AF12 AE12 AC12 AA12 W12 T12 AC11 AA11 AC10 W11 AF9 AE9
P21 UART1_RFR_N_PA_POWER_CTL_M_GPIO98 P16
CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 RINGER_GPIO18
MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31
UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 L26 UART1_DP_TX_DATA_GPIO95 D8 GPIO44 F7 GPIO39 F14 GPIO64
UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 M19 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42
UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88
P19 KEYSENSE1_N_GPIO63 R21
KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46
KEYSENSE0_N_GPIO62
K21 I2C_SDA_GPIO26 N16
USB_DAT_VP N23 USB_SE0_VM N25 USB_OE_TP_N
PA_POWER_CTL GSM_PA_DAC_REF
I2C_SCL_GPIO27
AD26
M23
M21
M16
G21
U21
R23
D14
D10
N26
H26
D20
D22
C25
D21 B3
H14
E23
K23
H23
MDDIH_STBN MDDIH_STBP MDDIH_DATN B20 MDDIH_DATP
GPIO45 GPIO53 GPIO52 GPIO51 B7 GPIO50 F9 GPIO49
SBST SBDT L21 SBCK
K26
P25
A19
A20
B19
F20
F16
L12
L23
L14
A4
A7
E4
J23
L15
J19
J25
J26
G6
F4
L19
R16
VDD_EF_USE
A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1
GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20
B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19 A22
VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38
D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0
GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK

H15 D16 F15 D15 A17 H16 K19
D17
A21
PA_R0
D13 D19 P26 U19 V26 W16 W18 W26 AB26 AC16 AC26 AD25 AF23 AF24
AUX_PCM_CLK_GRFC14_GPIO80 N21 AUX_PCM_DIN_GRFC13_GPIO14 G4 AUX_PCM_DOUT_GRFC12_GPIO103 J8 AUX_PCM_SYNC_GRFC11_GPIO102 H12 TX_ON_GRFC10
SPK_AMP_EN
TX_ON
VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16
F
AA21 AA6 AC4 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26
NC VSS39 VSS41 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50
MSM6280 Reference Rev.B : AA21 -> NC AC23: VSS_DIG
w18 (Analog VSS guard ring for CODEC)
ANT_SEL1 ANT_SEL0
GSM_PA_BAND GSM_PA_EN
BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA
for VSS_THERMAL
W19
M12
M14
M15
D23
H19
N12
N13
N14
N15 P12
R12
R13
R14
M13
R15
A25
A26
B2 B25
B26
K10
P13
P14
P15
T11
F21
M11
T16 W8
L11 L16
F6
D4
H8
A2
A1
B1
MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN
Section
CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_VSYNC CAM_HSYNC CAM_PCLK CAM_LDO_EN MEGA_CAM_PWR_DOWN LCD_BL_CTRL MEGA_CAM_RESET_N EAR_SENSE_N GSM_PA_RAMP GSM_PA_PWR_CTL_REF SSBDT_RTR SSBDT_PM C247 0.1u 10% Place near MSM pin AD26 12 11 10 9 8 7 6 5 4 3 2 1
CTS RTS DSR
Date
Sign & Name
Sheet/ MODEL
MMC_CD UART_RXD (NAND_BOOT_ERR) UART_TXD
USIM_CLK USIM_RST_N USIM_DATA
KEY_ROW(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0)
KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)
MMC_CMD MMC_DATA MMC_CLK
PM_INT_N PS_HOLD
USB_DAT USB_SE0 USB_OE_N
Designer
MAR.07.2007
Jaykay
U250/KU250 KU250
Sheets
CAMERA
2.2K 2.2K
KEYPAD
F
USIM PMIC
USB MicroSD
R214 R215
USB_D+ USB_DUSB_VBUS VBATT REMOTE_PWR_ON UART_TXD UART_RXD
2/4
TP402 TP403 TP404 TP405 TP406
UTXD URXD PWR VBAT VBAT

NC4 NC3 NC2
ON_SW ON_SW
Checked DRAWING Approved NAME
UART
NC1 TX RX GND
VREG_CAM_AVDD_2.8V (Check CAM_DATA PINOUT !!!!)
UFLS TX RX GND
MSM
REV_1.0
LG Electronics Inc.
LGMC
I2C_SDA I2C_SCL
2.5G 3G UART
LG Electronics Inc.
7 8 9
DRAWING NO.
LG(42)-A-5505-10:01
- 144 -
7. CIRCUIT DIAGRAM
10
11
12
13
14
15
16
A
VREG_TCXO_2.85V
VREG_SYNTH_2.6V GSM_PA_PWR_CTL_REF
PMIC VPWR BYPASS

A
VDD_MSMC : 4.7uF VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_RF : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF VDD_SPKR : 0.1uF
U301
SDRAM_CS_N(0) SDRAM_WE_N SDRAM_RAS_N SDRAM_CAS_N SDRAM_CLK SDRAM_CLK_EN EBI2_WE_N NAND_READY NAND_ALE NAND_CLE EBI2_OE_N RESOUT_N SDRAM_ADDR(13) SDRAM_ADDR(14) EBI2_DATA(0:7)
R302 100K J2 _CS K1 _WED G2 _RAS H2 _CAS G8 CK E3 CKE B6 _CE B7 C6 C4 B4 B3 C3 _WEN R_B ALE CLE _RE _WP
HYC0UEH0MF3P-6SS0E REV_B C5 VSSN0 P6 VSSN1 J9 K10 L10 M9 N10 C10 D9 E10 F9 G10 X16 SDRAM --> X32 SDRAM
R301 100K
VREG_MSMP_2.7V
51K R300
VREG_BT_2.85V
VDD_MSME : 4.7uF
+VPWR C307 C301 C303 C304 C305 C302 C306 C308 VSSQ0 VSSQ1 VSSQ2 VSSQ3 VSSQ4 VSSQ5 VSSQ6 VSSQ7 VSSQ8 VSSQ9 REV_B C310
0.1u
0.1u
0.1u
0.1u
4.7u
0.1u
NAND_CS_N
B
0.1u
0.1u
4.7u
C446 33u
1u
C312
C311
1u
+VPWR AMUX_OUT
+VPWR
+VPWR
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
CBL0PWR_N(MPP3)
CBL1PWR_N(MPP4)
AMUX_IN2(MPP2)
VDD_RF AMUX_IN1(MPP1)
VREG_SYNT REF_OUT(MPP8)
SPKR_OUT_M
VREG_RFRX1
VREG_RFRX2
SPKR_OUT_P
SPKR_IN_P
VREG_RFTX
VREG_WLAN
SPKR_IN_M
VREG_TCXO
VDD_WLAN
VDD_SPKR
GND_SLUG
AMUX_OUT
SPKR_BYP
VDD_MAIN
EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12)
N1 N2 N3 M5 P7 M6 N6 M8 K4 L1 L2 L3 C2 D2 E1 D3 E2 D4 K3 F2 F1
IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12
C317
C318
C319
C320
C321
C316
J3 BA0 K2 BA1
VDDQ0 VDDQ1 VDDQ2 VDDQ3 VDDQ4 VDDQ5 VDDQ6 VDDQ7 VDDQ8 VDDQ9
J10 K9 L9 M10 N9 C9 D10 E9 F10 G9
VREG_MSME_1.8V
+VPWR
2.2u 1608
REMOTE_PWR_ON
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 85 84 83 82 81
Check if it is LOW enable.
C
REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD 63 62 61 60 59 58 57 56 54 53 51 52 51 51K 50 49 51K 48 47 46 45 44 43 55
SDRAM_ADDR(0:12)
0.1u R303
C322 121K 1% BAT300 1u PM_INT_N TCXO_PM NBL414R-F9J C323 470K R304 PS_HOLD VREG_MSMA_2.6V
C324
10K 1005
C325
VSS0 VSS1 VSS2 VSS3 VSS4 VSS5
B9 C1 H9 J1 P9 M2
+5V_PWR ICHARGE CHG_CTL_N ICHARGEOUT VBATT BATT_FET_N RESIN_N C327 1u USB_OE_N C328 C329 C331 C330 C332 USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_DR309 2.2K 0.1u 12p
2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
ADC_BYP VCHG ISNS_P CHG_CTL_N ISNS_M VBAT BAT_FET_N FLSH_DRV_N PON_RESET_N VREG_USB USB_ID VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P
R305
4.7u C333 smd_1608h_9_r
RUIM_M_RST(MPP5)
RUIM_M_CLK(MPP9)
RUIM_M_IO(MPP11)
RUIM_CLK(MPP10)
C389
LCD LDO
0.1u
0.1u
SDRAM_DATA(0) SDRAM_DATA(1) SDRAM_DATA(2) SDRAM_DATA(3) SDRAM_DATA(4) SDRAM_DATA(5) SDRAM_DATA(6) SDRAM_DATA(7) SDRAM_DATA(8) SDRAM_DATA(9) SDRAM_DATA(10) SDRAM_DATA(11) SDRAM_DATA(12) SDRAM_DATA(13) SDRAM_DATA(14) SDRAM_DATA(15) SDRAM_DATA(16) SDRAM_DATA(17) SDRAM_DATA(18) SDRAM_DATA(19) SDRAM_DATA(20) SDRAM_DATA(21) SDRAM_DATA(22) SDRAM_DATA(23) SDRAM_DATA(24) SDRAM_DATA(25) SDRAM_DATA(26) SDRAM_DATA(27) SDRAM_DATA(28) SDRAM_DATA(29) SDRAM_DATA(30) SDRAM_DATA(31)
L4 L5 L6 L7 K8 L8 K7 K5 K6 G7 J6 J5 H6 H5 J4 G3 G4 F4 E4 F5 H3 H4 E6 F7 F6 D5 E8 D6 D8 D7 C8 C7
RUIM_IO(MPP12) VSW_PA
SDRAM_DQM(0) SDRAM_DQM(1) SDRAM_DQM(2) SDRAM_DQM(3) SDRAM_DATA(0:31)
0.01u
0.1u
J8 DQM0 G6 DQM1 F8 DQM2 E7 DQM3 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31
VDD0 VDD1 VDD2 VDD3 VDD4 VDD5
B8 D1 H1 H10 P8 M1
TCXO_EN VDD_ANA TCXO_OUT VDD_MSM SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT SLEEP_CLK XTAL_IN RUIM_RST(MPP6) VREG_RUIM VDD_RUIM
0.1uF
0.1uF
0.1uF
0.1uF
0.1uF
VREG_MSME_1.8V
R306 R307 R308
TCXO_EN +VPWR TCXO_MSM +VPWR VREG_MSMP_2.7V
C326 4.7u
smd_1608h_9_r
U300 PM6650-2M
VREG_MSMA
VREG_MSMP_2.7V
X300
SSBDT_PM TP308 SLEEP_CLK C337 C338 USIM_P_RST_N 4 1 MC-146_7pF 3 2
B5 VCC0 N5 VCC1 J7 H7 H8 B1 B2 B10 E5 F3 G1 G5 M3 M4 M7 N4 N7 N8 P1 P2 P3 P4 P5 P10
VREG_MSMP_2.7V
C335
USB_SE0 USB_D_M KPD_DRV_N GP1_DRV_N(MPP7) LCD_DRV_N KPDPWR_N VIB_DRV_N
C334
VREG_MSMC
VREG_MSME VSW_MSME
VSW_MSMC
C344
C343
NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21
VREG_MMC
VDD_MSMC
VDD_MSME
VREG_PA
C336 4.7u 1608
VDD_PA
32.768KHz
REV_D
12p +VPWR USIM_RST_N USIM_P_CLK USIM_CLK USIM_DATA VREG_USIM_2.85V VREG_MMC_3.0V
22
23
24
25
26
27
28
29
30
31 32
33
34
35
36
37
40
KYBD_BACKLIGHT PM_ON_SW_N MOTOR_PWRUSIM_P_DATA
41 42
38
39
12p
smd_2520h1_6_r
L300
L305 4.7uH VREG_RF_SMPS C435 22u C436 10u C433 0.1u C434 1000p
1608
1608
REV_B
4.7uH L301 smd_2520h1_6_r
C339 2.2u
C340 2.2u
C358 22u REV_E
4.7uH
4.7u
4.7u
Power Line --> Route carefully!!!!! Draw the Artwork_line thickly !!!!! --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-
DNU0 DNU1 DNU2 DNU3 DNU4 DNU5 DNU6
A2 A9 A10 R1 R2 R9 R10
1608
C341
1608
Artwork --> Place resistor and capacitor close to PM6650 !!

VREG_LCD_2.8V C345 1u VREG_MSMC_1.25V VREG_MSME_1.8V
MCP(512Mb NAND + 512Mb 1 piece SDRAM) MEMORY

C
+VPWR
U302 R1114D281D-TR-F 3 VDD VOUT 2 GND1 5 GND2
LCD_LDO_EN C346 1u
4 NC 6 CE
CAMERA LDO
+VPWR CAM_LDO_EN C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND PGND 9 ICHARGEOUT +VPWR SI3493DV-E3 Q301 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u VBATT R314 100K
D3 D4
CHARGER
R313 USB_VBUS 0.1 6 5 4
T-FLASH
D
S300 SCHA1A0100 GND
DAT2_RSV CD_DAT3_CS CMD_DI VDD CLK_SCLK VSS DAT0_DO
Q300
QST4
C1 1 2
C2
3 B
D1 D2
100K
VREG_MMC_3.0V 0
USB_CTL_N
USIM
MMC_CD MMC_CMD MMC_CLK
USIM_P_DATA
R317
15K +VPWR CAM_LDO_EN VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK C447 1u VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D
C1 1 smd_1005h_5_r smd_1005h_5_r 2 C2 3 B
D
+5V_PWR
VREG_CAM_DVDD_1.5V BATT_FET_N C350 1u 6 5 4
EVLC18S02003 VA300
5 6 7 8 9 10
J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12
GND3 GND4
R315
R316
Q302
QST4
CHG_CTL_N EVLC18S02003 VA302 EVL14K02200 VA301 ICHARGE
470K
VA305 EVLC18S02003
VA303 EVLC18S02003
VA304 EVLC18S02003
VA306 EVLC18S02003
DAT1_RSV
MMC_DATA
C351 0.1u
C352
C353
GND R318
L302 56nH
LCD BACKLIGHT
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT U305 +VPWR REV_B C355 1u WLED_PWR 8 CP C2EN_SET 6 5 IN AAT3157ITP-T1 10 C1+ 9 C17 C2+ C354 1u
33p
0.1u
Section
Date
Sign & Name
Sheet/ MODEL
C356 1u
Designer
WLED_1 WLED_2 WLED_3
MAR.07.2007
Jaykay
KU250 U250/KU250
Sheets
LCD_BL_CTRL R380 100K REV_C REV_B C357 1u
11
GND
1 D1 2 D2 3 D3 12 NC
3/4
Checked DRAWING
OJ300
OJ301
OJ302
OJ303
Approved
NAME
MEM & POWER

REV_1.0
LG Electronics Inc.
LGMC
LG Electronics Inc.
1 2 3 4 5 6 7 8 9
DRAWING NO.
LG(42)-A-5505-10:01
- 145 -
7. CIRCUIT DIAGRAM
10
11
12
13
14
15
16
LCD CONNECTOR
CN400 ICVE21184E150R500FR
9
VREG_MSMP_2.7V
2.2K MICBIAS R400 R401
I/O CONNECTOR
A
R403
A
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC
1 2 3 4
INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2
9 8 7 6
1M
10
LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N
7 6
INOUT_B2 INOUT_B3 INOUT_B4 G2
INOUT_A2 INOUT_A3 INOUT_A4 G1
3 4
C400 0.1u TP400 +VPWR L400 56nH D400 RB521S-30 5 MOTOR_PWRHOOK_KEY 1

OUT VCC GND
R402
ICVE21184E150R500FR
INOUT_B1
INOUT_A1
1 2
5.1K
VREG_MSMP_2.7V 51K 10K R404 100K 4 3

VIN-
CN401 HSEJ-18S04-25R
FL400
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 1 2 3 4
TP401 EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7)
FL401
ICVE21184E150R500FR
9 8 7 6 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2
10
VIN+
U400 NCS2200SQ2T2G
MIC2N MIC2P
C401 33u R406 100ohm
G1
HPH_L HPH_R
USB_D+ USB_D-
C402
33u
R407 100ohm
FL402
R408
INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4
B
19
20 18 17 16 15 14 13 12 11 10 9 8 7 6 5
ICVE21184E150R500FR
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 9 8 7 6
EAR_SENSE_N VBATT REMOTE_PWR_ON +5V_PWR

FL404 2 4 OUT G2 IN G1 REV_B 1 3
R409
G2
FL403
47n C403
680K
VBAT_SENSE 470K
USB_VBUS UART_TXD UART_RXD

CN402 EVLC18S02003 EVLC18S02003 EVL14K02200 EVL14K02200 EVL14K02200 1 2 3 4 C404 0.1uF VBAT
ICVE21184E150R500FR
10
NTS104B
21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22
10
R405
REV_B : Change Pin Description EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) VBAT_TEMP
EVL14K02200
C1005X7R1H471KT
EVL14K02200
EVL14K02200
EVL14K02200
SD12T1G
0.01u
1u
C432 470p
C
3
4 2 1 VA410 EVL14K02200
10
R410
C406
C407
C408
VA403
VA401
VA400
VA402
VA404
VA405
LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR
EVL14K02200
VBAT_GND
REV_1.0
VA409
PLW0501H-LF D402
0.1u
INSTPAR
C409
+VPWR
VA490
VA407
VA408
D401
80.6K
C405
FL405
VREG_MSMP_2.7V
47p
47p
LD400 LD403 LD406
LD402 LD405 LD408
CAMERA
E
REV_B : EDLH0013501 --> EDLH0006001
AUDIO MEGA CAMERA CONNECTOR

32 31 30 29 28 27 26 25 PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 REV_1.0 20 19 18 12 11 10 9 7 R436 0 CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK R437 20 EVL14K02200 +VPWR C410 0.01u SPKSPK_RCV-
SELECT_SPK&RCV
U401 NLAS5223BMNR2G
1 VCC 2 NO1 3 COM1 4 IN1 NC2 6 NC1 GND IN2 7 COM2 8 NO2 9 10
KYBD_BACKLIGHT
SPK+ SPK_RCV+ RCV_EN_N 10 R421 VA412 VREG_MSMP_2.7V RCV+ 2 4 6 8
VA414
R423
EVL14K02200
100K
CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7)
22 23 24 1 2 3 4 5
D0 D1 D2 D3 D4 D5 D6 D7
CN403
PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK
END
RCV-
R422
10
KEY MAP
100K
PM_ON_SW_N
END
F
RA400 1 3 5 7
DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD
8 15 21 6 17 13 14 16
CLR
MENU
REV_B KEY_ROW(0)
C411 C412
VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C414 C415 C448 C413 C449
400
401
2
402
3
LEFT
UP
0.1uF 1u
MIC
MICBIAS REV_B : SUMY0010301 --> SUMY0003802 REV_1.0 COMMON_CAM_MCLK MIC400 OB4-15L42-C33L 1 2 INSTPAR INSTPAR CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) C418 C419 2.2K 39p 39p 0.1u 0.1u MIC1P MIC1N R424 2.2K C416 10u C417 47p
10p
0.1u
10p
NA
NA
1 KEY_ROW(1)
403
4 KEY_ROW(2)
404
5
405
6
OK
RIGHT
C
406
7 KEY_ROW(3)
407
8
408
9
SND
SEARCH
ICVE21184E150R500FR CAM_DATA(0) CAM_DATA(1) CAM_DATA(2)

ICVE21184E150R500FR CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5)

HOT400
HOT4 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)
409
0
HOT401
HOT3
DN
BACK
C420
C421
10
10
FL406
FL407 ICVE21184E150R500FR CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC

D403 PSD05-LF
PSD05-LF
R425
CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT
REV_B : EDTY0008606 --> EDTY0008601
D404
Audio AMP
NCP2890DMR2
SPK_AMP_EN 1 REV_C : 20K --> 3K VGA_CAM_RESET_N I2C_SCL I2C_SDA LINE_N LINE_P R427 R429 1K 1K C4265600p C422 C423 C4275600p 0.1u 0.1u R428 5.6K R430 5.6K R431 20K C431 NA C425 10u R426 20K 2 _SD OUTB 8 SPK-
KEYS
FL408
VT_CAMERA_CONNECTOR
C424
10
VREG_CAM_AVDD_2.8V
3 INP 4 INM
7 BYPASSU402 VM 6 VP OUTA 5 C428 1u
+VPWR
E
SPK+ C429 C430
20 19 18 17 16
NA
GND8
GND7
P20 P19 P18 P17 P16
Section
Date MAR.07.2007
Sign & Name
Sheet/ MODEL
1000p 1000p
VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 CAM_PCLK CAM_DATA_OUT(0)
EVL14K02200
1 P1 2 P2 3 P3 4 P4 5 P5
GND1
GND6 GND5
CN404
15 P15 14 P14 13 P13 12 P12 11 P11

GND3 GND4
Designer
Jaykay
KU250 U250/KU250
KEY / MMI LCD/CAMERA REV_1.2
Sheets
CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6)
4/4
Checked DRAWING
6 P6 7 P7 8 P8 9 P9 10 P10
GND2
VA430
F
CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4)
L401 SPK_RCVL402 SPK_RCV+ CAM_DATA_OUT(5)
100nH 100nH
RCVN
Approved
RCVP
NAME
REV_E : For Antenna Radiation
LG Electronics Inc.
1 2 3 4 5 6 7 8 9
DRAWING NO.
LG(42)-A-5505-10:01
LGMC
LG Electronics Inc.
- 146 -
8. PCB LAYOUT
LGMC
- 147 -
U250/KU250
8. PCB LAYOUT
LGMC
- 148 -
U250/KU250
9. Calibration & RF Auto Test Program (Hot Kimchi)

9.1 Configuration of HOT KIMCHI
9.1.1 Configuration of directory
C: Cm_Grut Common dll_serialat Log At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_011.dll PwrSupply_Cmd.xml LG_CL_009.dll
Debug
Auto Cal
KU250 KU250 KU250
: Directory : File
CalAuto
- 149 -
Hot_Kimchi
Debug image Log ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll
Model
KU250 LG_RfTest_E5515C_211.dll QMSL_MSVC6R.dll
Log AutoSetup_110.xml Cal_Setup_Test.xml Ezlooks.xml

LG_RfCal_Q3G6280N_Polar_006.dll
Procedure_KU250_103.xml script_auto_001.xml : Directory : File script_cal_003.xml Spec_3GPP_030.xml
- 150 -
dll,ocx
(Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat
Result
Auto Cal CalAuto
KU250 KU250 KU250 result.bmp
UI
image LG_UI_Ad6500_002.dll LG_UI_EmKU250_001.dll
: Directory LG_UI_Qu6250_003.dll : File 1. _New_HK_0808.reg LG_UI_Qu6275_004.dll
- 151 -
9.2 How to use HOT KIMCHI
* Procedure 1. Click Logic Operation of SETTING menu bar 2. Select UART Port that PC can communicate with the phone 3. Select LOGIC MODE that you want - Logic Mode -> 1: Calibration Only
- 152 -
KU250
Click "Start"
Select "U250/KU250"
* Procedure 4. Select the model name U250/KU250 5. Click Start button
- 153 -
10. Factory Test Mode

10.1. Test Program Setting
1) Open LG FTM GUI 2) Click Options >> Port Settings 3) Select Com Port and click OK
- 154 -
10.2. WCDMA Test Mode

1) Click Tools >> FTM GUI WCDMA 2) Select FTM Mode 3) Select RF Frequencies, insert 9750 in Uplink chan and push Enter. Then 2140 is written at Rx UHF automatically. 4) For Deciding to TX AGC, insert 380 as a maximum value . And then WCDMA Power is decided. 5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode. 6) Depending on a situation, Click Tx On or Tx Off.
Channel Select
Tx Control
Rx Control
7) Set Rx mode. Click LNA Range, 0~4. 8) Click Get IM2 and Get Rx AGC. Confirm the value.
- 155 -
10.3. GSM Test Mode

1) To switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click GSM or GSM1800 or GSM1900 3) Write wanted channel. We usually set 1 4) For Deciding to PA DAC Value, insert 14300 as a maximum value 5) Click Tx On or Tx Off. 6) SET RX mode. Click LNA Range, 0~4. 7) Click RX ON
Channel Control
Tx Power Control
Rx Gain Control
- 156 -
11. EXPLODED VIEW & REPLACEMENT PART LIST

11.1 EXPLODED VIEW
32 31 28 29 30 35
20 19 17 15 16 13 12 8 5 4 3 2 1 6 7 18
22
36
34
33
24 25 23
26
27
37 14
10
11
- 157 -
- 158 -
11.2 Replacement Parts <Mechanic component>

Level 1 2 3 2 3 2 3 4 4 4 5 5 4 4 4 4 4 4 4 4 4 4 3 4 4 4 4 4 4 4 4 4 4 AAAY00 MCJA00 APAY00 BSEA00 APEY00 ACGK00 MCCC00 MCCG00 MCJK00 MICE00 MICE01 MFBC00 MFBZ00 MHGJ00 MKAZ00 MPBG00 MPBT00 MTAB00 MTAB01 MTAD00 Location No. Description IMT,BAR/FLIP ADDITION COVER,BATTERY PACKAGE SUPPLEMENTARY PART PHONE COVER ASSY,FRONT CAP,EARPHONE JACK CAP,MULTIMEDIA CARD COVER,FRONT INSERT,NUT INSERT,NUT FILTER,SPEAKER FILTER HOLDER,SPEAKER KEYPAD PAD,LCD PAD,CAMERA TAPE,PROTECTION TAPE,PROTECTION TAPE,WINDOW Part Number TIMT0000614 AAAY0219401 MCJA0040601 APAY0095904 BSEA0003901 APEY0394202 ACGK0085601 MCCC0043601 MCCG0007601 MCJK0069301 MICE0000601 MICE0000701 MFBC0029401 MFBZ0002801 MHGJ0001701 MKAZ0035901 MPBG0058301 MPBT0039101 MTAB0160501 MTAB0160601 MTAD0065801 MWAC0077201 ACGM0087501 ENZY0019701 MCCF0042501 MCJN0065501 MHGZ0028701 MLAB0001102 MLAN0000603 MPBH0029101 MPBN0039001 MPBZ0186001 MPBZ0186801
Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC
Spec
Color Black Black
Remark
MOLD, PC LUPOY SC-1004A, , , , , U250 HIT Packing(P/Label66-Angle-9501) PACKING-LIST ENVELOPE
Without Color Without Color
36
Black Without Color COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 1.2, , , , COMPLEX, (empty), 1.2, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.2, , , , COMPLEX, (empty), 1.0, , , , Without Color Without Color Without Color Without Color Without Color Without Color Without Color Black Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color 4 PIN,3.0 mm,ETC , ,H=5.8 COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , C2000 USASV DIA 4.0 White,95C COMPLEX, (empty), , , , , CUTTING, NS, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , Black Without Color Black White Transparent Black Black Without Color Without Color 26 18 19 25 24 29 28 22 27 6 9 7 11 12 8 1 13 3 2 10 4 5
MWAC00 WINDOW,LCD ACGM00 ENZY00 MCCF00 MCJN00 MHGZ00 MLAB00 MLAN00 MPBH00 MPBN00 MPBZ00 MPBZ01 COVER ASSY,REAR CONNECTOR,ETC CAP,MOBILE SWITCH COVER,REAR HOLDER LABEL,A/S LABEL,QUALCOMM PAD,MIKE PAD,SPEAKER PAD PAD
- 159 -
Level 4 4 4 4
Location No. MTAB01 MTAD00
Description TAPE,PROTECTION TAPE,WINDOW
Part Number MTAB0178301 MTAD0065901 MWAE0024501 SJMY0007903 COMPLEX, (empty), , , , ,
Spec
Color Without Color Without Color Without Color
Remark 32 30 31 23
COMPLEX, (empty), 0.2, , , , COMPLEX, (empty), 1.0, , , , 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , , 3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.6t, , , ,
MWAE00 WINDOW,CAMERA SJMY00 VIBRATOR,MOTOR
4 3 6 6 5 5 5
SNGF00 MLAA00 MCBA00 MPBZ00 ADCA00 MTAZ00 MLAZ00
ANTENNA,GSM,FIXED LABEL,APPROVAL CAN,SHIELD PAD DOME ASSY,METAL TAPE LABEL
SNGF0023102 MLAA0042001 MCBA0017101 MPBZ0179301 ADCA0064001 MTAZ0186301 MLAZ0038301
20 Without Color Without Color Without Color Without Color 16 14 34
COMPLEX, (empty), 0.1, , , , PID Label 4 Array
Without Color Without Color
- 160 -
11.2 Replacement Parts <Main component>

Level 3 3 4 5 5 5 Location No. GMEY00 SAFY00 SAFB00 ACKA00 SUMY00 SUSY00 Description SCREW MACHINE,BIND PCB ASSY,MAIN PCB ASSY,MAIN,INSERT CAN ASSY,SHIELD MICROPHONE SPEAKER Part Number GMEY0011201 SAFY0196602 SAFB0072901 ACKA0002101 SUMY0010301 SUSY0026801
Spec 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK
Color Without Color
Remark 33 15
Without Color FPCB ,-42 dB,4*1.5T ,Standard Holder ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T ,WIRE CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket Type CMOS ,VGA ,Socket type MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM ,NT3916(Novatek) ,NTSC:60%
17
5 5 5 4 5
SVCY00 SVCY01 SVLM00 SAFF00 SAFC00
CAMERA CAMERA LCD MODULE PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM ANTENNA,GSM,FIXED
SVCY0014401 SVCY0014301 SVLM0025001 SAFF0117802 SAFC0088501
ANT103
SNGF0026001
3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,2.0 ,50 ,3.0 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 3.3 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
BAT300 C101 C103 C104 C106 C107 C108 C109 C110 C112 C113 C114 C115 C117 C118 C119 C121 C122
BATTERY,CELL,LITHIUM CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP
SBCL0001701 ECZH0000841 ECCH0001002 ECCH0001002 ECZH0000846 ECCH0000107 ECCH0001002 ECZH0000830 ECZH0000830 ECZH0000816 ECCH0001002 ECCH0000149 ECCH0000143 ECCH0000110 ECZH0000816 ECCH0000115 ECTZ0005603 ECCH0000393
- 161 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C123 C124 C126 C127 C128 C129 C130 C131 C132 C134 C135 C136 C139 C140 C141 C142 C143 C144 C147 C149 C150 C151 C152 C153 C154 C155 C156 C157 C158 C159 C161 C162 C164 C165 C170 C171 C172
Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP
Part Number ECCH0000155 ECZH0000813 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000155 ECCH0000182 ECCH0000155 ECZH0000844 ECCH0000115 ECCH0000115 ECZH0000813 ECCH0000182 ECCH0000393 ECCH0000115 ECCH0000112 ECCH0000143 ECCH0000115 ECCH0000155 ECCH0000112 ECZH0000802 ECTH0002202 ECZH0000813 ELCH0001427 ECCH0000112 ECCH0000112 ECCH0000901 ECCH0000180 ECCH0000101 ECCH0000101 ECCH0000182 ECCH0000143 ECCH0004904
Spec 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4.7 uF,10V ,M ,STD ,1608 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 nH,S ,1005 ,R/TP ,Pb Free 15 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
- 162 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER
Part Number ECCH0000198 ECCH0000110 ECCH0000143 ECZH0004402 ECZH0000813 ECZH0000813 ECCH0005602 ECCH0000182 ECCH0000143 ECCH0000155 ECZH0000813 ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000115 ECCH0000101 ECZH0000813 ECCH0000122 ECCH0000122 ECZH0001211 ECZH0001211 ECCH0000110 ECTZ0004701 ECTH0003701 ECZH0004402 ECCH0000179 ECCH0000179 ECCH0000182 ECCH0000155 ECCH0000155 ECCH0000155 ECZH0004402 ECCH0000155 ECCH0000155 ECZH0004402 ECZH0004402 ECZH0004402
Spec 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
Color
Remark
- 163 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER
Part Number ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000155 ECCH0000155 ECCH0000155 ECZH0004402 ECZH0004402 ECCH0000147 ECCH0000143 ECCH0000143 ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000143 ECCH0000143 ECCH0000143 ECZH0004402 ECZH0004402 ECCH0000182 ECCH0000155 ECCH0000161 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0007801 ECCH0007801 ECCH0004904 ECCH0004904 ECCH0005602 ECZH0004402 ECZH0004402
Spec 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 2.2 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP
Color
Remark
- 164 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Description CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP
Part Number ECZH0004402 ECZH0004402 ECZH0004402 ECCH0000182 ECCH0004904 ECZH0000816 ECCH0000182 ECCH0006201 ECCH0004904 ECZH0004402 ECZH0004402 ECZH0004402 ECZH0004402 ECZH0004402 ECCH0006201 ECCH0000155 ECCH0000182 ECCH0007801 ECZH0000816 ECZH0000816 ECCH0005602 ECCH0005602 ECCH0006201 ECCH0000182 ECCH0000182 ECCH0004904 ECZH0001215 ECZH0001215 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000182 ECZH0000830 ECCH0000182 ECCH0004904 ECZH0001215 ECCH0004904
Spec 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP
Color
Remark
- 165 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP
Part Number ECZH0001215 ECCH0000393 ECCH0006201 ECCH0000182 ECTH0004402 ECTH0004402 ECCH0002002 ECZH0004402 ECCH0000155 ECZH0001215 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000155 ECZH0004402 ECCH0004904 ECCH0000110 ECCH0000182 ECCH0000110 ECTH0003701 ECCH0000122 ECCH0000182 ECCH0000182 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000182 ECTH0001902 ECCH0000152 ECCH0000152 ECZH0001215 ECCH0000143 ECCH0000143 ECZH0001121 ECCH0000182 ECCH0000143 ECTH0001903
Spec 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,10V ,M ,L_ESR ,1608 ,R/TP 5.6 nF,25V,K,X7R,HD,1005,R/TP 5.6 nF,25V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP
Color
Remark
- 166 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. C436 C437 C438 C439 C440 C441 C442 C443 C444 C445 C446 C447 C450 CN400 CN401 CN403 D400 D401 D402 D403 D404 FL101
Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CONNECTOR,FFC/FPC CONNECTOR,I/O CONN,SOCKET DIODE,SWITCHING DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS FILTER,SAW
Part Number ECCH0005604 ECZH0000802 ECZH0000813 ECZH0000806 ECZH0000806 ECCH0000185 ECCH0000185 ECCH0000185 ECCH0000901 ECCH0000901 ECTZ0005603 ECZH0001215 ECCH0000115 ENQY0010901 ENRY0006401 ENSY0020101 EDSY0011901 EDTY0007401 EDTY0008610 EDTY0008601 EDTY0008601 SFSY0030201
Spec 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 35 PIN,0.3 mm,ETC , ,H=1.2 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type 24 PIN,ETC , ,0.9 mm, EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SMD ,12 V,350 W,R/TP , SOD-523 ,5 V,250 W,R/TP ,PB-FREE SOD-323 ,6 V,400 W,R/TP ,PB-FREE SOD-323 ,6 V,400 W,R/TP ,PB-FREE 897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx 1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA 2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR 2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0, 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140 ,1.4*1.1*0.62 ,SMD ,R/TP 1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140 ,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,
Color
Remark
FL102
FILTER,SAW
SFSY0031101
FL103
FILTER,SAW
SFSY0031201
FL104
DUPLEXER,IMT
SDMY0001301
FL400
FILTER,EMI/POWER
SFEY0007103
FL401
FILTER,EMI/POWER
SFEY0007103
FL402
FILTER,EMI/POWER
SFEY0007103
6 6
FL403 FL404
FILTER,EMI/POWER FILTER,EMI/POWER
SFEY0007103 SFEY0006001
- 167 -
Level 6
Location No. FL405
Description FILTER,EMI/POWER
Part Number SFEY0007103
Spec SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM 100 nH,J ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP , 47 nH,J ,1005 ,R/TP ,COIL TYPE 18 nH,J ,1005 ,R/TP ,PBFREE 10 nH,S ,1005 ,R/TP ,PBFREE 47 nH,J ,1005 ,R/TP ,COIL TYPE 47 nH,J ,1005 ,R/TP ,COIL TYPE 1 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 12 nH,J ,1005 ,R/TP ,Pb Free 1.8 nH,S ,1005 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 56 nH,J ,1608 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 100 nH,J ,1005 ,R/TP , 100 nH,J ,1005 ,R/TP , 1.5 nH,S ,1005 ,R/TP ,PBFREE 1.8 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 10 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.5x3.2x1.2 Bluetooth RF Module TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680
Color
Remark
FL406
FILTER,EMI/POWER
SFEY0007103
FL407
FILTER,EMI/POWER
SFEY0007103
6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
FL408 J300 L102 L108 L111 L114 L115 L116 L119 L120 L121 L123 L125 L128 L300 L301 L302 L305 L400 L401 L402 L403 L404 L405 L406 L407 L408 L409 L410 L411 M100 Q300
FILTER,EMI/POWER CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP MODULE,ETC TR,BJT,PNP
SFEY0007103 ENSY0019201 ELCH0005009 ELCH0001031 ELCH0004718 ELCH0003813 ELCH0001032 ELCH0001041 ELCH0003813 ELCH0003813 ELCH0005020 ELCH0005020 ELCH0001410 ELCH0005010 ELCP0008001 ELCP0008001 ELCH0001550 ELCP0008001 ELCH0003825 ELCH0005009 ELCH0005009 ELCH0001033 ELCH0005010 ELCH0005002 ELCH0005002 ELCH0005002 ELCH0001041 ELCH0001035 ELCH0001035 ELCH0001035 SMZY0012601 EQBP0009901
- 168 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. Q301 Q302 R100 R101 R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 R123 R124 R128 R201 R202 R204 R205 R207 R208 R209 R211 R213
Description TR,FET,P-CHANNEL TR,BJT,PNP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER
Part Number EQFP0004701 EQBP0009901 ERHZ0000404 ERHZ0000404 ERHZ0000212 ERHZ0000310 ERHZ0003801 ERHZ0003801 ERHY0003301 ERHZ0000490 ERHZ0000402 ERHZ0000517 ERHZ0000517 ERHZ0000473 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHZ0000401 ERHZ0000490 ERHZ0000483 ERHZ0000415 ERHZ0000415 ERHZ0000401 ERHY0003301 ERHZ0000406 ERHZ0000222 ERHZ0000469 ERHZ0000493 ERHZ0000493 ERHZ0000490 ERHZ0000493 ERHZ0000493 ERHZ0000401 ERHZ0000437
Spec TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S) MOSFET, Pb free TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 12 Kohm,1/16W ,F ,1005 ,R/TP 680 ohm,1/16W ,F ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 39 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 150 Kohm,1/16W ,F ,1005 ,R/TP 36 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 2 Kohm,1/16W ,J ,1005 ,R/TP
Color
Remark
- 169 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. R214 R215 R300 R301 R302 R303 R304 R305 R306 R307 R308 R309 R313 R314 R315 R316 R317 R318 R380 R400 R401 R402 R403 R404 R405 R406 R407 R408 R409 R410 R421 R422 R424 R425 R426 R427 R428
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER
Part Number ERHZ0000443 ERHZ0000443 ERHZ0000493 ERHZ0000406 ERHZ0000406 ERHZ0004201 ERHZ0000487 ERHZ0000405 ERHZ0000490 ERHZ0000493 ERHZ0000493 ERHZ0000443 ERHY0008602 ERHZ0000401 ERHZ0000406 ERHZ0000406 ERHZ0000422 ERHZ0000487 ERHZ0000406 ERHZ0000443 ERHZ0000530 ERHZ0000407 ERHZ0000493 ERHZ0000405 ERHZ0000406 ERHY0003301 ERHY0003301 ERHZ0000288 ERHZ0000537 ERHZ0000318 ERHZ0000402 ERHZ0000402 ERHZ0000443 ERHZ0000443 ERHZ0000438 ERHZ0000404 ERHZ0000499
Spec 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 121000 ohm,1/16W ,F ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 0.1 ohm,1/4W ,J ,2012 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 5.1 Kohm,1/16W ,J ,1005 ,R/TP 1000 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,F ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 80.6 Kohm,1/16W ,F ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP
Color
Remark
- 170 -
Level 6 6 6 6 6 6 6 6 6
Location No. R429 R430 R431 R433 R434 R435 R436 R437 RA400
Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,ARRAY,R
Part Number ERHZ0000404 ERHZ0000499 ERHZ0000438 ERHY0013101 ERHY0013101 ERHZ0000487 ERHZ0000401 ERHZ0000435 ERNR0000404
Spec 1 Kohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 20 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1 mm,TRANS FLASH SOCKET / EXTERNAL MEMORY CARD SOCKET ,SMD ,0.4 dB, UMT5 ,.2 W,R/TP , QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF Transceiver, 8X8X0.9 QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~ 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD , SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free CSP ,409 PIN,R/TP ,WEDGE Baseband Platform BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree FBGA ,137 PIN,ETC ,512M(64Mx8) NAND+512M(16Mx32) SDRAM , ,IC,MCP SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version) SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER 900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006 HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 1.5V 18 V, ,SMD ,3pF, 1005 14 V, ,SMD ,120pF, 1005
Color
Remark
S300
CONN,SOCKET
ENSY0013501
6 6 6
SW100 TR100 U100
CONN,RF SWITCH TR,BJT,ARRAY IC
ENWY0003301 EQBA0000601 EUSY0300501
IC 6 6 6 6 6 6 6 6 6 U101 U102 U103 U104 U201 U300 U301 U302 U303 PAM COUPLER,RF DIRECTIONAL PAM IC IC IC IC IC IC
EUSY0300502 SMPY0014001 SCDY0003403 SMPY0014201 EUSY0073401 EUSY0318401 EUSY0306302 EUSY0332001 EUSY0232812 EUSY0319001
U305
IC
EUSY0238702
U400
IC
EUSY0250501
6 6 6
U401 U402 U500
IC IC FILTER,SEPERATOR
EUSY0300101 EUSY0176401 SFAY0007402
6 6 6
U501 VA300 VA301
IC VARISTOR VARISTOR
EUSY0223001 SEVY0004001 SEVY0004201
- 171 -
Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6
Location No. VA302 VA303 VA304 VA305 VA306 VA400 VA401 VA402 VA403 VA404 VA405 VA407 VA408 VA409 VA410 VA412 VA414 VA430 VA490 X100
Description VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VCTCXO
Part Number SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 EXSK0005703 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005
Spec
Color
Remark
19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM ,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,
6 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6
X300 SAFD00 CN404 LD400 LD402 LD403 LD404 LD405 LD406 LD407 LD408 R411 R413 R414 R415 R416
X-TAL PCB ASSY,MAIN,SMT TOP CONN,SOCKET DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP
EXXY0004601 SAFD0087801 ENSY0020001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301
Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP
- 172 -
Level 6 6 6 6 6
Location No. R417 R418 R419 R423 SPFY00
Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER PCB,MAIN
Part Number ERHY0003301 ERHY0003301 ERHY0003301 ERHZ0000406 SPFY0147601
Spec 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP FR-4 ,1.0 mm,BUILD-UP 8 ,
Color
Remark
- 173 -
11.3 Accessory
Level
Location No. SBPL00
Description
Part Number
Spec 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC ,50x34x55 , ,BLACK ,Innerpack ,Europe Label 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.20.3V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,
Color
Remark
BATTERY PACK,LI-ION
SBPL0090501
Black
35
SSAD00
ADAPTOR,AC-DC
SSAD0024501
ADAPTOR,AC-DC
SSAD0024502
ADAPTOR,AC-DC
SSAD0024503
ADAPTOR,AC-DC
SSAD0024504
- 174 -
Note
Note

En U250-Ku250 SVC Eng 0627 1.0

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En U250-Ku250 SVC Eng 0627 1.0

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Service Manual

Service Manual U250/KU250

Date: June, 2007 / Issue 1.0

3. TECHNICAL BRIEF ........................17

6. BLOCK DIAGRAM ........................134

10. Factory Test Mode .....................154 4. TROUBLE SHOOTING ...................73

11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 157

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices ATTENTION

2.2 Usable environment

2.3 Radio Performance

100k~880MHz 880M~915MHz 915M~1GHz

* In case of PCS : [A] -> 1850, [B] -> 1910

Item 30M ~ 1GHz MS allocated Channel 1G ~ 4GHz Radiated

Spurious Emission Idle Mode

30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz

Frequency Error Phase Error

0.1ppm 5(RMS) 20(PEAK)

400kHz 600 ~ 1800kHz 1800 ~ 3000kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

DCS & PCS Frequency offset 800kHz

2) Transmitter - WCDMA Mode

Inner Loop Power control in uplink

-0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5

-50dBm(3.84MHz) Qin/Qout : PCCH quality levels

Transmit OFF Power Transmit ON/OFF Time Mask

Change of TFC DTX : DPCH off (minimize interference between UE)

Power setting in uplink compressed Occupied Bandwidth(OBW)

3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M

Spectrum emission Mask -39-10*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M

Item Adjacent Channel Leakage Ratio(ACLR)

Spurious Emissions 14 (*: additional requirement)

Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm)

Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code

Transmit OFF Power transmission

3)Receiver - GSM Mode

4) Receiver - WCDMA Mode

2.4 Current Consumption

2.5 RSSI BAR

2.6 Battery BAR

2.7 Sound Pressure Level

[Fig 1.1] Block diagram of RF part

QUALCOMMs branded chipset that implements a Zero-IF radio architecture.

3.2 GSM Mode

[Table 1.1] Antenna Switch Module Control logic

[Fig 1.2] RTR6275 RX feature

3.2.2 GSM Transmitter

[Fig 1.3] GSM Transmitter matching

3.3 UMTS Mode

[Figure 1.4] RTR6275 IC functional block diagram

3.4 LO generation and distribution circuits

3.5 Off-chip RF Components

ACMD-7602 0.5p L125

PWR_DET R120 R121 47 130 7dB R122 130 C192 100p

[Figure 1.5] WCDMA PAM, Duplexer, Coupler

3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)

3.5.3 Front-End Module (U500 : D5011)

[Table 1.2] Front End Module control logic

3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)

[Figure 1.6] MSM6245 Interface

[Figure1.7] PM6650 Block Diagram

3dB(after 14slots transmission gap) 5MHz(99%) -35-15(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1(f-3.5)dBc@f=3.5~7.5MHz,1M