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type varistor physical effect grain boundary phenomena in semiconducting ceramicsy grain boundary phenomena in semiconducting ferroelectric ceramics self heating effects hopping condution in metal oxides self heating effects material n-doped ZnO n-doped BaTiO3 102...103 S/m spinells e.g. (Ni,Mn)3O4 10-2 S/m
PTC
NTC
glossary Thermistor: NTC: PTC: Varistor: thermally sensitive resistor negative temperature coefficient positive temperature coefficient variable resistor
[Schaumburg 1990]
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NTC
PTC
Varistor
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symbol varistor
U
[www.staratech.com]
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I IK UK UK U
IK
I = K U
geometry parameter K
nonlinearity coefficient
[Heywang 1984]
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RD CD
RP CP 2 RK
secondary phase
grain boundary
RD CD varistor
RP CP leakage current
leakage current RP, CP in parallel
grain- (RK) and grain boundary (varistor) (RD) resistance RD and CD in parallel RD and CD are voltage dependent
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e VO
Eg = 3,2 eV
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ZnO-grain
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microvaristor pair of grains grain boundary single barrier layer n charge carrier p concentrations acceptors 100 nm EC EF EV
[Heywang 1984 ]
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EC
EC
thermal activation
> 3 eV acceptors
EF EV
EF EV tunneling effect
100 nm
[Fasching 1994]
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Varistor Summary
varistor effect in doped ZnO-ceramic is related to grain boundary properties, ZnO-grains exhibit a high conductivity varistor effect only at grains exhibiting a direct contact varistor effect starts at a voltage of ~ 3,0 0,5 V / grain boundary grain boundary forms a potential barrier of 0,6 eV. time constants of several nanoseconds technical varistor systems: ZnO + Bi2O3 + MnO2 + Co3O4 + Sb2O3 + Cr2O3 + additional additives (up to 10 components to optimize secondary properties)
[Ein 1982 ]
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without varistor
varistor U
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Varistor
ZnO-varistors
Materials and Devices in Electrical Engineering
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symbol PTC
[www.atpsensor.com]
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104 PTC-behavior resistance increases several orders of magnitude 100 TB 200 temperature / C 300
TKR =
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barium vacancies
BaBa + 2e / + 1 O2 ( g ) 2
// VBa + BaO
oxygen vacancies
x OO
VO + 2e / +
1 O2 ( g ) 2
electroneutrality
// [e] + 2 VBa 2 VO + LaBa
acceptors
donors
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donor concentration
grain
[LaBa] 2[VBa]
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+ + - + + + + - + + + E -
~ exp
x
EB k T
x
Materials and Devices in Electrical Engineering Institut fr Werkstoffe der Elektrotechnik
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resistance R /
PTC
NTC
300
[Siemens]
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T > TC
grain boundary
-
EB
EB
TC 150
50
Materials and Devices in Electrical Engineering
250
Institut fr Werkstoffe der Elektrotechnik
T / C
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equivalent circuit
summary
grain boundary
Ps + + + + + + + + Ps -
PTCs consist of polycrystalline ferroelectric compounds, mostly metal-oxides like BaTiO3. The PTC-effect is based on the insulating grain boundary (schottkybarrier) and their interaction with the temperature dependent ferroelectric porperties. The negative grain boundary charge is compensated either by a space charge (paraelectric region high resistivity) or by a polarisation charge (ferroelectric region low resistivity).
Rgrain
Rgb
Rgrain
Cgrain
Cgb
Cgrain
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PTC Application
sensors
controller
heater
heat supply
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PTC Devices
overload protection
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[Zinke]
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I=
I IPTC
~ v
[Trnkler]
Pel = U I
Pth = A (T Tu )
v = flow speed A = PTC surface area Pel = electrical power U = voltage I = current Pth = thermal power = heat transfer coefficient T = temperature of PTC Tu = ambient temperature
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solid state
3p
3s 2p 2s
a0
a >> a0
a0 lattice parameter
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Even if the thermal energy of the charge carriers is not sufficient for the transport in the conduction band, some materials show an electric conductivity. The transport mechanism is called hopping conductivity because the charge carriers jump from one trap to another. The conductivity depends on the concentration and energetic level of the traps.
hopping condcutivity
[Heywang 1984]
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Semiconducting properties can result from valence exchange of the cations in the oxide. Charge transport through hopping-mechanism (valence exchange) elements valence states +3 +4 Ti V +2 +3 +4 +5 crystal lattice: typical compounds: A2+ B3+2 O2-4 Ni2+ Mn3+2 O2-4 (spinel) Mn2+ Cr +2 +3 +4 Mn +2 +3 +4 Fe +2 +3 +4 valence exchange hopping conduction Mn3+ Mn2+ Mn3+ Co +2 +3 Ni +2 +3 Cu +2 Zn +2
thermal activated
Materials and Devices in Electrical Engineering Institut fr Werkstoffe der Elektrotechnik
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potential energy W
gradient d(eU)/dx
potential energy W
gradient d(eU)/dx
EA
Fe2+ Fe3+
Fe3+ Fe3+
EA
Fe3+ Fe3+
Fe3+ Fe2+
place x
place x
For the hopping transport, an activation energy EA is required. For a valency exchange the thermal energy of the electron has to exceed the activation energy.
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In case of a light orbital overlapping the electrons interact with the phonons. The electrons polarize their surrounding, which results in a lattice distortion. The electron and the surrounding distortion field are called polaron. For an electron transport this state must be broken by thermal energy supplied to the electron.
[Maier 2000]
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mobility
q (1 c ) a2 0 kT E exp A kT
EA : 1-c : a: 0 :
q: T:
Einstein-relation:
q D k T
(T ) = ze0 n (T )
1 E exp A T kT
[Heywang 1984]
= q
(1
c T
E k
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conduction
mechanism
mobility [cm2/Vs]
EA [eV]
band
D ~ T-3/2
102 .. 104
large polaron
D ~ T-1/2
EA kT
100 .. 102
0,1
hopping
small polaron*
D ~ f (T ) e
10-4 .. 10-2
0,5
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symbol NTC
[www.shibako.co.kr]
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temperature
pure magnetit
B A eT
(Scm-1)
A,B h d2 R T
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temperature coefficient:
relative resistance
1 dR B = 2 R dT T
temperature
B R RN T TN
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PK = K A0 (T TU ) = Gth (T TU )
heat losses due to convection PK
I
U2 U I = = I 2 R(T ) = Gth (T TU ) R(T )
valid for T < 350 C (heat losses due to emission not considered)
U thermal equilibrium: Pel = PK T: TU : Gth : K : A0 : temperature of the NTC temperature of the environment heat conductivity heat transference number surface area of the NTC
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self heating
[Zinke 1982]
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th = c m
0 U
P
P: el. power (W) : time constant (s) U: environmental temperature (K) 0: final temperature (K) m: mass of the NTC (g) c: heat capacitance (Ws/gk) 0.7 Ws/gK for many NTC-materials
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[BetaTherm]
fast response time (< 1 s in liquids) 1%, 2%, 5%, 10% accuracy 1 mW/K losses (in air at 25 C) R25C=100, 1000 ... 1 M temperature coefficient 25C= - 3,68 ; B0/50C=3263 metallization: Ag, Au
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temperature range: -80 C ... 300 C long term operation up to 225 C metallization: Pt, Ir
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wo rk
ing line
time
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