Heat Sinks for Mobile & Embedded Intel CPUs • Suitable for Intel Core Duo, Core 2 Duo, Pentium M • Designed for Socket 479, Socket M, Socket P, Micro- FCBGA • Designed for airspeed environments ranging from 100 to 400 LFM • Generate exceptional cooling power • Possess low pressure drop characteristics • Forged from highly conductive aluminum • Lapped to achieve exceptional base surface finish and flatness • Overall height can be customized to any dimension between 0.2” to 1.1” • Plating options: Anodize (black/clear), Electroless Nickel • RoHS compliant