You are on page 1of 31

NA555, NE555, SA555, SE555

www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

PRECISION TIMERS
Check for Samples: NA555, NE555, SA555, SE555
1

FEATURES
Timing From Microseconds to Hours Astable or Monostable Operation
NA555...D OR P PACKAGE NE555...D, P, PS, OR PW PACKAGE SA555...D OR P PACKAGE SE555...D, JG, OR P PACKAGE (TOP VIEW)

Adjustable Duty Cycle TTL-Compatible Output Can Sink or Source up to 200 mA


SE555...FK PACKAGE (TOP VIEW)

GND TRIG OUT RESET

1 2 3 4

8 7 6 5

VCC DISCH THRES CONT

NC GND NC VCC NC
NC TRIG NC OUT NC
4 5 6 7 8 3 2 1 20 19 18 17 16 15 14 9 10 11 12 13

NC DISCH NC THRES NC

NC No internal connection

DESCRIPTION/ORDERING INFORMATION
These devices are precision timing circuits capable of producing accurate time delays or oscillation. In the time-delay or monostable mode of operation, the timed interval is controlled by a single external resistor and capacitor network. In the astable mode of operation, the frequency and duty cycle can be controlled independently with two external resistors and a single external capacitor. The threshold and trigger levels normally are two-thirds and one-third, respectively, of VCC. These levels can be altered by use of the control-voltage terminal. When the trigger input falls below the trigger level, the flip-flop is set, and the output goes high. If the trigger input is above the trigger level and the threshold input is above the threshold level, the flip-flop is reset and the output is low. The reset (RESET) input can override all other inputs and can be used to initiate a new timing cycle. When RESET goes low, the flip-flop is reset, and the output goes low. When the output is low, a low-impedance path is provided between discharge (DISCH) and ground. The output circuit is capable of sinking or sourcing current up to 200 mA. Operation is specified for supplies of 5 V to 15 V. With a 5-V supply, output levels are compatible with TTL inputs.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

NC RESET NC CONT NC
Copyright 19732010, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

ORDERING INFORMATION (1)


TA VTHRES MAX VCC = 15 V PDIP P SOIC D 0C to 70C 11.2 V SOP PS TSSOP PW PDIP P 40C to 85C 11.2 V SOIC D PDIP P 40C to 105C 11.2 V SOIC D PDIP P 55C to 125C 10.6 SOIC D CDIP JG LCCC FK (1) (2) PACKAGE (2) Tube of 50 Tube of 75 Reel of 2500 Reel of 2000 Tube of 150 Reel of 2000 Tube of 50 Tube of 75 Reel of 2000 Tube of 50 Tube of 75 Reel of 2000 Tube of 50 Tube of 75 Reel of 2500 Tube of 50 Tube of 55 ORDERABLE PART NUMBER NE555P NE555D NE555DR NE555PSR NE555PW NE555PWR SA555P SA555D SA555DR NA555P NA555D NA555DR SE555P SE555D SE555DR SE555JG SE555FK TOP-SIDE MARKING NE555P NE555 N555 N555 SA555P SA555 NA555P NA555 SE555P SE555D SE555JG SE555FK

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Table 1. FUNCTION TABLE


RESET Low High High High (1) TRIGGER VOLTAGE (1) Irrelevant <1/3 VCC >1/3 VCC >1/3 VCC THRESHOLD VOLTAGE (1) Irrelevant Irrelevant >2/3 VCC <2/3 VCC OUTPUT Low High Low DISCHARGE SWITCH On Off On

As previously established

Voltage levels shown are nominal.

Submit Documentation Feedback

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

FUNCTIONAL BLOCK DIAGRAM


CONT 5

6 THRES

2 TRIG

1 GND A. B. Pin numbers shown are for the D, JG, P, PS, and PW packages. RESET can override TRIG, which can override THRES.

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555


R1 R S 1

VCC 8

RESET 4

3 OUT

DISCH

Submit Documentation Feedback

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

Absolute Maximum Ratings (1)


over operating free-air temperature range (unless otherwise noted)
MIN VCC VI IO Supply voltage (2) Input voltage Output current D package qJA Package thermal impedance (3)
(4)

MAX 18 VCC 225 97 85 95 149 5.61 14.5 150 260 300

UNIT V V mA

CONT, RESET, THRES, TRIG

P package PS package PW package FK package JG package FK package JG package 65

C/W

qJC TJ

Package thermal impedance (5)

(6)

C/W C C C C

Operating virtual junction temperature Case temperature for 60 s Lead temperature 1, 6 mm (1/16 in) from case for 60 s

Tstg (1) (2) (3) (4) (5) (6)

Storage temperature range

150

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values are with respect to GND. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/qJA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case temperature is PD = (TJ(max) - TC)/qJC. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with MIL-STD-883.

Recommended Operating Conditions


over operating free-air temperature range (unless otherwise noted)
MIN VCC VI IO Supply voltage Input voltage Output current NA555 TA Operating free-air temperature NE555 SA555 SE555 40 0 40 55 NA555, NE555, SA555 SE555 CONT, RESET, THRES, and TRIG 4.5 4.5 MAX 16 18 VCC 200 105 70 85 125 C UNIT V V mA

Submit Documentation Feedback

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

Electrical Characteristics
VCC = 5 V to 15 V, TA = 25C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN THRES voltage level THRES current (1) VCC = 15 V TRIG voltage level VCC = 5 V TRIG current RESET voltage level RESET current DISCH switch off-state current VCC = 15 V CONT voltage (open circuit) VCC = 5 V VCC = 15 V, IOL = 10 mA VCC = 15 V, IOL = 50 mA VCC = 15 V, IOL = 100 mA VCC = 15 V, IOL = 200 mA VCC = 5 V, IOL = 3.5 mA VCC = 5 V, IOL = 5 mA VCC = 5 V, IOL = 8 mA VCC = 15 V, IOL = 100 mA High-level output voltage VCC = 15 V, IOH = 200 mA VCC = 5 V, IOL = 100 mA Output low, No load Supply current Output high, No load (1) 3 TA = 55C to 125C VCC = 15 V VCC = 5 V VCC = 15 V VCC = 5 V 2 10 3 9 2 12 5 10 4 10 3 9 2 15 6 13 5 mA 13 TA = 55C to 125C 12 12.5 3.3 2.75 12.5 3.3 V TA = 55C to 125C 0.1 TA = 55C to 125C 0.15 13.3 9.6 TA = 55C to 125C TA = 55C to 125C TA = 55C to 125C 0.4 TA = 55C to 125C 2 TA = 55C to 125C 2.5 0.35 0.2 0.8 0.25 12.75 0.15 13.3 0.4 0.1 0.35 9.6 2.9 2.9 0.1 3.3 TRIG at 0 V 0.3 TA = 55C to 125C RESET at VCC RESET at 0 V 0.1 0.4 20 10 4.8 TA = 55C to 125C TA = 55C to 125C 0.5 0.7 3 1.45 1.67 VCC = 15 V VCC = 5 V 9.4 2.7 SE555 TYP 10 3.3 30 5 MAX 10.6 4 250 5.2 6 1.9 1.9 0.9 1 1.1 0.4 1 100 10.4 10.4 3.8 3.8 0.15 0.2 0.5 1 2.2 2.7 2.5 2 2.5 V 0.4 0.75 0.1 0.25 2.6 3.3 4 9 0.1 0.4 20 10 0.4 1.5 100 11 V 0.3 0.5 0.7 2 1 mA V mA nA 1.1 1.67 2.2 4.5 MIN 8.8 2.4 NA555 NE555 SA555 TYP 10 3.3 30 5 MAX 11.2 4.2 250 5.6 V V nA UNIT

Low-level output voltage

This parameter influences the maximum value of the timing resistors RA and RB in the circuit of Figure 12. For example, when VCC = 5 V, the maximum value is R = RA + RB 3.4 M, and for VCC = 15 V, the maximum value is 10 M.

Copyright 19732010, Texas Instruments Incorporated

Submit Documentation Feedback

Product Folder Link(s): NA555 NE555 SA555 SE555

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

Operating Characteristics
VCC = 5 V to 15 V, TA = 25C (unless otherwise noted)
PARAMETER
(3)

TEST CONDITIONS (1) MIN TA = 25C TA = MIN to MAX TA = 25C CL = 15 pF, TA = 25C CL = 15 pF, TA = 25C

SE555 TYP 0.5 1.5 30 90 0.05 0.15 100 100 200 (4) 200 (4) 0.2 (4) 100 (4) MAX 1.5
(4)

NA555 NE555 SA555 MIN TYP 1 2.25 50 150 0.1 0.3 100 100 300 300 0.5 MAX 3

UNIT

Initial error of timing interval (2) Temperature coefficient of timing interval

Each timer, monostable Each timer, astable (5)

% ppm/ C %/V ns ns

Each timer, monostable (3) Each timer, astable


(5)

(3) Supply-voltage sensitivity of Each timer, monostable (5) timing interval Each timer, astable

Output-pulse rise time Output-pulse fall time (1) (2) (3) (4) (5)

For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. Timing interval error is defined as the difference between the measured value and the average value of a random sample from each process run. Values specified are for a device in a monostable circuit similar to Figure 9, with the following component values: RA = 2 k to 100 k, C = 0.1 mF. On products compliant to MIL-PRF-38535, this parameter is not production tested. Values specified are for a device in an astable circuit similar to Figure 12, with the following component values: RA = 1 k to 100 k, C = 0.1 mF.

Submit Documentation Feedback

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

TYPICAL CHARACTERISTICS
Data for temperatures below 0C and above 70C are applicable for SE555 circuits only. LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT

10 7 VOL Low-Level Output Voltage V 4 2 1 0.7 0.4 0.2 0.1 0.07 0.04 0.02 0.01

VCC = 5 V

10 7 VOL Low-Level Output Voltage V 4 2 1 0.7 0.4 0.2 0.1 0.07 0.04 0.02 0.01

TA = 55C

TA = 25C

TA = 125C

10

20

40

70 100

IOL Low-Level Output Current mA Figure 1.

10 7 VOL Low-Level Output Voltage V 4 2 1 0.7 0.4 0.2

VCC = 15 V

2.0 1.8 TA = 55C ( VCC VOH) Voltage Drop V 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2

TA = 25C TA = 125C

0.1 0.07 0.04 0.02 0.01 1 2 4 7 10 20 40 70 100

IOL Low-Level Output Current mA Figure 3.

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

VCC = 5 V to 15 V

LOW-LEVEL OUTPUT VOLTAGE vs LOW-LEVEL OUTPUT CURRENT

DROP BETWEEN SUPPLY VOLTAGE AND OUTPUT vs HIGH-LEVEL OUTPUT CURRENT


TA = 55C


VCC = 10 V TA = 25C TA= 55C TA = 125C 2 4 7 10 Figure 2. TA = 25C TA = 125C Figure 4.

20

40

70 100

IOL Low-Level Output Current mA

2 4 7 10 20 40 70 100 IOH High-Level Output Current mA

Submit Documentation Feedback

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

TYPICAL CHARACTERISTICS (continued)


Data for temperatures below 0C and above 70C are applicable for SE555 circuits only. SUPPLY CURRENT vs SUPPLY VOLTAGE
10 9 8 I CC Supply Current mA TA = 25C 7 6 5 TA = 55C 4 3 2 1 0 5 6 7 8 9 10 11 12 13 14 15 VCC Supply Voltage V Figure 5. TA = 125C Pulse Duration Relative to Value at VCC = 10 V Output Low, No Load 1.015

NORMALIZED OUTPUT PULSE DURATION (MONOSTABLE OPERATION) vs SUPPLY VOLTAGE

1.010

1.005

0.995

0.990

0.985 0 5 10 15 20 VCC Supply Voltage V Figure 6.

NORMALIZED OUTPUT PULSE DURATION (MONOSTABLE OPERATION) vs FREE-AIR TEMPERATURE


1.015 Pulse Duration Relative to Value at TA = 255C VCC = 10 V
t PD Propagation Delay Time ns
1000 900

PROPAGATION DELAY TIME vs LOWEST VOLTAGE LEVEL OF TRIGGER PULSE

TA = 125 C

1.010

800 700 TA = 70 C 600 500 TA = 25 C 400 300 TA = 0 C 200 TA = 55 C 100 0

1.005

0.995

0.990

0.985 75

50

25

25

50

75

100 125

TA Free-Air Temperature C Figure 7.

0.05 0.1 0.15 0.2 0.25 0.3 0.35 Lowest Level of Trigger Pulse VCC

0.4

Figure 8.

Submit Documentation Feedback

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

APPLICATION INFORMATION Monostable Operation


For monostable operation, any of these timers can be connected as shown in Figure 9. If the output is low, application of a negative-going pulse to the trigger (TRIG) sets the flip-flop (Q goes low), drives the output high, and turns off Q1. Capacitor C then is charged through RA until the voltage across the capacitor reaches the threshold voltage of the threshold (THRES) input. If TRIG has returned to a high level, the output of the threshold comparator resets the flip-flop (Q goes high), drives the output low, and discharges C through Q1.
VCC (5 V to 15 V)

RA

4 7 6 Input 2

Pin numbers shown are for the D, JG, P, PS, and PW packages.

Figure 9. Circuit for Monostable Operation Monostable operation is initiated when TRIG voltage falls below the trigger threshold. Once initiated, the sequence ends only if TRIG is high for at least 10 s before the end of the timing interval. When the trigger is grounded, the comparator storage time can be as long as 10 s, which limits the minimum monostable pulse width to 10 s. Because of the threshold level and saturation voltage of Q1, the output pulse duration is approximately tw = 1.1RAC. Figure 11 is a plot of the time constant for various values of RA and C. The threshold levels and charge rates both are directly proportional to the supply voltage, VCC. The timing interval is, therefore, independent of the supply voltage, so long as the supply voltage is constant during the time interval. Applying a negative-going trigger pulse simultaneously to RESET and TRIG during the timing interval discharges C and reinitiates the cycle, commencing on the positive edge of the reset pulse. The output is held low as long as the reset pulse is low. To prevent false triggering, when RESET is not used, it should be connected to VCC.

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555

5 CONT RESET DISCH

8 VCC RL

OUT THRES TRIG GND 1

Output

Submit Documentation Feedback

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

tw Output Pulse Duration s

Voltage 2 V/div

Figure 10. Typical Monostable Waveforms

Astable Operation
As shown in Figure 12, adding a second resistor, RB, to the circuit of Figure 9 and connecting the trigger input to the threshold input causes the timer to self-trigger and run as a multivibrator. The capacitor C charges through RA and RB and then discharges through RB only. Therefore, the duty cycle is controlled by the values of RA and RB. This astable connection results in capacitor C charging and discharging between the threshold-voltage level (0.67 VCC) and the trigger-voltage level (0.33 VCC). As in the monostable circuit, charge and discharge times (and, therefore, the frequency and duty cycle) are independent of the supply voltage.
VCC (5 V to 15 V) 0.01 F Voltage 1 V/div Open (see Note A) 5 CONT 4 RESET 7 DISCH 6 2 C

RA

8 VCC

RL 3

RB

OUT

Output

THRES TRIG GND 1

t H

tL

Pin numbers shown are for the D, JG, P, PS, and PW packages. NOTE A: Decoupling CONT voltage to ground with a capacitor can improve operation. This should be evaluated for individual applications.

Figure 12. Circuit for Astable Operation

Figure 13. Typical Astable Waveforms

10

Submit Documentation Feedback

Product Folder Link(s): NA555 NE555 SA555 SE555


RA = 9.1 k CL = 0.01 F RL = 1 k See Figure 9

www.ti.com

10 RA = 10 M 1

RA = 1 M

101

Input Voltage

102

103 RA = 100 k 104 RA = 10 k RA = 1 k 105 0.001 0.01 0.1 1 10 100 C Capacitance F

Output Voltage

Capacitor Voltage

Time 0.1 ms/div

Figure 11. Output Pulse Duration vs Capacitance

RA = 5 kW RB = 3 kW C = 0.15 F

RL = 1 kW See Figure 12

Output Voltage

Capacitor Voltage Time 0.5 ms/div

Copyright 19732010, Texas Instruments Incorporated

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

Figure 12 shows typical waveforms generated during astable operation. The output high-level duration tH and low-level duration tL can be calculated as follows: 100 k t + 0.693 (R ) R C H A B) RA + 2 RB = 1 k t + 0.693 (R C RA + 2 RB = 10 k L B) Other useful relationships are shown below. period + t ) t + 0.693 (R ) 2R ) C H L A B 1.44 frequency [ (R ) 2R ) C A B Output driver duty cycle + L B + t )t R ) 2R H L A B t R
f Free-Running Frequency Hz 10 k RA + 2 RB = 100 k 1k

100

10

Output waveform duty cycle t R H + 1 B + t )t R ) 2R H L A B t R B Low-to-high ratio + L + t R )R H A B Figure .

RA + 2 RB = 1 M RA + 2 RB = 10 M

0.1 0.001

0.01

0.1

10

100

C Capacitance F

Figure 14. Free-Running Frequency

Missing-Pulse Detector
The circuit shown in Figure 15 can be used to detect a missing pulse or abnormally long spacing between consecutive pulses in a train of pulses. The timing interval of the monostable circuit is retriggered continuously by the input pulse train as long as the pulse spacing is less than the timing interval. A longer pulse spacing, missing pulse, or terminated pulse train permits the timing interval to be completed, thereby generating an output pulse as shown in Figure 16.
VCC (5 V to 15 V)

Input 2

4 RESET TRIG

8 VCC OUT

RL 3

DISCH 5 0.01 F CONT GND 1

THRES

A5T3644

Pin numbers shown are shown for the D, JG, P, PS, and PW packages.

Figure 15. Circuit for Missing-Pulse Detector

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555


RA VCC = 5 V RA = 1 k C = 0.1 F See Figure 15 Voltage 2 V/div Output Input Voltage C Output Voltage Capacitor Voltage Time 0.1 ms/div

Figure 16. Completed Timing Waveforms for Missing-Pulse Detector

Submit Documentation Feedback

11

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

Frequency Divider
By adjusting the length of the timing cycle, the basic circuit of Figure 9 can be made to operate as a frequency divider. Figure 17 shows a divide-by-three circuit that makes use of the fact that retriggering cannot occur during the timing cycle.

Voltage 2 V/div

Figure 17. Divide-by-Three Circuit Waveforms

12

Submit Documentation Feedback

Product Folder Link(s): NA555 NE555 SA555 SE555


VCC = 5 V RA = 1250 C = 0.02 F See Figure 9

Input Voltage

Output Voltage

Capacitor Voltage Time 0.1 ms/div

Copyright 19732010, Texas Instruments Incorporated

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

Pulse-Width Modulation
The operation of the timer can be modified by modulating the internal threshold and trigger voltages, which is accomplished by applying an external voltage (or current) to CONT. Figure 18 shows a circuit for pulse-width modulation. A continuous input pulse train triggers the monostable circuit, and a control signal modulates the threshold voltage. Figure 19 shows the resulting output pulse-width modulation. While a sine-wave modulation signal is shown, any wave shape could be used.
VCC (5 V to 15 V)

4 RESET Clock Input 2 TRIG

8 VCC OUT 3

RL

RA

Output 7

DISCH Modulation 5 Input (see Note A) CONT THRES GND 1 C 6

Pin numbers shown are for the D, JG, P, PS, and PW packages. NOTE A: The modulating signal can be direct or capacitively coupled to CONT. For direct coupling, the effects of modulation source voltage and impedance on the bias of the timer should be considered.

Figure 18. Circuit for Pulse-Width Modulation

Figure 19. Pulse-Width-Modulation Waveforms

Copyright 19732010, Texas Instruments Incorporated

Product Folder Link(s): NA555 NE555 SA555 SE555


RA = 3 k C = 0.02 F RL = 1 k See Figure 18 Modulation Input Voltage Clock Input Voltage Output Voltage Capacitor Voltage Time 0.5 ms/div Submit Documentation Feedback

Voltage 2 V/div

13

NA555, NE555, SA555, SE555


SLFS022H SEPTEMBER 1973 REVISED JUNE 2010 www.ti.com

Pulse-Position Modulation
As shown in Figure 20, any of these timers can be used as a pulse-position modulator. This application modulates the threshold voltage and, thereby, the time delay, of a free-running oscillator. Figure 21 shows a triangular-wave modulation signal for such a circuit; however, any wave shape could be used.
VCC (5 V to 15 V)

4 RESET 2 TRIG

8 VCC OUT

RL 3

RA Output Voltage 2 V/div

DISCH Modulation Input 5 (see Note A) CONT GND THRES

7 RB

C Pin numbers shown are for the D, JG, P, PS, and PW packages. NOTE A: The modulating signal can be direct or capacitively coupled to CONT. For direct coupling, the effects of modulation source voltage and impedance on the bias of the timer should be considered.

Figure 20. Circuit for Pulse-Position Modulation

Figure 21. Pulse-Position-Modulation Waveforms

14

Submit Documentation Feedback

Product Folder Link(s): NA555 NE555 SA555 SE555


RA = 3 k RB = 500 RL = 1 k See Figure 20 Modulation Input Voltage Output Voltage Capacitor Voltage Time 0.1 ms/div

Copyright 19732010, Texas Instruments Incorporated

NA555, NE555, SA555, SE555


www.ti.com SLFS022H SEPTEMBER 1973 REVISED JUNE 2010

Sequential Timer
Many applications, such as computers, require signals for initializing conditions during start-up. Other applications, such as test equipment, require activation of test signals in sequence. These timing circuits can be connected to provide such sequential control. The timers can be used in various combinations of astable or monostable circuit connections, with or without modulation, for extremely flexible waveform control. Figure 22 shows a sequencer circuit with possible applications in many systems, and Figure 23 shows the output waveforms.
VCC

4 RESET 2 S 5 CONT TRIG

8 VCC 3 OUT DISCH 7

RA 33 k 2 0.001 F 5

4 RESET TRIG

8 VCC 3 OUT DISCH 7

RB

33 k 2 0.001 F 5

4 RESET TRIG

8 VCC 3 OUT DISCH 7 6

RC

0.01 F

6 THRES GND 1 CA

CONT

0.01 F Output A

THRES GND 1 CB

CONT

0.01 F

THRES GND 1 CC

CA = 10 F RA = 100 k

CB = 4.7 F RB = 100 k

Output B

CC = 14.7 F RC = 100 k

Output C

Pin numbers shown are for the D, JG, P, PS, and PW packages. NOTE A: S closes momentarily at t = 0.

Copyright 19732010, Texas Instruments Incorporated


See Figure 22 Output A twA twA = 1.1 RACA twB Output B twB = 1.1 RBCB Output C twC twC = 1.1 RCCC t=0 t Time 1 s/div

Figure 22. Sequential Timer Circuit

Voltage 5 V/div

Figure 23. Sequential Timer Waveforms

Submit Documentation Feedback

15

Product Folder Link(s): NA555 NE555 SA555 SE555

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jan-2012

PACKAGING INFORMATION
Orderable Device JM38510/10901BPA M38510/10901BPA NA555D NA555DG4 NA555DR NA555DRG4 NA555P NA555PE4 NE555D NE555DE4 NE555DG4 NE555DR NE555DRE4 NE555DRG3 NE555DRG4 NE555P NE555PE4 NE555PSLE NE555PSR NE555PSRE4 Status
(1)

Package Type Package Drawing CDIP CDIP SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SO SO SO JG JG D D D D P P D D D D D D D P P PS PS PS

Pins 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8 8

Package Qty 1 1 75 75 2500 2500 50 50 75 75 75 2500 2500 2500 2500 50 50 2000 2000

Eco Plan TBD TBD

(2)

Lead/ Ball Finish A42 A42

MSL Peak Temp N / A for Pkg Type N / A for Pkg Type

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE PREVIEW ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU SN Level-1-260C-UNLIM

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type Call TI Call TI CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jan-2012

Orderable Device NE555PSRG4 NE555PW NE555PWE4 NE555PWG4 NE555PWR NE555PWRE4 NE555PWRG4 NE555Y SA555D SA555DE4 SA555DG4 SA555DR SA555DRE4 SA555DRG4 SA555P SA555PE4 SE555D SE555DG4 SE555DR SE555DRG4

Status

(1)

Package Type Package Drawing SO TSSOP TSSOP TSSOP TSSOP TSSOP TSSOP PS PW PW PW PW PW PW

Pins 8 8 8 8 8 8 8 0

Package Qty 2000 150 150 150 2000 2000 2000

Eco Plan

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE ACTIVE

Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Green (RoHS & no Sb/Br) Pb-Free (RoHS) Pb-Free (RoHS) TBD Green (RoHS & no Sb/Br) TBD Green (RoHS & no Sb/Br)

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM Call TI Call TI

SOIC SOIC SOIC SOIC SOIC SOIC PDIP PDIP SOIC SOIC SOIC SOIC

D D D D D D P P D D D D

8 8 8 8 8 8 8 8 8 8 8 8

75 75 75 2500 2500 2500 50 50 75 75 2500 2500

CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU N / A for Pkg Type CU NIPDAU N / A for Pkg Type CU NIPDAU Level-1-220C-UNLIM CU NIPDAU Level-1-260C-UNLIM CU NIPDAU Level-1-220C-UNLIM CU NIPDAU Level-1-260C-UNLIM

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jan-2012

Orderable Device SE555FKB SE555JG SE555JGB SE555N SE555P


(1)

Status

(1)

Package Type Package Drawing LCCC CDIP CDIP PDIP PDIP FK JG JG N P

Pins 20 8 8 8 8

Package Qty 1 1 1 50

Eco Plan TBD TBD TBD TBD

(2)

Lead/ Ball Finish

MSL Peak Temp

(3)

Samples (Requires Login)

ACTIVE ACTIVE ACTIVE OBSOLETE ACTIVE

POST-PLATE N / A for Pkg Type A42 A42 Call TI N / A for Pkg Type N / A for Pkg Type Call TI

Pb-Free (RoHS)

CU NIPDAU N / A for Pkg Type

The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SE555, SE555M :

Catalog: SE555 Military: SE555M

Addendum-Page 3

PACKAGE OPTION ADDENDUM

www.ti.com

25-Jan-2012

Space: SE555-SP, SE555-SP


NOTE: Qualified Version Definitions:

Catalog - TI's standard catalog product Military - QML certified for Military and Defense Applications Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application

Addendum-Page 4

PACKAGE MATERIALS INFORMATION


www.ti.com 22-Oct-2011

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins Type Drawing SOIC SOIC SO TSSOP SOIC D D PS PW D 8 8 8 8 8

SPQ

Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 330.0 330.0 330.0 330.0 12.4 12.4 16.4 12.4 12.4 6.4 6.4 8.2 7.0 6.4

B0 (mm) 5.2 5.2 6.6 3.6 5.2

K0 (mm) 2.1 2.1 2.5 1.6 2.1

P1 (mm) 8.0 8.0 12.0 8.0 8.0

W Pin1 (mm) Quadrant 12.0 12.0 16.0 12.0 12.0 Q1 Q1 Q1 Q1 Q1

NA555DR NE555DRG4 NE555PSR NE555PWR SE555DR

2500 2500 2000 2000 2500

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION


www.ti.com 22-Oct-2011

*All dimensions are nominal

Device NA555DR NE555DRG4 NE555PSR NE555PWR SE555DR

Package Type SOIC SOIC SO TSSOP SOIC

Package Drawing D D PS PW D

Pins 8 8 8 8 8

SPQ 2500 2500 2000 2000 2500

Length (mm) 346.0 346.0 346.0 346.0 346.0

Width (mm) 346.0 346.0 346.0 346.0 346.0

Height (mm) 29.0 29.0 33.0 29.0 29.0

Pack Materials-Page 2

MECHANICAL DATA
MCER001A JANUARY 1995 REVISED JANUARY 1997

JG (R-GDIP-T8)
0.400 (10,16) 0.355 (9,00) 8 5

CERAMIC DUAL-IN-LINE

0.280 (7,11) 0.245 (6,22)

4 0.065 (1,65) 0.045 (1,14)

0.063 (1,60) 0.015 (0,38)

0.020 (0,51) MIN

0.310 (7,87) 0.290 (7,37)

0.200 (5,08) MAX Seating Plane 0.130 (3,30) MIN

0.023 (0,58) 0.015 (0,38) 0.100 (2,54) 0.014 (0,36) 0.008 (0,20)

015

4040107/C 08/96 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. Falls within MIL STD 1835 GDIP1-T8

POST OFFICE BOX 655303

DALLAS, TEXAS 75265

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Audio Amplifiers Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Mobile Processors Wireless Connectivity www.ti.com/audio amplifier.ti.com dataconverter.ti.com www.dlp.com dsp.ti.com www.ti.com/clocks interface.ti.com logic.ti.com power.ti.com microcontroller.ti.com www.ti-rfid.com www.ti.com/omap www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Applications Automotive and Transportation www.ti.com/automotive Communications and Telecom www.ti.com/communications Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space, Avionics and Defense Video and Imaging www.ti.com/computers www.ti.com/consumer-apps www.ti.com/energy www.ti.com/industrial www.ti.com/medical www.ti.com/security www.ti.com/space-avionics-defense www.ti.com/video

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2012, Texas Instruments Incorporated

You might also like