U.S. patent D608474: Architectural panel with buri palm and reed. Granted to Metcalf et. al. (2 total) on 2010-01-19 (filed 2009-05-12) and assigned to 3Form, Inc. Currently involved in at least 1 patent litigation: 3Form v. New Glaspro (Utah). See http://news.priorsmart.com for more info.
Original Title
Architectural panel with buri palm and reed (US patent D608474)
U.S. patent D608474: Architectural panel with buri palm and reed. Granted to Metcalf et. al. (2 total) on 2010-01-19 (filed 2009-05-12) and assigned to 3Form, Inc. Currently involved in at least 1 patent litigation: 3Form v. New Glaspro (Utah). See http://news.priorsmart.com for more info.
U.S. patent D608474: Architectural panel with buri palm and reed. Granted to Metcalf et. al. (2 total) on 2010-01-19 (filed 2009-05-12) and assigned to 3Form, Inc. Currently involved in at least 1 patent litigation: 3Form v. New Glaspro (Utah). See http://news.priorsmart.com for more info.